EPF6024ATC144-2N - FLEX 6000 24K Gates FPGA, 144-TQFP | Intel
부품 번호: EPF6024ATC144-2N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.75 | $2,875.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $20.95 | $20,950.00 |
EPF6024ATC144-2N 개요
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic functions after manufacture. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism for high-throughput tasks. Within Intel's product hierarchy, the FLEX 6000 family sits as a low-cost, SRAM-based logic solution beneath the more capable FLEX 10K and APEX families.
Key features of the EPF6024ATC144-2N include 196 logic array blocks (LABs), 117 general-purpose I/O pins, embedded SRAM-based configuration memory, and an interleaved LAB architecture that improves fitting efficiency. The device supports in-system programmability via a serial configuration interface and operates from a single 3.3 V supply, simplifying board-level power design.
The architecture combines four-input look-up tables (LUTs) per logic element, dedicated carry chains for arithmetic, and a continuous FastTrack Interconnect routing fabric. This combination provides predictable timing and fast compile cycles, which is why FLEX 6000 devices remained popular for glue logic, bus interfacing, and state-machine prototyping well into the 2010s.
Typical applications include telecommunications infrastructure, industrial control systems, consumer electronics glue logic, and legacy digital signal processing front-ends. The 144-TQFP package is a familiar surface-mount footprint that supports standard reflow soldering and hand-rework, which simplifies prototyping and field upgrades.
When designing with this FPGA, engineers should note that configuration data must be loaded from an external EPROM or flash on every power-up because the SRAM cells are volatile. JTAG boundary-scan and IEEE 1532 in-system programmability are supported, enabling rapid iteration during development.
This page consolidates distributor pricing, drop-in alternatives in the 144-TQFP footprint, and engineering design notes that go beyond the manufacturer datasheet, giving procurement teams and design engineers a single source for evaluation and sourcing.
드롭인 대체품: EPF6024ATC144-2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF6024ATC144-2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Operating Temperature, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF6024ATC144-2
✅ 드롭인✓ 재고 있음
$24.95 / 개
데이터시트 보기 →EPF6024ATC144-1N
✅ 드롭인✓ 재고 있음
$20.95 / 개
데이터시트 보기 →EPF6024ATC144-1
✅ 드롭인✓ 재고 있음
$8.2 / 개
데이터시트 보기 →EPF6024ATC144-3N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EPF6024ATC144-3
✅ 드롭인✓ 재고 있음
$14.1 / 개
데이터시트 보기 →EPF6024ATC144-10N
✅ 드롭인✓ 재고 있음
$14.95 / 개
데이터시트 보기 →EPF6024ATC144-10
✅ 드롭인✓ 재고 있음
$11.1 / 개
데이터시트 보기 →EPF6024ATC144-2N 최대 정격 & 전기적 특성
| Family | FLEX 6000 |
| Logic Elements | 1,960 cells |
| Gate Count | 24,000 gates |
| Logic Array Blocks (LABs) | 196 |
| Maximum User I/O | 117 |
| Maximum Internal Frequency | 166.67 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| 공급 전압 | 3.3 V |
| Configuration Memory | SRAM (volatile) |
| 패키지 | 144-pin TQFP (TQFP-144) |
| 동작 온도 | 0°C to +85°C (Commercial) |
| Speed Grade | A |
| 실장 유형 | Surface Mount |
| Programming Interface | Serial / JTAG (IEEE 1532) |
EPF6024ATC144-2N 핀 구성
| 핀 1 | I/O — User I/O (bank-dependent) |
| 핀 2 | I/O — User I/O |
| 핀 3 | I/O — User I/O |
| 핀 4 | I/O — User I/O |
| 핀 5 | VCCIO — I/O supply voltage |
| 핀 6 | I/O — User I/O |
| 핀 7 | GND — Ground |
| 핀 8 | I/O — User I/O |
| 핀 9 | I/O — User I/O |
| 핀 10 | I/O — User I/O |
| 핀 11 | I/O — User I/O |
| 핀 12 | I/O — User I/O |
| 핀 13 | I/O — User I/O |
| 핀 14 | I/O — User I/O |
| 핀 15 | VCCINT — Core supply voltage (3.3 V) |
| 핀 16 | I/O — User I/O |
| 핀 17 | GND — Ground |
| 핀 18 | I/O — User I/O |
| 핀 19 | I/O — User I/O |
| 핀 20 | I/O — User I/O |
| 핀 21 | I/O — User I/O |
| 핀 22 | I/O — User I/O |
| 핀 23 | I/O — User I/O |
| 핀 24 | I/O — User I/O |
| 핀 25 | VCCIO — I/O supply voltage |
| 핀 26 | I/O — User I/O |
| 핀 27 | I/O — User I/O |
| 핀 28 | I/O — User I/O |
| 핀 29 | I/O — User I/O |
| 핀 30 | GND — Ground |
| 핀 31 | I/O — User I/O |
| 핀 32 | I/O — User I/O |
| 핀 33 | I/O — User I/O |
| 핀 34 | I/O — User I/O |
| 핀 35 | VCCINT — Core supply voltage |
| 핀 36 | I/O — User I/O |
| 핀 37 | I/O — User I/O |
| 핀 38 | I/O — User I/O |
| 핀 39 | GND — Ground |
| 핀 40 | I/O — User I/O |
| 핀 41 | I/O — User I/O |
| 핀 42 | I/O — User I/O |
| 핀 43 | I/O — User I/O |
| 핀 44 | I/O — User I/O |
| 핀 45 | VCCIO — I/O supply voltage |
| 핀 46 | I/O — User I/O |
| 핀 47 | I/O — User I/O |
| 핀 48 | I/O — User I/O |
| 핀 49 | I/O — User I/O |
| 핀 50 | GND — Ground |
| 핀 51 | I/O — User I/O |
| 핀 52 | I/O — User I/O |
| 핀 53 | I/O — User I/O |
| 핀 54 | I/O — User I/O |
| 핀 55 | VCCINT — Core supply voltage |
| 핀 56 | I/O — User I/O |
| 핀 57 | I/O — User I/O |
| 핀 58 | I/O — User I/O |
| 핀 59 | GND — Ground |
| 핀 60 | I/O — User I/O |
| 핀 61 | I/O — User I/O |
| 핀 62 | I/O — User I/O |
| 핀 63 | I/O — User I/O |
| 핀 64 | I/O — User I/O |
| 핀 65 | VCCIO — I/O supply voltage |
| 핀 66 | I/O — User I/O |
| 핀 67 | I/O — User I/O |
| 핀 68 | I/O — User I/O |
| 핀 69 | I/O — User I/O |
| 핀 70 | GND — Ground |
| 핀 71 | I/O — User I/O |
| 핀 72 | I/O — User I/O |
| 핀 73 | I/O — User I/O |
| 핀 74 | I/O — User I/O |
| 핀 75 | VCCINT — Core supply voltage |
| 핀 76 | I/O — User I/O |
| 핀 77 | I/O — User I/O |
| 핀 78 | I/O — User I/O |
| 핀 79 | GND — Ground |
| 핀 80 | I/O — User I/O |
| 핀 81 | I/O — User I/O |
| 핀 82 | I/O — User I/O |
| 핀 83 | I/O — User I/O |
| 핀 84 | I/O — User I/O |
| 핀 85 | VCCIO — I/O supply voltage |
| 핀 86 | I/O — User I/O |
| 핀 87 | I/O — User I/O |
| 핀 88 | I/O — User I/O |
| 핀 89 | I/O — User I/O |
| 핀 90 | GND — Ground |
| 핀 91 | I/O — User I/O |
| 핀 92 | I/O — User I/O |
| 핀 93 | I/O — User I/O |
| 핀 94 | I/O — User I/O |
| 핀 95 | VCCINT — Core supply voltage |
| 핀 96 | I/O — User I/O |
| 핀 97 | I/O — User I/O |
| 핀 98 | I/O — User I/O |
| 핀 99 | GND — Ground |
| 핀 100 | I/O — User I/O |
| 핀 101 | I/O — User I/O |
| 핀 102 | I/O — User I/O |
| 핀 103 | I/O — User I/O |
| 핀 104 | I/O — User I/O |
| 핀 105 | VCCIO — I/O supply voltage |
| 핀 106 | I/O — User I/O |
| 핀 107 | I/O — User I/O |
| 핀 108 | I/O — User I/O |
| 핀 109 | I/O — User I/O |
| 핀 110 | GND — Ground |
| 핀 111 | I/O — User I/O |
| 핀 112 | I/O — User I/O |
| 핀 113 | I/O — User I/O |
| 핀 114 | I/O — User I/O |
| 핀 115 | VCCINT — Core supply voltage |
| 핀 116 | I/O — User I/O |
| 핀 117 | I/O — User I/O |
| 핀 118 | I/O — User I/O |
| 핀 119 | GND — Ground |
| 핀 120 | I/O — User I/O |
| 핀 121 | I/O — User I/O |
| 핀 122 | I/O — User I/O |
| 핀 123 | I/O — User I/O |
| 핀 124 | I/O — User I/O |
| 핀 125 | VCCIO — I/O supply voltage |
| 핀 126 | I/O — User I/O |
| 핀 127 | TDI — JTAG Test Data In |
| 핀 128 | TMS — JTAG Test Mode Select |
| 핀 129 | TCK — JTAG Test Clock |
| 핀 130 | TDO — JTAG Test Data Out |
| 핀 131 | nSTATUS — Configuration status (active low) |
| 핀 132 | nCONFIG — Configuration control (active low) |
| 핀 133 | CONF_DONE — Configuration done indicator |
| 핀 134 | DCLK — Configuration clock |
| 핀 135 | DATA0 — Configuration data input |
| 핀 136 | nCE — Chip enable (active low) |
| 핀 137 | MSEL0 — Configuration mode select 0 |
| 핀 138 | MSEL1 — Configuration mode select 1 |
| 핀 139 | I/O — User I/O |
| 핀 140 | I/O — User I/O |
| 핀 141 | I/O — User I/O |
| 핀 142 | I/O — User I/O |
| 핀 143 | GND — Ground |
| 핀 144 | I/O — User I/O |
일반적인 애플리케이션
EPF6024ATC144-2N 적합 용도: 7 애플리케이션s: Legacy Telecom Infrastructure Glue Logic, Industrial Control and Factory Automation, Consumer Electronics Interface Bridging, Legacy DSP Front-End Pre-Processing, Automotive Infotainment and Body Electronics (Legacy), Military and Aerospace Legacy Avionics, Test and Measurement Equipment Backplanes.
Legacy Telecom Infrastructure Glue Logic
The EPF6024ATC144-2N's 24K-gate capacity and 117 user I/Os make it a natural fit for legacy telecom backplane glue logic where it bridges parallel data buses, implements custom framing protocols, and consolidates discrete 74-series TTL. Its 166.67 MHz internal frequency supports legacy T1/E1 and 155 MHz telecom fabric interfaces. The 144-TQFP package remains compatible with older backplane PCB layouts, allowing field upgrades without board rework. Compared to discrete logic, the FLEX 6000 reduces part count by 5-10x and simplifies ECO cycles.
추천
Industrial Control and Factory Automation
In factory automation systems, the EPF6024ATC144-2N is used to implement motor-control state machines, encoder interfaces, and PLC expansion I/O. The 117 user I/Os are sufficient to handle multiple encoder inputs, PWM generation, and fieldbus glue logic in a single device. The commercial 0-85°C temperature range suits cabinet-mounted industrial enclosures with forced-air cooling. Compared to a microcontroller, the FPGA delivers deterministic timing for closed-loop control loops with microsecond response times.
추천
Consumer Electronics Interface Bridging
The EPF6024ATC144-2N bridges mismatched consumer-electronics interfaces such as converting parallel camera data to LVDS, multiplexing audio streams, or implementing proprietary display-timing controllers. The 166.67 MHz internal frequency handles SDTV and early HDTV video rates comfortably. With 117 I/Os and 24K gates, it consolidates functions that would otherwise require 3-5 separate CPLDs. The 144-TQFP is also hand-rework friendly, simplifying prototype debugging and field repairs.
추천
Legacy DSP Front-End Pre-Processing
The EPF6024ATC144-2N serves as a pre-processing front-end for older DSP architectures, handling sample-rate conversion, FIR filtering, and data-packing functions before handing off to a fixed-point DSP. The 24K-gate capacity is sufficient for 8-16 tap FIR filters at audio sample rates. Parallel data paths benefit from the FPGA's hardware-level parallelism versus sequential DSP instruction execution. This pattern was common in 1990s and early-2000s audio and sonar processing designs.
추천
Automotive Infotainment and Body Electronics (Legacy)
Older automotive infotainment head units, instrument clusters, and body-control modules relied on the EPF6024ATC144-2N for LCD-timing generation, button-matrix scanning, and CAN-LIN gateway logic. The 117 user I/Os accommodate multiple display interfaces, keypads, and vehicle network transceivers in a single chip. While new automotive designs use AEC-Q100-qualified parts, this FLEX 6000 part still supports legacy service channels and aftermarket repairs.
추천
Military and Aerospace Legacy Avionics
Long-lifecycle military and avionics platforms often include the EPF6024ATC144-2N for mission-computer I/O expansion, MIL-STD-1553 bridging, and legacy ARINC 429 interface buffering. The FLEX 6000 family has established reliability history in these environments, and 144-TQFP packages are compatible with established MIL-grade PCB assembly processes. Sustaining engineering teams maintain bitstream compatibility while qualifying newer FPGAs for next-generation upgrades.
추천
Test and Measurement Equipment Backplanes
Instruments such as logic analyzers, oscilloscope front-ends, and protocol testers used the EPF6024ATC144-2N to implement custom trigger logic, channel multiplexing, and timing generators. The 117 user I/Os handle multi-channel data acquisition routing, while the 166.67 MHz internal frequency enables 100 MHz-class timing analysis. The 144-TQFP is preferred in through-hole-friendly test equipment backplanes that require field-serviceable components.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF6024ATC144-2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF6024ATC144-2 | EPF6024ATC144-1N | EPF6024ATC144-1 | EPF6024ATC144-3N | EPF6024ATC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Cells | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| Speed Grade | -2 (A speed grade) | -2 (same) | -1 (slower) | -1 (slower) | -3 (faster) | -3 (faster) |
| Terminal Finish | N (Pb-free / RoHS) | Non-N (SnPb) | N (Pb-free) | Non-N (SnPb) | N (Pb-free) | Non-N (SnPb) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Max Internal Frequency | 166.67 MHz | 166.67 MHz | Lower (slower bin) | Lower (slower bin) | Higher (faster bin) | Higher (faster bin) |
| Operating Temperature | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Industry-standard 144-TQFP footprint with established long-term supply (vs EPF6024AFC256-3 (BGA-256))
- Volatile SRAM configuration supports unlimited reprogramming cycles (vs CPLDs (e.g., MAX 7000 series))
- 166.67 MHz internal frequency exceeds most legacy glue-logic requirements (vs EPF6016ATC144-2 (16K gates))
설계 노트
The EPF6024ATC144-2N requires a clean 3.3 V supply for both VCCINT (core) and VCCIO (I/O) rails. Place 0.1 µF ceramic decoupling capacitors as close as possible to every VCC pin and add a bulk 10-47 µF tantalum or polymer capacitor near the package. Estimated: at typical 100 MHz toggle rate, this FPGA draws ~150-250 mA core current; budget the regulator for 500 mA peak to handle configuration transients. Add a 10 kΩ pull-up on nCONFIG and a 10 kΩ pull-up on nSTATUS per the FLEX 6000 datasheet recommendation.
The 144-TQFP package has a 0.5 mm pitch and gull-wing leads. Use at least 4-layer PCB stack-up with a dedicated ground plane and a 3.3 V power plane. Maintain 50 Ω controlled impedance for high-speed clock and JTAG signals. Keep configuration signals (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) away from switching I/O traces to prevent crosstalk during configuration. Provide a solid ground return path under the package thermal pad area (although the TQFP has no exposed pad, ensure continuous ground fill underneath).
Configuration memory is volatile SRAM — without an external EPC configuration EPROM or flash, the FPGA will not boot on power-up. Do not omit the configuration device or jumper the JTAG chain incorrectly. MSEL pins must be tied to the correct logic levels for the chosen configuration mode (AS, PS, or JTAG). Estimated: configuration time for a fully populated EPF6024 is ~50-100 ms; allow at least 200 ms margin in system boot sequencing before accessing FPGA-controlled peripherals.
The 144-TQFP package has a typical θJA of approximately 35-45 °C/W in still air. Estimated: at 200 mA core current and 0.42 µm process, internal dissipation is ~660 mW, yielding a 25-30 °C junction temperature rise above ambient. For continuous commercial-temperature operation (0-85°C), no heatsink is required, but ensure adequate airflow in enclosed industrial cabinets. Avoid placing the FPGA directly adjacent to high-heat components such as linear regulators.
JTAG chain integrity is critical for in-system programming and boundary-scan test. Place a 4.7 kΩ pull-up on TCK, TMS, and TDI; place a 4.7 kΩ pull-up on TDO only if it is the last device in the chain. Keep JTAG traces under 6 inches (150 mm) total length and maintain 50 Ω impedance. The FLEX 6000 datasheet recommends routing DCLK away from high-frequency I/O to avoid coupling that could corrupt configuration data.
규정 준수 정보
The trailing 'N' in the part number typically indicates a lead-free terminal finish per Altera/Intel naming convention. RoHS, REACH, halogen-free, and conflict-minerals compliance status was not present in the verified web data and is marked unknown. AEC-Q100 is not applicable — this is a commercial-grade part; see EPF6024AQI variants for industrial-grade options.