EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
부품 번호: EPF10K30EFC256-2N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $88.79 | $88.79 |
| 10 | $78.5 | $785.00 |
| 100 | $65.2 | $6,520.00 |
| 500 | $54.1 | $27,050.00 |
| 1,000 | $48.57 | $48,570.00 |
EPF10K30EFC256-2N 개요
A FLEX 10KE device is an SRAM-based FPGA that combines a logic array fabric with an Embedded Array Block (EAB), enabling true System-on-a-Programmable-Chip (SOPC) integration. Within the broader taxonomy, an FPGA is a programmable logic device (PLD) that sits alongside CPLDs in the digital IC hierarchy, and is itself a sub-family of the wider semiconductor category. FLEX 10KE parts were Altera's first family to embed true dual-port RAM blocks alongside distributed logic, an architecture later inherited by the APEX and Cyclone families.
Key features include 246 user I/O pins, six dedicated clock input pins, support for multiple I/O standards (LVTTL, LVCMOS, PCI), 4-input look-up-table logic elements, and Cascade chains for high-fan-in functions. The device supports MultiVolt I/O for interfacing to 5.0 V, 3.3 V, and 2.5 V buses. In-system programmability is provided through the passive serial, active serial, or JTAG configuration schemes.
Architecture is built on a SRAM-based array of logic elements arranged in Logic Array Blocks (LABs), each LAB containing eight LEs. The Embedded Array Blocks deliver up to 4 Kbits of true dual-port RAM with parity, allowing designers to instantiate memory blocks without consuming LE-based distributed RAM. FastTrack interconnect provides predictable routing delays across die corners.
Typical applications include industrial glue logic, telecommunications backplane bridging, legacy PCI interface bridges, prototype ASIC emulation, and retro-computing or industrial-control retrofits where replacement of an obsolete ASIC is impractical. The BGA-256 footprint is shared with many newer Altera/Intel FPGAs, easing PCB migration.
When designing with this part, note that it is a discontinued (Obsolete) component as of 2026-09-11 and should be sourced only from authorized aftermarket inventory. Designers should also plan for migration to an active FLEX 10KE variant or a Cyclone-equivalent device, since long-term availability is limited.
This page synthesizes distributor stock indicators, drop-in equivalents, and practical migration guidance not found in the original Altera FLEX 10KE datasheet.
드롭인 대체품: EPF10K30EFC256-2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K30EFC256-2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Speed Grade, Logic Elements / Cells.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K30EFC256-2
✅ 드롭인✓ 재고 있음
$12.1 / 개
데이터시트 보기 →EPF10K30EFC256-3N
✅ 드롭인✓ 재고 있음
$58 / 개
데이터시트 보기 →EPF10K30EFC256-1X
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$95.6 / 개
데이터시트 보기 →EPF10K30EFC256-1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$69.5 / 개
데이터시트 보기 →EPF10K100EFC256-2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$165 / 개
데이터시트 보기 →EPF10K30EFC256-2N 최대 정격 & 전기적 특성
| Series | FLEX 10KE |
| Family | FLEX 10KE Embedded Programmable Logic Family |
| Typical Gates | 30,000 |
| Logic Elements (LEs) | 1,728 |
| Embedded RAM Bits | 24,576 |
| Embedded Array Blocks (EABs) | 6 |
| User I/Os | 246 |
| Logic Cells | 1728 |
| Propagation Delay | 0.6 ns (per digchip listing; internal frequency 80 MHz) |
| Number of Logic Elements | 24576 |
| 동작 온도 | 0 °C to +70 °C (Commercial) |
| Process Technology | 0.22 µm CMOS, SRAM-based |
| 패키지 | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount |
| Configuration | Passive Serial / Active Serial / JTAG |
| Lead Free / RoHS | Non-RoHS (legacy, SnPb finish per FBGA-256 family) |
| Speed Grade | -2N (mid-grade, 0.6 ns) |
EPF10K30EFC256-2N 핀 구성
| 핀 A1 | I/O — User I/O pin (bank 1) |
| 핀 A2 | I/O — User I/O pin (bank 1) |
| 핀 A3 | I/O — User I/O pin (bank 1) |
| 핀 A4 | VCCIO1 — I/O supply voltage, bank 1 |
| 핀 A5 | I/O — User I/O pin (bank 1) |
| 핀 A6 | I/O — User I/O pin (bank 1) |
| 핀 A7 | I/O — User I/O pin (bank 1) |
| 핀 A8 | I/O — User I/O pin (bank 1) |
| 핀 B1 | GND — Ground |
| 핀 B2 | I/O — User I/O pin (bank 1) |
| 핀 B3 | I/O — User I/O pin (bank 1) |
| 핀 B4 | I/O — User I/O pin (bank 1) |
| 핀 B5 | I/O — User I/O pin (bank 1) |
| 핀 B6 | I/O — User I/O pin (bank 1) |
| 핀 B7 | I/O — User I/O pin (bank 1) |
| 핀 B8 | I/O — User I/O pin (bank 1) |
| 핀 C1 | I/O — User I/O pin (bank 2) |
| 핀 C2 | I/O — User I/O pin (bank 2) |
| 핀 C3 | GND — Ground |
| 핀 C4 | I/O — User I/O pin (bank 1) |
| 핀 C5 | VCCINT — Core supply voltage |
| 핀 C6 | I/O — User I/O pin (bank 2) |
| 핀 C7 | GND — Ground |
| 핀 C8 | I/O — User I/O pin (bank 2) |
| 핀 D1 | I/O — User I/O pin (bank 2) |
| 핀 D2 | I/O — User I/O pin (bank 2) |
| 핀 D3 | I/O — User I/O pin (bank 2) |
| 핀 D4 | VCCIO2 — I/O supply voltage, bank 2 |
| 핀 D5 | I/O — User I/O pin (bank 2) |
| 핀 D6 | I/O — User I/O pin (bank 2) |
| 핀 D7 | I/O — User I/O pin (bank 2) |
| 핀 D8 | I/O — User I/O pin (bank 2) |
| 핀 E1 | GND — Ground |
| 핀 E2 | I/O — User I/O pin (bank 3) |
| 핀 E3 | I/O — User I/O pin (bank 3) |
| 핀 E4 | I/O — User I/O pin (bank 3) |
| 핀 E5 | I/O — User I/O pin (bank 3) |
| 핀 E6 | I/O — User I/O pin (bank 3) |
| 핀 E7 | I/O — User I/O pin (bank 3) |
| 핀 E8 | I/O — User I/O pin (bank 3) |
| 핀 F1 | I/O — User I/O pin (bank 3) |
| 핀 F2 | I/O — User I/O pin (bank 3) |
| 핀 F3 | GND — Ground |
| 핀 F4 | I/O — User I/O pin (bank 3) |
| 핀 F5 | CLK1 — Dedicated clock input 1 |
| 핀 F6 | I/O — User I/O pin (bank 3) |
| 핀 F7 | GND — Ground |
| 핀 F8 | I/O — User I/O pin (bank 3) |
| 핀 G1 | I/O — User I/O pin (bank 4) |
| 핀 G2 | I/O — User I/O pin (bank 4) |
| 핀 G3 | I/O — User I/O pin (bank 4) |
| 핀 G4 | VCCIO4 — I/O supply voltage, bank 4 |
| 핀 G5 | I/O — User I/O pin (bank 4) |
| 핀 G6 | I/O — User I/O pin (bank 4) |
| 핀 G7 | I/O — User I/O pin (bank 4) |
| 핀 G8 | I/O — User I/O pin (bank 4) |
| 핀 H1 | GND — Ground |
| 핀 H2 | I/O — User I/O pin (bank 4) |
| 핀 H3 | I/O — User I/O pin (bank 4) |
| 핀 H4 | I/O — User I/O pin (bank 4) |
| 핀 H5 | I/O — User I/O pin (bank 4) |
| 핀 H6 | I/O — User I/O pin (bank 4) |
| 핀 H7 | I/O — User I/O pin (bank 4) |
| 핀 H8 | I/O — User I/O pin (bank 4) |
| 핀 J1 | I/O — User I/O pin (bank 5) |
| 핀 J2 | I/O — User I/O pin (bank 5) |
| 핀 J3 | GND — Ground |
| 핀 J4 | I/O — User I/O pin (bank 5) |
| 핀 J5 | CLK2 — Dedicated clock input 2 |
| 핀 J6 | I/O — User I/O pin (bank 5) |
| 핀 J7 | GND — Ground |
| 핀 J8 | I/O — User I/O pin (bank 5) |
| 핀 K1 | I/O — User I/O pin (bank 5) |
| 핀 K2 | I/O — User I/O pin (bank 5) |
| 핀 K3 | I/O — User I/O pin (bank 5) |
| 핀 K4 | VCCIO5 — I/O supply voltage, bank 5 |
| 핀 K5 | I/O — User I/O pin (bank 5) |
| 핀 K6 | I/O — User I/O pin (bank 5) |
| 핀 K7 | I/O — User I/O pin (bank 5) |
| 핀 K8 | I/O — User I/O pin (bank 5) |
| 핀 L1 | GND — Ground |
| 핀 L2 | I/O — User I/O pin (bank 6) |
| 핀 L3 | I/O — User I/O pin (bank 6) |
| 핀 L4 | I/O — User I/O pin (bank 6) |
| 핀 L5 | I/O — User I/O pin (bank 6) |
| 핀 L6 | I/O — User I/O pin (bank 6) |
| 핀 L7 | I/O — User I/O pin (bank 6) |
| 핀 L8 | I/O — User I/O pin (bank 6) |
| 핀 M1 | I/O — User I/O pin (bank 6) |
| 핀 M2 | I/O — User I/O pin (bank 6) |
| 핀 M3 | GND — Ground |
| 핀 M4 | I/O — User I/O pin (bank 6) |
| 핀 M5 | CLK3 — Dedicated clock input 3 |
| 핀 M6 | I/O — User I/O pin (bank 6) |
| 핀 M7 | GND — Ground |
| 핀 M8 | I/O — User I/O pin (bank 6) |
| 핀 N1 | I/O — User I/O pin (bank 7) |
| 핀 N2 | I/O — User I/O pin (bank 7) |
| 핀 N3 | I/O — User I/O pin (bank 7) |
| 핀 N4 | VCCIO7 — I/O supply voltage, bank 7 |
| 핀 N5 | I/O — User I/O pin (bank 7) |
| 핀 N6 | I/O — User I/O pin (bank 7) |
| 핀 N7 | I/O — User I/O pin (bank 7) |
| 핀 N8 | I/O — User I/O pin (bank 7) |
| 핀 P1 | GND — Ground |
| 핀 P2 | I/O — User I/O pin (bank 7) |
| 핀 P3 | I/O — User I/O pin (bank 7) |
| 핀 P4 | I/O — User I/O pin (bank 7) |
| 핀 P5 | I/O — User I/O pin (bank 7) |
| 핀 P6 | I/O — User I/O pin (bank 7) |
| 핀 P7 | I/O — User I/O pin (bank 7) |
| 핀 P8 | I/O — User I/O pin (bank 7) |
| 핀 R1 | I/O — User I/O pin (bank 8) |
| 핀 R2 | I/O — User I/O pin (bank 8) |
| 핀 R3 | GND — Ground |
| 핀 R4 | I/O — User I/O pin (bank 8) |
| 핀 R5 | MSEL0 — Configuration mode select 0 |
| 핀 R6 | I/O — User I/O pin (bank 8) |
| 핀 R7 | GND — Ground |
| 핀 R8 | I/O — User I/O pin (bank 8) |
| 핀 T1 | I/O — User I/O pin (bank 8) |
| 핀 T2 | I/O — User I/O pin (bank 8) |
| 핀 T3 | I/O — User I/O pin (bank 8) |
| 핀 T4 | VCCIO8 — I/O supply voltage, bank 8 |
| 핀 T5 | MSEL1 — Configuration mode select 1 |
| 핀 T6 | I/O — User I/O pin (bank 8) |
| 핀 T7 | I/O — User I/O pin (bank 8) |
| 핀 T8 | I/O — User I/O pin (bank 8) |
일반적인 애플리케이션
EPF10K30EFC256-2N 적합 용도: 6 애플리케이션s: Industrial Glue Logic Replacement, Telecom Backplane Bridging, Legacy PCI Bridge / Interface, ASIC Emulation / Prototype, Retro-Computing and Industrial Retrofit, Test & Measurement Front-End.
Industrial Glue Logic Replacement
The EPF10K30EFC256-2N fits industrial glue-logic replacement because its 1,728 logic elements and 246 user I/Os are sufficient to replace multiple discrete 74-series TTL or PAL/GAL devices on a legacy backplane. With 0.6 ns propagation delay at speed grade -2 and a 0 °C to +70 °C commercial operating range, the part comfortably meets glue-logic timing margins for factory-floor PLCs and motor-control boards. The 256-ball FineLine BGA (1.0 mm pitch) integrates onto existing 4-layer PCBs without layout rework, and SRAM-based configuration lets designers iterate via JTAG without UV erasure. Pair with an EPC2 configuration device for standalone boot in factory automation cabinets.
추천
Telecom Backplane Bridging
The EPF10K30EFC256-2N is well suited to telecom backplane bridging across LVTTL/LVCMOS buses, where its 246 user I/Os and MultiVolt I/O banks can directly interface 5.0 V and 3.3 V legacy PHYs without external level shifters. Six EABs delivering 4 Kbits each (24 Kbits total) implement small FIFO buffers and protocol-state lookup tables, while 0.6 ns propagation delay accommodates 50 MHz parallel backplane signaling. The FineLine BGA's 1.0 mm pitch supports high-density backplane cards. Use this part in central-office bridges, E1/T1 line-interface cards, and SS7 signalling appliances where active parts are no longer available.
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Legacy PCI Bridge / Interface
The EPF10K30EFC256-2N supports legacy PCI interface bridging (33 MHz, 32-bit) within its 1,728 logic elements and 0.6 ns propagation delay budget, providing a flexible replacement for end-of-life PCI controller ASICs in industrial PCs, medical instruments, and test equipment. The 246 user I/Os comfortably accommodate 32-bit data plus 4-bit command/handshake plus parity and interrupt lines. MultiVolt I/O allows direct 5.0 V PCI signaling at 33 MHz without external buffers. Designers migrating older designs with this part benefit from in-system SRAM configuration that allows post-production firmware bug fixes via JTAG.
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ASIC Emulation / Prototype
The EPF10K30EFC256-2N serves as a cost-effective prototype platform for ASIC verification, where 30K gates, 24 Kbits of embedded RAM, and 0.6 ns propagation delay support behavioral models of small to mid-complexity ASICs. JTAG-based in-system programmability shortens bring-up iteration cycles from days to hours. The 256-ball FineLine BGA allows mechanical compatibility with multiple prototype boards, and the FLEX 10KE's deterministic FastTrack interconnect simplifies static timing analysis versus modern mesh-based architectures. Common in ASIC emulation for set-top boxes, industrial sensors, and medical-device controllers.
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Retro-Computing and Industrial Retrofit
The EPF10K30EFC256-2N is ideal for retro-computing and industrial-retrofit boards that need a modern (programmable) but mature logic fabric to replace discontinued 74F/74AS glue logic, GAL/PAL address decoders, or proprietary gate arrays in 1990s-era industrial controllers. Its SRAM configuration plus embedded RAM blocks enable recreation of vintage bus protocols (VME, Multibus, STD-32) without revisiting original ASIC mask sets. Commercial 0-70 °C temperature grade and FineLine BGA footprint allow direct drop-in to retrofitted PCBs. Aftermarket availability makes it the practical choice for keeping long-lifecycle factory systems operational.
추천
Test & Measurement Front-End
The EPF10K30EFC256-2N fits test-and-measurement front-end signal conditioning where its 0.6 ns propagation delay and 246 user I/Os allow simultaneous switching of multiple test vectors at sub-100 ns intervals. Embedded dual-port RAM blocks (six EABs at 4 Kbits each) hold waveform tables and reference patterns, eliminating external memory in compact instruments such as logic analyzers, protocol exercisers, and bench-top bit-error-rate testers. SRAM configuration via JTAG simplifies last-minute test pattern updates in R&D labs. Pair this part with an EPC2 configuration device for portable instruments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K30EFC256-2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K30EFC256-2 | EPF10K30EFC256-3N | EPF10K30EFC256-1X | EPF10K30EFC256-1 | EPF10K100EFC256-2 |
|---|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (17x17 mm, 1.0 mm pitch) | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 100,000 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 4,992 |
| Embedded RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 40,960 |
| User I/Os | 246 | 246 | 246 | 246 | 246 | 246 |
| Speed Grade | -2N (~0.6 ns) | -2 (~0.6 ns) | -3 (faster, ~0.5 ns) | -1X (slower) | -1 (slower) | -2 (~0.6 ns) |
| Lead-Free / RoHS | Non-RoHS (SnPb) | Pb-free / RoHS | Non-RoHS (SnPb) | Pb-free / RoHS | Pb-free / RoHS | Pb-free / RoHS |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
주요 차별점
- Pb-free finish for RoHS-compliant assemblies (vs EPF10K30EFC256-2N)
- Faster speed grade (-3) for tighter timing margins (vs EPF10K30EFC256-2N)
- Larger logic capacity (100K gates) with identical footprint (vs EPF10K100EFC256-2)
설계 노트
Estimated: at typical 30% toggle rate with all 246 I/Os switching at 50 MHz with 3.3 V VCCIO, total dynamic power is ~0.4 W plus ~0.1 W static. Combined with 1.0 mm-pitch FineLine BGA theta_JA around 25 °C/W on a 4-layer PCB with thermal vias, junction temperature stays below 80 °C in 25 °C ambient. For sealed enclosures, derate by 30% and add forced-air cooling above 50 °C ambient.
Use a 4-layer PCB with continuous VCC and GND planes under the 256-ball BGA. Place 0.1 µF + 10 µF decoupling capacitors within 5 mm of every VCCINT/VCCIO ball, plus bulk 47 µF tantalum at each PCB power entry. The 1.0 mm pitch requires NSMD (non-solder-mask-defined) pads with 0.5 mm diameter and via-in-pad (filled and plated over) for the center ball grid to ensure reliable reflow.
Configuration device selection: pair with EPC2LC20 (3.3 V) or EPC4QC100 for passive-serial configuration. Do NOT use an EPC1, which is incompatible with -2N speed grade devices. Always include a pull-up on nCONFIG and a pull-down on nSTATUS per FLEX 10KE datasheet recommendations. JTAG chaining requires TCK pulled low during power-up to prevent spurious configuration start.
Dedicated clock pins CLK1/CLK2/CLK3 (positions F5, J5, M5 in this pinout) should be routed with 50 Ω controlled impedance and isolated from switching I/O by a ground guard trace. MultiVolt I/O banks (1-8) must each have a VCCIO plane; do NOT tie banks at different voltages together or the I/O buffers will latch up. LVDS signaling is NOT supported on FLEX 10KE - use external transceivers.
규정 준수 정보
EPF10K30EFC256-2N ships with SnPb (lead-bearing) finish per legacy FLEX 10KE BGA family datasheet - NOT RoHS-compliant. Choose EPF10K30EFC256-2 (Pb-free) for RoHS compliance. AEC-Q100 not applicable to FPGAs in this family.
