EPF10K50VRC240-1 - 50K FLEX 10K FPGA, 240-RQFP, 66MHz | Intel
부품 번호: EPF10K50VRC240-1 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $217.2 | $217.20 |
| 10 | $195.48 | $1,954.80 |
| 100 | $173.76 | $17,376.00 |
| 500 | $152.04 | $76,020.00 |
| 1,000 | $130.32 | $130,320.00 |
EPF10K50VRC240-1 개요
A Field Programmable Gate Array (FPGA) is a programmable-logic device (PLD) whose architecture combines a dense array of configurable logic blocks (LEs), a programmable routing fabric, and embedded memory. FPGAs occupy the middle ground between fixed-function ASICs and small CPLDs - they offer higher gate counts and richer I/O than CPLDs while remaining reprogrammable, unlike ASICs. The FLEX 10K series was the industry's first family to embed an array of SRAM blocks alongside logic, enabling System-on-a-Programmable-Chip (SOPC) designs where a CPU core, memory, and glue logic coexist on a single device.
Key specifications include 2,880 logic elements, 20,480 typical gates, 189 Kbits of embedded SRAM, 240 user I/O, an internal clock frequency up to 66.67 MHz, 0.6 ns propagation delay, and 0.42 µm CMOS process technology. The device also features JTAG boundary-scan test (IEEE 1149.1-1990) support, programmable PCI clamping diodes, slew-rate control, and open-drain output options configured pin-by-pin via the Altera MAX+PLUS II / Quartus design software.
The MultiVolt I/O interface separates VCCINT (core supply) from VCCIO (I/O supply), so 5 V-tolerant I/O can be driven from a 3.3 V core - critical when bridging legacy peripherals. The exposed thermal pad on the RQFP-240 package improves heat dissipation for high-utilization designs. Configuration is supported through JTAG, the BitBlaster serial cable, the ByteBlasterMV parallel cable, or the Jam STAPL programming and test language, allowing board-level flexibility.
Typical applications include telecommunications glue logic, PCI bridge designs, industrial-control state machines, embedded-protocol bridges, and pre-production ASIC prototyping. The commercial 0-70 °C temperature grade makes it well-suited for indoor enclosures, laboratory instrumentation, and development platforms.
When designing with this device, ensure the Quartus MAX+PLUS II toolchain supports the FLEX 10K device family - modern Quartus releases support legacy FLEX devices for compilation. Always confirm supply rails (VCCINT and VCCIO) are decoupled with bulk + ceramic capacitors placed close to the package pins, and respect the exposed-pad soldering guidelines.
This page synthesizes distributor pricing, drop-in FLEX 10K alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single decision-making reference for legacy Altera FLEX 10K FPGA designs.
드롭인 대체품: EPF10K50VRC240-1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K50VRC240-1 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Method, Speed Grade, Family, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K50VRC240-2
✅ 드롭인✓ 재고 있음
$18.95 / 개
데이터시트 보기 →EPF10K50VRC240-3
✅ 드롭인✓ 재고 있음
$61.75 / 개
데이터시트 보기 →EPF10K50VR1240-4
✅ 드롭인✓ 재고 있음
$42 / 개
데이터시트 보기 →EPF10K50VQC240-1
✅ 드롭인✓ 재고 있음
$55.2 / 개
데이터시트 보기 →EPF10K50VQC240-2
✅ 드롭인✓ 재고 있음
$28.75 / 개
데이터시트 보기 →EPF10K50VQC240-3
✅ 드롭인✓ 재고 있음
$21.5 / 개
데이터시트 보기 →EPF10K50VRC240-1 최대 정격 & 전기적 특성
| Family | FLEX 10K |
| Logic Elements | 2,880 |
| Typical Gates | 50,000 |
| Embedded Memory | 20,480 bits (189 Kb) |
| User I/O | 274 (max) |
| Number of I/O Pins | 189 |
| 패키지 | 240-RQFP Exposed Pad |
| Pins | 240 |
| Core Voltage (VCCINT) | 3.3 V |
| I/O Voltage (VCCIO) | MultiVolt (2.5 V / 3.3 V / 5 V tolerant) |
| Internal Frequency (max) | 66.67 MHz |
| Propagation Delay | 0.6 ns |
| Process Technology | 0.42 µm CMOS |
| Logic Family | CMOS |
| 동작 온도 | 0 °C to +70 °C (Commercial) |
| JTAG Support | Yes (IEEE Std 1149.1-1990) |
| Configuration Interface | JTAG / BitBlaster / ByteBlasterMV / Jam STAPL |
| Programming Language | Altera MAX+PLUS II / Quartus |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
EPF10K50VRC240-1 240-rqfp exposed pad 핀 구성 가이드
EPF10K50VRC240-1(240-rqfp exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K50VRC240-1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K50VRC240-1 적합 용도: 7 애플리케이션s: Telecommunications Glue Logic, PCI Bridge / Interface Controller, Industrial Control State Machines, ASIC Prototyping Platform, Embedded Protocol Bridge, Test & Measurement Instrumentation, Legacy System Sustainment.
Telecommunications Glue Logic
The EPF10K50VRC240-1's 2,880 logic elements and 189 user I/O make it well-suited for telecom backplane glue-logic applications where bus-bridging, protocol conversion, and timing-alignment functions must be reconfigured as standards evolve. Its 66.67 MHz internal frequency handles common telecom data rates, while the 0.6 ns propagation delay supports real-time framing logic. The MultiVolt I/O interface lets the FPGA bridge 5 V legacy TDM buses with newer 3.3 V processor cores without external level shifters. Compared to a discrete logic implementation, one FLEX 10K device replaces dozens of 74-series buffers, latches, and transceivers while remaining in-system programmable through JTAG - critical for telecom systems that need field updates. The exposed thermal pad on the 240-RQFP package handles the thermal load of high-utilization designs.
추천
PCI Bridge / Interface Controller
The EPF10K50VRC240-1 is widely used as a PCI bridge controller, leveraging its 0.6 ns propagation delay to meet the 33 MHz PCI timing envelope and its programmable PCI clamp diodes to support the 5 V signaling standard. The 240-RQFP package provides the 189 user I/O needed for 32-bit PCI bus implementations, plus additional GPIO for secondary buses. FLEX 10K embedded SRAM (189 Kbits) buffers transaction data without external memory. MultiVolt I/O allows the FPGA core to run at 3.3 V while presenting 5 V signals to the PCI bus. Compared to a fixed-function PCI controller ASIC, the EPF10K50VRC240-1 lets designers customize vendor-ID and subsystem behavior without mask charges - ideal for board-level prototyping.
추천
Industrial Control State Machines
The EPF10K50VRC240-1's 2,880 logic elements support multi-axis industrial state machines, sequence controllers, and safety-interlock logic for factory-automation systems. Its 66.67 MHz internal frequency executes Boolean and arithmetic control loops in microseconds - well within the response-time envelope of PLC scan cycles. The MultiVolt I/O interface accepts 24 V industrial sensor inputs through external dividers and drives 5 V actuator outputs. The commercial 0-70 °C temperature grade suits indoor control cabinets; for harsher environments, the industrial-grade EPF10K50VR1240-4 variant extends the operating range. Compared to discrete PLC hardware, the EPF10K50VRC240-1 replaces fixed-function ladder logic with a reprogrammable platform that engineers can update via JTAG without rewiring the panel.
추천
ASIC Prototyping Platform
The EPF10K50VRC240-1 serves as a pre-silicon ASIC prototyping vehicle for embedded SoC designs, mapping logic and memory into 2,880 LEs and 189 Kbits of embedded SRAM at speed. Its 0.6 ns propagation delay approximates the timing of the target ASIC's standard-cell library, letting engineers validate RTL before committing to silicon. The 240-RQFP package exposes enough I/O (189 pins) to break out processor buses, memory interfaces, and peripheral pins for oscilloscope probing. JTAG-based configuration via BitBlaster or ByteBlasterMV shortens the iterate-test-edit cycle from days to hours. Compared to a gate-array prototype, the FLEX 10K family removes NRE charges and lets designers swap designs at will through JTAG reprogramming.
추천
Embedded Protocol Bridge
The EPF10K50VRC240-1 is well-suited for bridging legacy serial protocols (RS-232, RS-422, RS-485, I²C, SPI) to modern buses in embedded systems. Its 189 user I/O pins handle multiple UART channels, plus FIFO buffers implemented in the 189 Kbit embedded SRAM. The 0.6 ns propagation delay sustains high-speed SPI and UART throughput without handshaking stalls. MultiVolt I/O lets the FPGA interface with both 5 V legacy peripherals and 3.3 V modern MCUs on the same PCB. Compared to a fixed-function bridge chip, the EPF10K50VRC240-1 lets engineers customize framing, escape sequences, and bus arbitration rules through VHDL or Verilog rather than firmware, eliminating CPU overhead.
추천
Test & Measurement Instrumentation
The EPF10K50VRC240-1 is used in test-and-measurement instruments (logic analyzers, pattern generators, ATE racks) where 50,000 typical gates of logic implement stimulus generation and response capture at high speed. The 0.6 ns propagation delay supports real-time pattern comparison at sub-nanosecond resolution when combined with external high-speed comparators. Its 189 user I/O drive numerous channels of parallel test vectors without multiplexing. JTAG-based configuration enables remote firmware updates in deployed test racks. Compared to discrete ECL logic, the FLEX 10K reduces BOM count and board area dramatically - one EPF10K50VRC240-1 can replace an entire shelf of emitter-coupled logic gates in a pattern-generator channel card.
추천
Legacy System Sustainment
The EPF10K50VRC240-1 is used to sustain legacy systems where the original FLEX 10K design must be repaired, replaced, or replicated long after the part entered obsolete status. Long-life programs (military, aerospace, industrial-control) rely on factory-fresh pulls from authorized brokers to keep fielded systems operational. The 240-RQFP-EP footprint and JTAG configuration allow engineers to swap a failed part on an existing PCB without any rework. Compared to designing a new FPGA carrier board, sustaining the original FLEX 10K design preserves form, fit, and function while avoiding costly board re-spins and re-qualification.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K50VRC240-1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K50VRC240-2 | EPF10K50VRC240-3 | EPF10K50VR1240-4 | EPF10K50VQC240-1 |
|---|---|---|---|---|---|
| Package | 240-RQFP Exposed Pad | 240-RQFP Exposed Pad | 240-RQFP Exposed Pad | 240-RQFP Exposed Pad | 240-RQFP Exposed Pad |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Family | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 |
| Core Voltage (VCCINT) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Speed Grade | -1 (fastest -V series) | -2 (medium) | -3 (slowest -V series) | -4 (industrial temp) | -1 (same speed grade) |
| Temperature Grade | Commercial (0-70 °C) | Commercial (0-70 °C) | Commercial (0-70 °C) | Industrial (-40 to +85 °C) | Commercial (0-70 °C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Same 240-RQFP-EP footprint across the FLEX 10K V-series speed grades (vs EPF10K50VRC240-2)
- Fastest speed grade in the 240-RQFP-EP FLEX 10K V-series (vs EPF10K50VRC240-3)
- Commercial temperature grade (vs EPF10K50VR1240-4)
설계 노트
Estimated: at 66 MHz and 80 % logic utilization, the EPF10K50VRC240-1 typically draws 200-400 mA from VCCINT (3.3 V) - approximately 0.7-1.3 W. Decouple VCCINT with a 100 µF bulk capacitor plus 0.1 µF ceramic placed within 5 mm of the package pin; tie VCCIO to 3.3 V or 5 V depending on downstream logic. According to the Altera datasheet, the MultiVolt I/O interface requires that VCCIO be powered before or simultaneously with VCCINT to prevent I/O latch-up. Add a 10 kΩ pull-down on each JTAG pin (TCK, TMS, TDI) to prevent spurious configuration at power-up.
The 240-RQFP package with exposed thermal pad requires a copper pour of at least 1 square inch on the top PCB layer to dissipate typical 0.7-1.3 W loads. Estimate: theta_JA is approximately 25-30 °C/W with a properly soldered exposed pad and 4-layer PCB. Without the exposed-pad solder connection, junction temperature can exceed 125 °C at maximum utilization, triggering thermal shutdown. Per Altera design guidelines, place 8-12 thermal vias under the exposed pad to the inner ground plane for optimal heat spreading.
Route JTAG signals (TCK, TMS, TDI, TDO) as short traces (<50 mm) and keep them away from high-speed clocks. Place a 4.7 kΩ pull-up on TDO to prevent floating during configuration. According to the Altera datasheet, configuration mode selection pins (MSEL0/MSEL1) must be tied high or low through 1 kΩ resistors; floating MSEL pins cause configuration failures. Decouple each VCCINT/VCCIO pair with 0.1 µF X7R ceramic plus 10 µF tantalum bulk - the FLEX 10K family is sensitive to power-rail noise during configuration.
Common pitfalls: (1) Do not confuse the 240-RQFP-EP variant (suffix 'RC240') with the 356-BGA variant (suffix 'BC356') - the ball map is completely different. (2) The exposed thermal pad on the RQFP-EP package must be soldered - omitting it causes thermal runaway at high utilization. (3) Use MAX+PLUS II or Quartus II (legacy device library) - modern Quartus Prime does not always include FLEX 10K support. (4) Always verify JTAG chain order; multiple FLEX 10K devices on the same chain must have unique TDI/TDO paths or use the BYPASS instruction.
규정 준수 정보
RoHS compliant per Intel/Altera product documentation. Halogen-free status not specified in available datasheets. Conflict-minerals compliance unknown - consult Intel product compliance page.
