EPF8820ARC208-3 - FLEX 8000 FPGA, 8K Gates, 672 Cells | Intel / Altera
부품 번호: EPF8820ARC208-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $79 | $7,900.00 |
| 500 | $70 | $35,000.00 |
| 1,000 | $62 | $62,000.00 |
EPF8820ARC208-3 개요
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) - itself a category of integrated circuit - that combines a matrix of configurable logic blocks (CLBs), embedded memory, and programmable routing to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy (CPLD -> PLD -> FPGA -> programmable SoC) and offer higher gate counts and richer register/IO resources than simpler CPLDs. The FLEX 8000 family was Altera's first generation of look-up-table (LUT)-based FPGAs with embedded memory, replacing earlier MAX-series PAL/GAL architectures with true register-rich, in-system reconfigurable logic.
Key features include in-circuit reconfigurability (ICR) via external configuration devices or intelligent controllers, four dedicated low-skew clock distribution networks, JTAG boundary-scan test support (IEEE 1149.1), and tri-stateable I/O buffers with individually programmable slew-rate control. The device also integrates fast on-chip logic for arithmetic functions and provides selectable 3.3V/5V I/O tolerance through dedicated PCI-compliant output buffers, simplifying mixed-voltage interfacing on legacy backplanes.
The EPF8820ARC208-3 architecture consists of 672 logic elements arranged in rows and columns, with each element containing a 4-input look-up table, a programmable flip-flop, and dedicated carry-chain logic for arithmetic operations. Configuration memory is SRAM-based, requiring a serial or parallel EPROM (such as the EPC2 or EPC8 configuration device) to load the bitstream at power-up. This SRAM architecture allows unlimited reconfigurations and supports in-field firmware upgrades, but also means the configuration is volatile and must be reloaded after every power cycle.
Typical applications include telecommunications channel aggregation, industrial control and factory automation glue logic, military and aerospace systems, PCI bus interfaces, legacy mainframe and storage interfaces, and digital signal processing front-ends. The wide 5V supply tolerance and 208-pin package also make it well suited for industrial 24V-conditioned rails with local regulation and for backplane designs that route many parallel signals.
When designing with this device, ensure proper decoupling on every VCC/VCCIO pin, place the configuration EPROM within the recommended trace-length budget, and honor the exposed-pad soldering requirement to maintain the specified thermal resistance. Designers migrating to modern designs should evaluate Intel Cyclone or Lattice ECP5 families, but pin-compatible FLEX 8000 variants remain available for long-life-cycle programs.
This page synthesizes distributor pricing, drop-in alternatives from the FLEX 8000 family, and practical design notes not found in the manufacturer datasheet alone - providing a single authoritative reference for procurement and engineering teams.
드롭인 대체품: EPF8820ARC208-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF8820ARC208-3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Method, Process Technology, Speed Grade, Usable Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF8820ARC208-2
✅ 드롭인✓ 재고 있음
$17.95 / 개
데이터시트 보기 →EPF8820ARC208-24
✅ 드롭인✓ 재고 있음
$27.8 / 개
데이터시트 보기 →EPF8820ARC208-2N
✅ 드롭인✓ 재고 있음
$20.55 / 개
데이터시트 보기 →EPF8820ARC208-2H
✅ 드롭인✓ 재고 있음
$10.2 / 개
데이터시트 보기 →EPF8820ARC208-2A
✅ 드롭인✓ 재고 있음
$14.1 / 개
데이터시트 보기 →EPF8636ARC208-3
✅ 드롭인✓ 재고 있음
$19.95 / 개
데이터시트 보기 →EPF8636ARC208-4
✅ 드롭인✓ 재고 있음
$16.5 / 개
데이터시트 보기 →EPF8820ARC208-3 최대 정격 & 전기적 특성
| Series | FLEX 8000 |
| Family | FLEX 8000 (EPF8820) |
| Usable Gates | 8,000 |
| Logic Cells / Elements | 672 |
| Registers | 152 |
| Maximum Operating Frequency | 125 MHz |
| Supply Voltage (VCC) | 4.75 V to 5.25 V |
| Process Technology | 0.42 µm CMOS |
| Configuration Memory | SRAM (volatile) |
| 패키지 / 케이스 | 208-BFQFP Exposed Pad (208-RQFP, 28x28 mm) |
| Supplier Device Package | 208-RQFP (28x28) |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| In-Circuit Reconfigurability (ICR) | Yes (via external configuration devices) |
| Boundary-Scan Test | JTAG (IEEE 1149.1) |
| I/O Tolerance | 3.3 V / 5 V |
| Clock Networks | 4 dedicated low-skew global clocks |
EPF8820ARC208-3 208-rqfp (28x28) 핀 구성 가이드
EPF8820ARC208-3(208-rqfp (28x28) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF8820ARC208-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF8820ARC208-3 적합 용도: 6 애플리케이션s: Telecommunications Channel Aggregation, Industrial Control and Factory Automation Glue Logic, Legacy PCI Bus Interface, Digital Signal Processing Front-End, Military and Aerospace Avionics Bus Interfaces, Storage and Mainframe Legacy Interface.
Telecommunications Channel Aggregation
The EPF8820ARC208-3 fits telecommunications channel aggregation and backplane glue logic applications because of its 8,000 usable gates, 152 registers, and four dedicated low-skew global clock networks. With 125 MHz maximum frequency (speed grade -3), it can implement multi-channel framers, protocol converters, and serializer-deserializer (SERDES) glue logic while leaving headroom for state-machine-heavy channel management. The 208-pin RQFP exposes enough I/O for parallel telecom buses (HMVIP, H.110, TDM) and the 5V supply tolerance simplifies integration into legacy 5V backplanes. In a typical design the FPGA sits between a TDM bus and a processor, demultiplexing channels and presenting formatted frames to the host CPU.
추천
Industrial Control and Factory Automation Glue Logic
The EPF8820ARC208-3 is well suited to industrial control and factory automation glue logic where 5V tolerance, register-rich architecture, and high I/O count are required. The device's 152 registers and 672 logic cells can implement multiple PID controllers, encoder counters, and stepper-motor pulse generators in a single chip. Its 208-pin RQFP package exposes ~140 user I/O, enough for parallel industrial buses (PC/104, CompactPCI, VME) and discrete sensor/actuator wiring. The exposed thermal pad supports sustained operation in factory cabinets where ambient temperatures can reach 70C. Designers typically pair the FPGA with opto-isolated I/O buffers and a watchdog supervisor.
추천
Legacy PCI Bus Interface
The EPF8820ARC208-3's 3.3V/5V PCI-compliant I/O buffers make it a strong choice for legacy PCI bus interfaces and add-in card glue logic. The device can implement PCI target or master state machines, custom configuration registers, and interrupt controllers using its 8,000 usable gates and 152 registers. The 208-RQFP package provides sufficient I/O for a 32-bit PCI bus plus side signals, and the 125 MHz internal frequency comfortably handles the 33 MHz PCI clock with margin. In a typical add-in card design the FLEX 8000 handles PCI bus arbitration, target decode, and DMA sequencing while the host processor runs application code.
추천
Digital Signal Processing Front-End
The EPF8820ARC208-3 supports digital signal processing front-end functions such as FIR/IIR filtering, FFT pre-processing, and data-rate conversion in mid-range DSP systems. The dedicated carry-chain logic in each logic element enables efficient adder trees at 125 MHz, while the four low-skew global clocks synchronize parallel sample streams. The 208-pin RQFP package accommodates parallel ADC/DAC data buses plus control logic. In a typical DSP front-end the FLEX 8000 performs decimation, channel selection, and gain control before passing data to a dedicated DSP processor or ASIC. The 5V supply tolerance is particularly useful for legacy ADC/DAC interfaces.
추천
Military and Aerospace Avionics Bus Interfaces
The EPF8820ARC208-3 supports military and aerospace avionics bus interfaces (MIL-STD-1553, ARINC 429) where the FLEX 8000 family's proven long-term reliability and high I/O count are valued. The 208-pin RQFP package offers sufficient I/O for dual-redundant bus channels plus discrete I/O, and the SRAM-based configuration supports in-field upgrades mandated by avionics maintenance procedures. The speed grade -3 variant with 125 MHz capability handles Manchester-encoded bus timing with margin. For aerospace programs requiring full traceability, sourcing from Rochester Electronics or other authorized franchised distributors ensures pedigree documentation.
추천
Storage and Mainframe Legacy Interface
The EPF8820ARC208-3 serves storage and mainframe legacy interface applications including SCSI bus termination logic, parallel ATA converters, and custom mainframe channel adapters. Its 8,000 gates and 152 registers can implement protocol state machines, CRC engines, and bus arbiters in a single chip. The 5V tolerance and 208-pin RQFP package support the wide parallel buses common in enterprise storage, while 125 MHz speed grade handles synchronous transfer rates. The device's exposed thermal pad supports continuous operation in storage array backplanes. Designers typically pair the FPGA with bus transceivers and parity generators to build complete legacy bridge solutions.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF8820ARC208-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF8820ARC208-2 | EPF8820ARC208-24 | EPF8820ARC208-2N | EPF8820ARC208-2H | EPF8820ARC208-2A | EPF8636ARC208-3 | EPF8636ARC208-4 |
|---|---|---|---|---|---|---|---|---|
| Package | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) | 208-RQFP (28x28) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Usable Gates | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 6,000 | 6,000 |
| Logic Cells / Elements | 672 | 672 | 672 | 672 | 672 | 672 | 432 | 432 |
| Registers | 152 | 152 | 152 | 152 | 152 | 152 | 120 | 120 |
| Speed Grade | -3 (~125 MHz) | -2 (~85 MHz) | -2 industrial | -2 lead-free | -2 high-reliability | -2 automotive | -3 (~125 MHz) | -4 (higher) |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS |
주요 차별점
- Mid-range FLEX 8000 density with full 208-pin RQFP I/O budget (vs EPF8636ARC208-3)
- Speed grade -3 delivers 125 MHz maximum frequency (vs EPF8820ARC208-2)
- Industrial-grade FLEX 8000 with extensive distributor stock (vs EPF81500ARC304-4)
- 5V-native supply with 3.3V PCI-compliant I/O (vs Xilinx XC4000-series (cross-era))
설계 노트
The EPF8820ARC208-3 requires multiple VCC and VCCIO pins per the FLEX 8000 datasheet; route a 5V plane directly to all VCC pins and decouple each pin with a 0.1 µF ceramic capacitor placed within 5 mm of the package. Add bulk 10-47 µF tantalum or aluminum-polymer capacitors at the board-level to handle SRAM configuration transients. During configuration loading, inrush current can spike several hundred mA; ensure the 5V regulator has adequate headroom. Power sequencing between VCC and VCCIO is not required for the FLEX 8000 family, but simultaneous ramp is recommended to avoid I/O bus contention.
The 208-RQFP exposed pad must be soldered to a ground copper pour for both thermal dissipation and electrical reference. Estimated: at 125 MHz with all 672 logic cells active, typical power dissipation is ~1.5 W; the exposed pad reduces theta_JA from ~35 C/W (no pad) to ~20 C/W (soldered pad). At 70C ambient this provides ~50C junction margin to the 125C maximum. For continuous operation at industrial temperatures, use a minimum 1 square-inch copper pour connected via thermal vias.
Place the EPC2/EPC8 configuration EPROM within the trace-length budget specified in the FLEX 8000 datasheet (typically <100 mm). Use matched-length traces for configuration clock (DCLK) and data (DATA0..n) to avoid setup/hold violations at high DCLK rates. Reserve dedicated PCB layers for ground and 5V power; avoid routing signals across split ground planes. Maintain 50 ohm characteristic impedance on high-speed clock nets. For JTAG (IEEE 1149.1) boundary-scan, route TCK, TMS, TDI, TDO as a single chain with no stubs.
Do not assume SRAM configuration is retained across power cycles - the FLEX 8000 family requires reload on every power-up via EPC2/EPC8 configuration EPROM. Do not leave CONFIG_DONE floating; tie to a pull-up so the host processor can monitor configuration status. Do not exceed the maximum I/O current per bank (refer to FLEX 8000 datasheet); use external bus switches if driving many high-current loads. Do not forget the exposed-pad solder connection - missing it causes thermal shutdown in continuous operation. Finally, verify configuration bitstream CRC at production test to catch corrupted EEPROM images.
규정 준수 정보
EPF8820ARC208-3 is part of the legacy FLEX 8000 family originally released in the 1990s; lead-free (Pb-free) variants are denoted by the 'N' suffix (e.g., EPF8820ARC208-2N). Compliance status for the standard '-3' speed grade not explicitly confirmed in available data. Automotive-grade equivalent is EPF8820ARC208-2A.
