EPF10K30EFC256-3 - 30K FLEX 10KE FPGA, 1728 Cells, 256-BGA | Intel
부품 번호: EPF10K30EFC256-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $32.5 | $3,250.00 |
| 500 | $27.8 | $13,900.00 |
| 1,000 | $24.6 | $24,600.00 |
EPF10K30EFC256-3 개요
A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines gate-array-equivalent logic density with configurable interconnect, embedded memory blocks, and an I/O ring that can be programmed for multiple voltage and timing standards. FPGAs belong to the broader hierarchy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> look-up-table (LUT) + embedded-block architecture. The FLEX 10KE family pioneered embedded array block (EAB) integration for on-chip RAM and ROM, enabling single-chip implementation of memory-intensive functions like FIFOs and DSP datapaths.
Key features of the EPF10K30EFC256-3 include 216 logic array blocks (LABs), a built-in Joint Test Action Group (JTAG) boundary-scan interface (IEEE Std 1149.1 compliant), multi-voltage I/O standards support (LVTTL, LVCMOS, PCI), and the Altera SameFrame pin-compatibility migration path that allows board reuse across the 256-pin FineLine BGA family. The -3 speed grade targets designs where the highest toggle rates and shortest combinatorial delays are required.
Architecturally, the FLEX 10KE device connects each LAB through a continuous FastTrack Interconnect routing fabric, while embedded array blocks provide true dual-port RAM capability. Compared with pure gate-array ASICs, the FLEX 10KE family offers instant prototyping, in-system reconfigurability through the serial configuration device interface, and significantly lower non-recurring engineering (NRE) cost for low-to-medium-volume production.
Typical applications include telecommunications line cards, industrial control and factory automation backplanes, networking routers and switches, PCI bus bridges, and legacy ASIC-replacement designs. The 256-FBGA footprint and SameFrame pin migration also enable straightforward board reuse across the FLEX 10K family density ladder.
When designing with the EPF10K30EFC256-3, ensure that the configuration EPROM (EPC8 or equivalent) is correctly sized for the device bitstream and that all 2.5 V VCCINT and 3.3 V VCCIO rails are properly decoupled with bulk and high-frequency ceramic capacitors near the BGA balls.
This page synthesizes distributor pricing, SameFrame drop-in alternatives within the FLEX 10K family, and practical design notes that supplement the manufacturer datasheet to accelerate component selection.
드롭인 대체품: EPF10K30EFC256-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K30EFC256-3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Core Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K30EFC256-2
✅ 드롭인✓ 재고 있음
$12.1 / 개
데이터시트 보기 →EPF10K30EFC256-1
✅ 드롭인✓ 재고 있음
$69.5 / 개
데이터시트 보기 →EPF10K30EFC256-2X
✅ 드롭인✓ 재고 있음
$17.95 / 개
데이터시트 보기 →EPF10K30EFC256-2N
✅ 드롭인✓ 재고 있음
$48.57 / 개
데이터시트 보기 →EPF10K30EFC256-2XN
✅ 드롭인✓ 재고 있음
$9.8 / 개
데이터시트 보기 →EPF10K30EFC256-3N
✅ 드롭인✓ 재고 있음
$58 / 개
데이터시트 보기 →EPF10K30EFC256-3 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Typical Gates | 30,000 |
| Logic Elements / Cells | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded RAM Bits | 24,576 |
| User I/O Pins | 176 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 micrometer CMOS |
| Core Supply Voltage (VCCINT) | 2.5 V |
| I/O Supply Voltage (VCCIO) | 3.3 V (multi-voltage I/O standard support) |
| 패키지 | 256-ball FineLine BGA |
| 실장 유형 | Surface Mount (BGA) |
| Speed Grade | -3 (fastest) |
| Temperature Grade | Commercial |
| Configuration Interface | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) |
EPF10K30EFC256-3 256-ball fineline bga 핀 구성 가이드
EPF10K30EFC256-3(256-ball fineline bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K30EFC256-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K30EFC256-3 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, Industrial Control and Factory Automation, PCI Bus Bridge / Glue Logic, Networking Router and Switch Line-Card Glue, ASIC Replacement / Legacy Glue Logic, Test and Measurement Instrumentation Front-End.
Telecommunications Line Cards
The EPF10K30EFC256-3 fits telecommunications line cards where 30K gates of glue logic must glue framers, mappers, and physical-layer devices with deterministic 200 MHz performance. Its 24,576 embedded RAM bits simplify on-chip FIFO buffers between serial data paths and the backplane, while the 176 user I/O accommodate 16-bit buses plus serial control links. Compared with a CPLD-based design, the FLEX 10KE provides higher integration and shorter worst-case combinatorial paths, while still supporting JTAG-driven in-system reconfigurability for field upgrades.
추천
Industrial Control and Factory Automation
In factory automation backplanes, the EPF10K30EFC256-3 functions as a multi-protocol bridge that consolidates Profibus, EtherCAT, and discrete I/O scanning without an additional ASIC. Its 1,728 logic cells and 200 MHz fMAX support 32-bit datapath glue logic at typical industrial bus speeds (12 MHz SPI, 25 MHz parallel), while the 256-FBGA package provides mechanical robustness for vibration-prone factory environments. The SameFrame pin-compatibility lets designers migrate later to higher-density FLEX 10K parts (e.g., EPF10K100EFC256) without re-laying-out the PCB.
추천
PCI Bus Bridge / Glue Logic
The EPF10K30EFC256-3 is well-suited as a PCI bus bridge or address-mapper between a host processor and peripheral ASICs, where its 200 MHz internal frequency and 176 I/O support both 32-bit PCI (33 MHz) and a wide local bus concurrently. The 24 Kbit of embedded RAM enable fast transaction FIFOs and small cache structures, eliminating external SRAM and saving board area. Multi-voltage I/O standards (LVTTL/LVCMOS at 3.3 V plus 5.0 V PCI compatibility via open-drain with pull-up) simplify host bridge designs.
추천
Networking Router and Switch Line-Card Glue
In networking line cards, the EPF10K30EFC256-3 provides glue between PHY/MAC devices, switch fabrics, and lookup memories where its 1,728 logic cells and 200 MHz fMAX are enough for header parsing, queue management, and statistics counters. The embedded RAM blocks accelerate small CAM emulations and rate-limiters, while 176 I/O permit multiple SGMII/SerDes-adjacent interfaces plus management bus access. Designers can later migrate to the EPF10K100EFC256 in the same 256-FBGA footprint for higher port density.
추천
ASIC Replacement / Legacy Glue Logic
For designs that need to replace an aging ASIC or hard-to-source gate-array part, the EPF10K30EFC256-3 offers 30K typical gates of reprogrammable logic that can be re-spun instantly, eliminating NRE charges and shortening time-to-market. Its 200 MHz system frequency and PCI-compliant I/O support the timing and signaling needs of legacy 33 MHz/66 MHz bus systems, while the JTAG interface simplifies board-level test and in-field updates. SameFrame pin-compatibility with other FLEX 10K family members provides an in-design density upgrade path.
추천
Test and Measurement Instrumentation Front-End
In test and measurement instruments (logic analyzers, protocol analyzers, ATE fixtures), the EPF10K30EFC256-3 can implement custom capture sequencers, pattern generators, and trigger logic with deterministic 200 MHz timing. The 24,576 bits of embedded RAM buffer pre-trigger samples, while 176 user I/O drive high-density probe pods and parallel DAC buses. JTAG-based configuration allows fixture reprogramming for each new device-under-test, supporting rapid test-plan iteration.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K30EFC256-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K30EFC256-2 | EPF10K30EFC256-1 | EPF10K30EFC256-2X | EPF10K30EFC256-2N | EPF10K30EFC256-3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Speed Grade | -3 (fastest, 200 MHz fMAX) | -2 | -1 | -2X (industrial temp) | -2 (Pb-free) | -3 (Pb-free) |
| Logic Cells | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| User I/O Pins | 176 | 176 | 176 | 176 | 176 | 176 |
| Typical Gates | 30K | 30K | 30K | 30K | 30K | 30K |
주요 차별점
- Fastest speed grade in the FLEX 10K 30K-gate 256-FBGA family (vs EPF10K30EFC256-2)
- SameFrame pin-compatible with higher-density FLEX 10K parts (vs EPF10K100EFC256-3)
- Reprogrammable, in-system configurable via JTAG (vs ASIC replacement scenarios)
설계 노트
Decouple each VCCINT (2.5 V) and VCCIO (3.3 V) ball group with at least one 0.1 microfarad X7R ceramic capacitor placed within 5 mm of the BGA, plus a 10 microfarad tantalum or polymer bulk capacitor per supply plane. FPGAs draw high transient currents during configuration and during logic transitions; inadequate decoupling causes VCC droop and JTAG configuration failures. Source: Altera FLEX 10KE hardware guidelines.
The 256-ball FineLine BGA requires a 4-6 layer PCB with microvia fan-out or dog-bone escape routing for inner-row balls. Match the BGA pad diameter and solder mask defined (NSMD) pad geometry to the FLEX 10KE reference footprint for reliable assembly. Estimated: For a 1 mm pitch FineLine BGA, a 0.5 mm pad with 0.6 mm solder mask opening is a typical starting point - confirm against assembly house capability.
Do not reuse MSEL pin settings from a different FLEX 10K family member without verifying against the EPF10K30 datasheet - misconfigured MSEL pins can prevent configuration entirely. Always connect nCONFIG, nSTATUS, and CONF_DONE through the recommended pull-up resistor values from the datasheet, and verify the configuration EPC8/EPC16 device is correctly sized for the 1,728-cell / 24 Kbit bitstream of this specific device.
규정 준수 정보
RoHS/REACH/lead-free status not explicitly captured in the verified web data; 'N'-suffix variants (e.g., EPF10K30EFC256-3N) typically denote Pb-free finish per Altera ordering convention. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified IC.
