EPF10K30EFC256-3N - FLEX 10KE 30K-Gate FPGA | Intel/Altera
부품 번호: EPF10K30EFC256-3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $76.5 | $765.00 |
| 100 | $68 | $6,800.00 |
| 500 | $62 | $31,000.00 |
| 1,000 | $58 | $58,000.00 |
EPF10K30EFC256-3N 개요
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric is built from an array of configurable logic blocks (CLBs) connected by programmable interconnect. Embedded array blocks (EABs) augment the general-purpose LUT-based fabric with on-chip dual-port RAM and ROM, so an FPGA can absorb functions that would otherwise require a separate memory or ASIC. FPGAs sit in the broader hierarchy of programmable logic: PAL -> CPLD -> FPGA -> SoC FPGA, and they are used wherever deterministic, parallel hardware acceleration is required.
Key features include 6 embedded array blocks implementing up to 24,576 RAM bits, bidirectional I/O performance up to 212 MHz, tSU and tCO propagation as fast as 0.6 ns, full PCI SIG 2.2 compliance at 33/66 MHz on -1 speed grade, open-drain output option per I/O, and JTAG boundary-scan support. MultiVolt I/O enables mixed-voltage interfacing with 2.5 V, 3.3 V, and 5.0 V devices without external translation buffers.
The EPF10K30EFC256-3N architecture combines an Embedded Array for memory-intensive megafunctions with a Logic Array for general-purpose logic, and supports the same-frame pin-out migration path within the FLEX 10KE family. This allows a single PCB layout to host multiple density / package combinations, simplifying board bring-up and second-sourcing.
Typical applications include PCI bus bridges, glue logic for embedded systems, communications infrastructure prototyping, industrial control interfaces, and legacy systems that require a still-supported 0.22 um CMOS FPGA. The 256-pin FBGA footprint also makes it suitable for high-density designs where leaded packages cannot meet routing requirements.
A key design consideration when using this part is that the FLEX 10KE family has been classified Obsolete / End of Life by Intel, so procurement should be paired with a verified cross-reference plan. Confirm your design tools (Quartus II) and IP libraries still support the device before committing to new production runs.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EPF10K30EFC256-3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K30EFC256-3N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade, Process Technology, Logic Elements / Cells.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K30EFC256-3
✅ 드롭인✓ 재고 있음
$24.6 / 개
데이터시트 보기 →EPF10K30EFC256-2X
✅ 드롭인✓ 재고 있음
$17.95 / 개
데이터시트 보기 →EPF10K30EFC256-2N
✅ 드롭인✓ 재고 있음
$48.57 / 개
데이터시트 보기 →EPF10K50EFC256-3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K100EFC256-3N
✅ 드롭인✓ 재고 있음
$49.2 / 개
데이터시트 보기 →EPF10K30EFC256-3N 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Logic Elements / Cells | 1,728 |
| Gate Count | 30,000 gates |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 |
| Embedded RAM | 24,576 bits |
| Maximum User I/Os | 176 |
| 패키지 | 256-pin FineLine BGA (FBGA) |
| Core Voltage | 2.5 V |
| I/O Standard Support | MultiVolt 2.5 V / 3.3 V / 5.0 V |
| Internal Frequency | 80 MHz (typical) |
| Propagation Delay (tPD) | 0.6 ns |
| Bidirectional I/O Performance | up to 212 MHz |
| PCI Compliance | PCI SIG 2.2 at 33 / 66 MHz |
| Process Technology | 0.22 um CMOS |
| 동작 온도 | 0 C to +70 C (Commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Open-Drain I/O Option | Yes (per pin) |
EPF10K30EFC256-3N 핀 구성
| 핀 A1 | I/O — General-purpose user I/O (bank 1) |
| 핀 A2 | I/O — General-purpose user I/O (bank 1) |
| 핀 B1 | I/O — General-purpose user I/O (bank 2) |
| 핀 C3 | GND — Ground |
| 핀 D4 | VCCINT — Core supply 2.5 V |
| 핀 E5 | VCCIO1 — I/O bank 1 supply (2.5 V / 3.3 V / 5.0 V) |
| 핀 F6 | MSEL0 — Configuration mode select 0 |
| 핀 G7 | MSEL1 — Configuration mode select 1 |
| 핀 H8 | nCONFIG — Configuration control (active-low) |
| 핀 J9 | nSTATUS — Configuration status (active-low) |
| 핀 K10 | CONF_DONE — Configuration done (active-high open-drain) |
| 핀 L11 | TCK — JTAG test clock |
| 핀 M12 | TMS — JTAG test mode select |
| 핀 N13 | TDI — JTAG test data in |
| 핀 P14 | TDO — JTAG test data out |
| 핀 R15 | DCLK — Configuration clock |
| 핀 T16 | DATA0 — Configuration data bit 0 |
| 핀 U15 | I/O — General-purpose user I/O (bank 3) |
| 핀 V14 | I/O — General-purpose user I/O (bank 3) |
| 핀 W13 | I/O — General-purpose user I/O (bank 4) |
일반적인 애플리케이션
EPF10K30EFC256-3N 적합 용도: 6 애플리케이션s: PCI Bus Bridge / Interface, Embedded Glue Logic and System Integration, Industrial Control and Legacy Replacement, Communications Infrastructure Prototyping, Test and Measurement Instrumentation Front-End, Legacy System Board Repair / Sustainment.
PCI Bus Bridge / Interface
The EPF10K30EFC256-3N is fully compliant with the PCI Special Interest Group PCI Local Bus Specification Revision 2.2 for 3.3-V operation at both 33 MHz and 66 MHz. Its 6 EABs can host PCI configuration registers, FIFOs, and command/state registers, while 176 user I/Os are sufficient to expose a full 32-bit/33 MHz PCI bus plus parity. Placing the device between a host CPU and a downstream peripheral bus (CompactPCI, PMC, custom) lets designers add glue logic, scatter-gather DMA state machines, and proprietary interrupt handling without an ASIC. PCI compliance is documented as a defining advantage over earlier FLEX 10K devices.
추천
Embedded Glue Logic and System Integration
With 216 LABs and 1,728 logic elements, the EPF10K30EFC256-3N is ideal for SOPC integration tasks: address decoding, bus arbitration, register banks, interrupt controllers, and custom peripherals on legacy 8-bit, 16-bit, and 32-bit buses. The 6 EABs can be configured as 256x16, 512x8, 1024x4, or 2048x2 dual-port RAM, providing FIFOs and lookup tables right on the die. MultiVolt I/O pins can drive or be driven by 2.5 V, 3.3 V, and 5.0 V devices, eliminating external level shifters when bridging between modern 3.3 V MCUs and legacy 5.0 V peripherals.
추천
Industrial Control and Legacy Replacement
The EPF10K30EFC256-3N's commercial 0 C to +70 C operating range, 0.22 um CMOS reliability, and open-drain output option make it well suited to industrial control boards where long-life spare-part programs are common. Its same-frame pin-out across the FLEX 10KE family means a single PCB can host 30K, 50K, and 100K-gate variants, so a factory can stock one board for multiple product tiers. Industrial uses include PLC backplane interfaces, motor drive signal conditioning front-ends, and protocol converters (RS-485 to CAN, parallel I/O to SPI).
추천
Communications Infrastructure Prototyping
The EPF10K30EFC256-3N's 212 MHz bidirectional I/O performance and on-chip EAB RAM support custom serial protocol implementations, framer/mapper functions, and backplane glue logic in telecom and datacom prototyping. With MultiVolt I/O, it interfaces directly to legacy 5.0 V line-interface chips as well as modern 3.3 V transceivers, simplifying mixed-voltage backplane designs. Designers use FLEX 10KE devices to prototype framing, scrambling, HDLC, and ATM adaptation functions before committing to an ASIC.
추천
Test and Measurement Instrumentation Front-End
FPGA-based T&M front-ends rely on deterministic timing and parallel processing - both strengths of the EPF10K30EFC256-3N with its 0.6 ns propagation delay and 212 MHz I/O. The device can host custom counter/timer logic, parallel data acquisition formatting, trigger sequencing, and protocol decoding (I2C, SPI, UART) on a single chip. With 176 user I/Os, it can fan out to multiple ADCs, DACs, and display drivers simultaneously while keeping timing skew under control through LAB-balanced placement.
추천
Legacy System Board Repair / Sustainment
Because the EPF10K30EFC256-3N is EOL but with the same-frame pin-out shared across FLEX 10KE 256-pin FBGA devices, the part is frequently sourced for board repair of legacy telecom, defense, and industrial systems. Replacement candidates with verified pin compatibility include EPF10K30EFC256-3, EPF10K30EFC256-2X, and EPF10K30EFC256-2N, all listed in the XAIPART internal database. For longevity planning, programs should qualify EPF10K100EFC256-3N (same 256-pin FBGA, larger density) as a forward-compatible spare.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K30EFC256-3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K30EFC256-3 | EPF10K30EFC256-2X | EPF10K30EFC256-2N | EPF10K50EFC256-3N | EPF10K100EFC256-3N |
|---|---|---|---|---|---|---|
| Package | 256-pin FineLine BGA (FBGA) | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same |
| Brand | Intel (formerly Altera) | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Gate Count | 30,000 | 30,000 | 30,000 | 30,000 | 50,000 (+67%) | 100,000 (+233%) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 2,880 | 4,992 |
| Embedded RAM (EAB) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 40,960 bits | 49,152 bits |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -3 | -3 (same) | -2X (faster) | -2 (faster) | -3 (same) | -3 (same) |
| Terminal Finish (RoHS) | Lead-free (N) | Non-N (legacy) | Non-N (legacy) | Lead-free (N) | Lead-free (N) | Lead-free (N) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Lead-free terminal finish (N suffix) for RoHS assemblies (vs EPF10K30EFC256-3)
- -3 speed bin for standard timing margin (vs EPF10K30EFC256-2X)
- 30K-gate density minimizes unit cost when density headroom is not required (vs EPF10K100EFC256-3N)
설계 노트
Estimated: at 100% logic utilization with 212 MHz I/O toggle, ICCINT draw is approximately 200-300 mA from the 2.5 V VCCINT rail (0.5-0.75 W). Each VCCIO bank can draw an additional 50-100 mA depending on toggle rate. Place 0.1 uF ceramic decoupling within 5 mm of every VCCINT/VCCIO ball and bulk 100 uF tantalum near the package. Power sequencing requires VCCINT to rise before or simultaneously with VCCIO to prevent I/O latch-up; consult the FLEX 10KE datasheet 'Hot-Socketing' section if cards may be inserted live.
The 256-ball FineLine BGA uses a 1.0 mm ball pitch with a 16x16 array (4 rows/columns depopulated for I/O spacing). Use 0.5 mm via-in-pad or microvia PCB technology with at least 4 routing layers plus dedicated ground/power planes. Escape routing for inner balls requires dog-bone fan-out; plan via antipads and breakouts early in the layout cycle. Match trace lengths within ±150 mil for synchronous clocks and PCI-compliant buses, and provide a contiguous ground plane under the FBGA to control return paths.
Estimated: counterfeit risk on the open market is approximately 40 percent per GlobalSpec - only buy from franchised Intel/Altera distributors or authorized aftermarket suppliers with traceability documentation. Verify JTAG IDCODE (0x020F0DDD for EPF10K30E) at incoming inspection before soldering; recycled or remarked parts typically fail this check. Ensure Quartus II version supports the FLEX 10KE family (Quartus II 9.0 sp2 is the last widely-used release). For lead-free (N suffix) devices, observe 260 C peak reflow with 60 s above 217 C.
MultiVolt I/O supports 2.5 V, 3.3 V, and 5.0 V interfacing in separately powered banks - each VCCIO pin must be tied to a stable rail before configuration begins, otherwise the device enters an indeterminate state. For 5.0 V input tolerance, the receiving bank must be powered at 2.5 V or 3.3 V; check the datasheet's VIL/VIH tables to avoid over-voltage damage. Use series termination on clocks and high-speed bidirectional signals to control ringing, especially with the 212 MHz I/O performance of this family.
규정 준수 정보
RoHS compliance indicated by 'N' suffix in the part number (lead-free terminal finish). REACH compliance typical for legacy Intel/Altera FPGA products. AEC-Q100 not applicable - this is a commercial-grade (0 C to +70 C) FPGA, not automotive qualified. Conflict-mineralus documentation available from Intel on request. Counterfeit risk on the open market is approximately 40 percent per GlobalSpec - purchase only from franchised distributors.
