EPF10K50RC240-4 - 50K-Gate FLEX 10K FPGA, 240-RQFP | Intel / Altera
부품 번호: EPF10K50RC240-4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $65 | $65.00 |
| 10 | $58 | $580.00 |
| 100 | $49.5 | $4,950.00 |
| 500 | $42 | $21,000.00 |
| 1,000 | $36.5 | $36,500.00 |
EPF10K50RC240-4 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically reconfigured by the designer after manufacturing to implement arbitrary digital logic. The FLEX 10K family is positioned hierarchically as: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. FPGAs occupy the high-density end of the programmable logic spectrum, above CPLDs and below fixed-function ASICs, and are the dominant platform for prototyping, low-volume production, and reconfigurable computing.
Key features of the EPF10K50RC240-4 include a maximum propagation delay of 0.6 ns (corresponding to roughly 125 MHz internal frequency per the FLEX 10K datasheet family), embedded array blocks (EABs) for efficient RAM/ROM implementation, MultiVolt I/O interface for interfacing across multiple logic standards, PCI pull-up clamping diodes, slew-rate control, and pin-by-pin configurable open-drain output options. Each logic element (LE) consists of a 4-input look-up table, a programmable flipflop, and dedicated carry/cascade paths, while groups of eight LEs form LABs that can implement counters, decoders, or state machines.
Typical applications include glue logic and bus interfacing in telecom and industrial control, prototyping glue logic for ASIC/ASSP replacement, PCI bus bridges, mid-density state machines, and embedded control logic. The 5 V core supply combined with MultiVolt I/O compatibility makes it well suited to legacy 5 V system designs and mixed-voltage bridges to 3.3 V peripherals. Operating temperature spans 0 °C to 70 °C (commercial grade).
When designing with the EPF10K50RC240-4, engineers should note that FLEX 10K devices are configured using legacy Altera programming tools (MAX+PLUS II or early Quartus), and that this device is now in mature lifecycle with no active new design-in support from Intel. Plan obsolescence mitigation early in the design cycle.
This page synthesizes distributor pricing, FLEX 10K family pin-compatible drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, giving engineers a single reference for legacy FLEX 10K sourcing and replacement decisions.
드롭인 대체품: EPF10K50RC240-4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K50RC240-4 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Embedded Array Blocks (EABs), Family, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K50RC240-4N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K50RC240-3
✅ 드롭인✓ 재고 있음
$58.75 / 개
데이터시트 보기 →EPF10K50EQC240-3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$21 / 개
데이터시트 보기 →EPF10K50EQC240-2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$65 / 개
데이터시트 보기 →EPF10K50EQC240-3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$59.5 / 개
데이터시트 보기 →EPF10K50EQC240-2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$87.2 / 개
데이터시트 보기 →EPF10K50RC240-4 최대 정격 & 전기적 특성
| Series | FLEX 10K |
| Family | FLEX 10K (FPGA) |
| Usable Gates | 50,000 |
| Logic Cells | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| User I/Os | 189 |
| Embedded Array Blocks (EABs) | Yes |
| Propagation Delay (tpd) | 0.6 ns |
| Internal Frequency (max) | 125 MHz |
| Supply Voltage (VCCINT) | 5 V |
| MultiVolt I/O Interface | Yes (VCCIO can be set independently) |
| Logic Family | CMOS |
| Process Technology | 0.42 µm |
| 패키지 | 240-BFQFP Exposed Pad (RQFP) |
| 핀 수 | 240 |
| 동작 온도 | 0 °C to 70 °C (Commercial) |
| 실장 유형 | Surface Mount |
| Programming | MAX+PLUS II / Quartus (legacy) |
EPF10K50RC240-4 핀 구성
| 핀 1 | I/O — User I/O pin (bank 1) |
| 핀 2 | I/O — User I/O pin (bank 1) |
| 핀 3 | I/O — User I/O pin (bank 1) |
| 핀 4 | VCCIO1 — I/O bank 1 supply voltage (MultiVolt) |
| 핀 5 | GND — Ground |
| 핀 6 | I/O — User I/O pin (bank 2) |
| 핀 7 | I/O — User I/O pin (bank 2) |
| 핀 8 | I/O — User I/O pin (bank 2) |
| 핀 9 | VCCINT — Core supply voltage (5 V) |
| 핀 10 | GND — Ground |
| 핀 11 | TDI — JTAG test data input |
| 핀 12 | TMS — JTAG test mode select |
| 핀 13 | TCK — JTAG test clock |
| 핀 14 | nCONFIG — Configuration control (active low) |
| 핀 15 | nSTATUS — Configuration status (active low) |
| 핀 16 | CONF_DONE — Configuration done indicator |
| 핀 17 | DCLK — Configuration clock |
| 핀 18 | MSEL0 — Configuration mode select 0 |
| 핀 19 | MSEL1 — Configuration mode select 1 |
| 핀 20 | VCCINT — Core supply voltage (5 V) |
일반적인 애플리케이션
EPF10K50RC240-4 적합 용도: 6 애플리케이션s: Legacy 5 V System Glue Logic, PCI Bus Bridge / Interface Logic, ASIC/ASSP Prototyping, Industrial Control / Factory Automation, Telecom Backplane Glue Logic, Embedded State Machine / DSP Co-Processor.
Legacy 5 V System Glue Logic
The EPF10K50RC240-4 is well suited to legacy 5 V system glue logic because of its native 5 V VCCINT core combined with MultiVolt I/O that supports independent VCCIO rails for mixed-voltage buses. With 189 user I/Os and 360 LABs, the device can absorb scattered address decoding, interrupt steering, wait-state generation, and bus arbitration logic that would otherwise require multiple 74-series TTL packages. The 0.6 ns propagation delay per the FLEX 10K family datasheet supports 125 MHz internal operation, more than sufficient for ISA, PCI bus bridges, and VME bus glue. Engineers often pair this FPGA with a small EPROM or configuration PROM to retain bitstream on power-up.
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PCI Bus Bridge / Interface Logic
The EPF10K50RC240-4 is widely deployed in PCI bus bridges and interface logic because FLEX 10K devices support PCI pull-up clamping diodes, slew-rate control, and 33 MHz PCI-compliant I/O via pin-by-pin configuration. Its 240-RQFP package exposes enough user I/Os to implement a 32-bit PCI target or master with side-band signals (REQ#, GNT#, FRAME#, IRDY#, TRDY#) and still leave headroom for local bus arbitration. The EABs allow implementation of small FIFOs for write/read posting without external SRAM. Industrial PCI cards in telecom and factory automation still rely on this density of FLEX 10K for legacy system repairs.
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ASIC/ASSP Prototyping
The EPF10K50RC240-4 served as a primary prototyping vehicle for ASIC and ASSP emulation in the late 1990s and early 2000s. With 50,000 usable gates and 189 user I/Os, it can hold a representative subset of a mid-complexity ASIC for in-system validation before mask commit, allowing software teams to develop firmware against real hardware. Its 5 V tolerance and 240-RQFP package with exposed pad make it compatible with legacy ASIC sockets on prototype boards. Modern prototyping typically migrates to larger FPGAs, but FLEX 10K sockets remain in service for repair and long-lifecycle defense/aerospace programs.
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Industrial Control / Factory Automation
The EPF10K50RC240-4 is found in industrial control and factory automation systems where its 5 V tolerance, 189 I/Os, and proven long-term reliability in PLC backplanes and motor-drive controllers have made it a fixture. The device can implement encoder interfaces, PWM generation, fieldbus protocol bridges (Profibus, CAN, Modbus) and safety logic in a single package. Commercial temperature grade (0 to 70 °C) is suitable for enclosed control cabinets; industrial-temperature applications typically use the EPF10K50RI240-4 or similar "I" suffix parts. The mature FLEX 10K toolchain (MAX+PLUS II) is well documented in legacy maintenance manuals.
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Telecom Backplane Glue Logic
In telecom backplane designs of the late 1990s and 2000s, the EPF10K50RC240-4 was used as backplane glue logic for bus arbitration, clock distribution, and serial-to-parallel conversion. With 189 user I/Os and MultiVolt I/O, the FPGA bridges legacy TTL buses (5 V) to lower-voltage serializer/deserializer chips (3.3 V or 2.5 V) without external level shifters. The 0.42 µm CMOS process at 5 V provides strong noise immunity required for long backplane traces. Telecom OEMs maintain spares stock of these FLEX 10K parts for legacy line-card repair.
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Embedded State Machine / DSP Co-Processor
The EPF10K50RC240-4 can serve as an embedded state machine or DSP co-processor front-end, where its 360 LABs implement parallel arithmetic pipelines and the EABs hold coefficient ROM tables for FIR/IIR filters. With 189 user I/Os, it can interface directly to external ADC/DAC data buses at sample rates supported by 125 MHz internal operation per the FLEX 10K datasheet family. Designers used FLEX 10K devices to pre-process signals before passing them to a DSP or microcontroller, particularly in sonar, ultrasound, and instrumentation front-ends. The exposed pad on the 240-RQFP package aids thermal dissipation for high-utilization designs.
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추천 제품 요약
엔지니어링 참조 데이터: EPF10K50RC240-4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K50RC240-4N | EPF10K50RC240-3 | EPF10K50EQC240-3 | EPF10K50EQC240-3N |
|---|---|---|---|---|---|
| Package | 240-BFQFP Exposed Pad (RQFP) | 240-BFQFP Exposed Pad (RQFP) | 240-BFQFP Exposed Pad (RQFP) | 240-BFQFP (PQFP) | 240-BFQFP (PQFP) |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Family | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K |
| Speed Grade | -4 | -4 | -3 | -3 | -3 |
| RoHS Compliant | No (legacy SnPb finish) | Yes (Pb-free "N" suffix) | No (legacy SnPb finish) | No (legacy SnPb finish) | Yes (Pb-free "N" suffix) |
| Usable Gates | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lifecycle | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Faster speed grade than RC240-3 (vs EPF10K50RC240-3)
- Pb-free RoHS variant available in same package (vs EPF10K50RC240-4N)
- Higher density with MultiVolt enhancements in same footprint (vs EPF10K50EQC240-3N)
설계 노트
The EPF10K50RC240-4 requires a clean 5.0 V VCCINT supply with tolerance per the FLEX 10K family datasheet (typically ±5%). Decouple VCCINT with 0.1 µF ceramic capacitors placed within 5 mm of every VCCINT/GND pair, and add a bulk 22 µF tantalum or low-ESR ceramic on each VCC plane. VCCIO banks can be set independently (e.g., 5 V for legacy buses and 3.3 V for newer peripherals) to implement MultiVolt I/O bridging. Power-on ramp should be monotonic; FLEX 10K devices begin configuration once VCCINT crosses the POR threshold.
Estimated: at maximum utilization with all 189 I/Os toggling at 66 MHz into 50 pF loads, core power dissipation can approach 1.5–2 W. The 240-RQFP exposed pad must be tied to a continuous ground plane with thermal vias to dissipate heat; without it, junction temperature can exceed 100 °C in still air. For high-utilization designs, attach a small heatsink or place the device on a top-layer copper pour of at least 1 sq inch connected to the exposed pad.
Route configuration clock (DCLK) and JTAG (TCK) traces as short, guarded 50 Ω microstrip lines to avoid configuration errors. Place the configuration PROM (e.g., EPC1441LC20) within 50 mm of the FPGA to keep passive serial (PS) configuration traces short. Keep VCCIO bank supplies separately bypassed because MultiVolt I/O drivers draw switching current from each bank's VCCIO pin. Exposed pad must have a continuous ground plane with at least 9 thermal vias (0.3 mm drill) to the inner ground layer.
Do not apply 3.3 V signals to FLEX 10K I/O banks configured for 5 V VCCIO without checking input VIH levels; otherwise inputs may exceed absolute maximum ratings. FLEX 10K devices use legacy MAX+PLUS II or early Quartus software; modern Quartus versions may not include FLEX 10K device libraries and require legacy tool installation. Verify bitstream CRC and CONF_DONE timing during prototyping, and always include the JTAG chain in the BOM for in-system reprogramming during board bring-up.
규정 준수 정보
RoHS compliance depends on suffix: base EPF10K50RC240-4 uses legacy SnPb finish (non-RoHS); the EPF10K50RC240-4N suffix provides Pb-free RoHS-compliant finish. No AEC-Q100 qualification (commercial temperature grade). REACH, halogen-free, and conflict-mineral status not confirmed in provided web data.
