EPF8820ARI208-3N - 672 LEs FLEX 8000 FPGA, 208-PQFP | Intel / Altera
부품 번호: EPF8820ARI208-3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $38.5 | $385.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $24.2 | $12,100.00 |
| 1,000 | $21.5 | $21,500.00 |
EPF8820ARI208-3N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells, all controlled by SRAM-based configuration memory. FPGAs occupy the highest tier in the programmable logic hierarchy - sitting between discrete logic ICs and ASICs - and are widely used for high-density glue logic, prototyping, DSP, and parallel processing where time-to-market and in-system reprogrammability are paramount. The FLEX 8000 family, launched in the mid-1990s, established many of the architectural conventions still used in modern Altera/Intel FPGA families.
Key architectural features include configurable I/O standards supporting both 3.3V and 5V operation, embedded logic array blocks with cascade-chain interconnect for high-speed wide-input functions, and JTAG-based in-system programming via the ByteBlaster or BitBlaster download cables. Each logic element contains a 4-input look-up table (LUT) plus a programmable flip-flop, and each LAB aggregates 8 LEs plus local interconnect. The device also integrates a global ClearN signal, four dedicated clock inputs, and a configurable output enable per I/O pin.
Typical applications for the EPF8820ARI208-3N include industrial control glue logic, legacy telecom interface cards, bus-bridging and protocol-conversion logic, test and measurement front-ends, and migration of older Altera designs that require a true drop-in replacement on existing PQFP-208 PCB footprints. The wide 3.3V/5V I/O tolerance and -40C to +85C industrial temperature range also support factory-automation and instrumentation designs. Many engineers keep FLEX 8000 stocks for maintaining long-life industrial equipment where a board re-spin is cost-prohibitive.
A critical design consideration is the device's 5V/3.3V dual-voltage I/O - engineers must consult the datasheet's VCCINT and VCCIO pin assignments before laying out mixed-voltage rails, because mis-wiring can permanently damage the input buffers. Because the FLEX 8000 family is EOL with no new designs recommended for production, new designs should target Cyclone IV/V or MAX series unless a true drop-in is required for repair/maintenance. The configuration memory is volatile, so an external PROM or microcontroller is required to load the bitstream at power-up. This page synthesizes distributor availability, drop-in alternatives, and practical design notes not typically found in the manufacturer datasheet.
드롭인 대체품: EPF8820ARI208-3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF8820ARI208-3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Configuration Method, Device Type, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF8820ARI208-3
✅ 드롭인✓ 재고 있음
$55.4 / 개
데이터시트 보기 →EPF8820ARI208-2N
✅ 드롭인✓ 재고 있음
$99.5 / 개
데이터시트 보기 →EPF8820ARI208-2
✅ 드롭인✓ 재고 있음
$11.5 / 개
데이터시트 보기 →EPF8820ARI208-1
✅ 드롭인✓ 재고 있음
$20.4 / 개
데이터시트 보기 →EPF8820ARC208-3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$85 / 개
데이터시트 보기 →EPF8820ARI208-3N 최대 정격 & 전기적 특성
| Family | FLEX 8000 |
| Device Sub-family | EPF8820A |
| Logic Elements (LEs) | 672 |
| Logic Array Blocks (LABs) | 16 |
| Dedicated Flip-Flops | 672 |
| 패키지 | 208-pin PQFP / RQFP (gull-wing) |
| Terminal Form | GULL WING |
| Package Code (per Corphita) | HFQFP |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Process Technology | CMOS (SRAM-based configuration) |
| I/O Voltage Tolerance | 3.3V or 5V configurable |
| Configuration Method | Serial (PS / passive serial) or ByteBlaster JTAG |
| Number of Terminals | 208 |
| 실장 유형 | Surface Mount |
EPF8820ARI208-3N hfqfp 핀 구성 가이드
EPF8820ARI208-3N(hfqfp 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF8820ARI208-3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF8820ARI208-3N 적합 용도: 6 애플리케이션s: Legacy Industrial Glue Logic, Telecom Interface and Protocol Bridging, Test and Measurement Front-End Logic, Bus-Bridging and Protocol Conversion, Long-Life Fielded Equipment Repair, Educational FPGA and Legacy Design Reference.
Legacy Industrial Glue Logic
The EPF8820ARI208-3N fits legacy industrial glue logic where 672 logic elements are sufficient to replace multiple discrete 74LS/HC logic ICs on a control board. Its 208-RQFP package and industrial -40C to +85C temperature range let it operate inside factory-automation enclosures and outdoor cabinets. The dual 3.3V/5V configurable I/O lets it interface directly to legacy 5V PLC backplanes and modern 3.3V microcontrollers without level shifters. Because the FLEX 8000A SRAM bitstream is reloadable in-system via JTAG, field firmware revisions are possible without removing the IC from the board, which is critical for long-life industrial equipment where the original PCB layout must be preserved.
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Telecom Interface and Protocol Bridging
The EPF8820ARI208-3N suits telecom interface cards requiring low-density protocol conversion between legacy E1/T1, RS-232, RS-485, and parallel bus formats. Its 672 flip-flops and 16 LABs provide ample state-machine resources to implement UART, HDLC, and bus-arbitration logic, while the 5V-tolerant I/O banks mate directly to telecom line-interface ICs. The device's industrial temperature range handles outdoor cabinet environments, and the 208-RQFP's gull-wing leads are field-reworkable for legacy repair. Engineers maintaining installed telecom bases use the FLEX 8000 family precisely because the bitstream format is well-documented and stable across reorders, avoiding expensive board re-spins.
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Test and Measurement Front-End Logic
The EPF8820ARI208-3N works well in test-and-measurement front-end boards that need user-configurable trigger sequencers, counter/timer chains, and digital pattern generators. The 672 logic elements support mid-density state machines and parallel data paths, while the 672 flip-flops provide the register density required for high-resolution timing measurements. The 5V-tolerant I/O cells interface to legacy bench-top instruments, and the industrial temperature rating covers laboratory and field-test use. Because FLEX 8000 designs can be re-loaded in seconds via JTAG, an engineer can iterate on test patterns without swapping EPROMs, dramatically accelerating instrument bring-up.
추천
Bus-Bridging and Protocol Conversion
The EPF8820ARI208-3N is a natural fit for bus-bridging between PCI, ISA, VME, and proprietary backplanes in legacy embedded systems. Its 672 LEs can implement bus-state machines, address decoding, and DMA handshake logic without external TTL glue, while 5V-tolerant I/O banks mate directly to legacy 5V bus transceivers. The 208-RQFP's high pin count provides dedicated pins for each bus control signal, simplifying PCB routing and timing analysis. Industrial temperature grading ensures operation in backplane chassis with limited airflow, and the field-upgradeable SRAM configuration allows firmware patches to be pushed without depot-level rework.
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Long-Life Fielded Equipment Repair
The EPF8820ARI208-3N is specifically targeted at maintenance and repair of long-life fielded equipment - industrial controllers, military radios, medical monitors, and avionics subsystems originally designed in the late 1990s and early 2000s. Because the FLEX 8000 family is EOL, the original Altera die is no longer in production, but distributor stock and aftermarket channels continue to supply the part for repair. The 208-RQFP package is a standard JEDEC outline, so legacy boards can be reworked using standard hot-air and soldering stations without specialized tooling. Engineers maintaining such equipment rely on verified Site MPN stock to avoid counterfeit risk on the secondary market.
추천
Educational FPGA and Legacy Design Reference
The EPF8820ARI208-3N is a popular educational reference target for university courses teaching FPGA fundamentals. Its 672 LEs are small enough to be fully understood and manually floor-planned by students, yet large enough to implement meaningful projects such as simple CPUs, UART cores, and VGA controllers. The FLEX 8000 architecture is well-documented in textbooks and Altera's legacy application notes, making it pedagogically valuable. The 208-RQFP package exposes enough I/O pins for breadboard-friendly daughter boards, and the JTAG programming interface works with cost-effective ByteBlaster cables that universities already own. Educational labs frequently keep stocks of FLEX 8000 parts for repeated class use.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF8820ARI208-3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF8820ARI208-3 | EPF8820ARI208-2N | EPF8820ARI208-2 | EPF8820ARI208-1 | EPF8820ARC208-3N |
|---|---|---|---|---|---|---|
| Package | 208-RQFP (Heatsink PQFP) | 208-RQFP (same) | 208-RQFP (same) | 208-RQFP (same) | 208-RQFP (same) | 208-PQFP (different slug) |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 672 | 672 | 672 | 672 | 672 | 672 |
| Speed Grade | -3 | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -3 |
| Lead-Free Finish (N suffix) | Yes | No (tin-lead) | Yes | No (tin-lead) | No (tin-lead) | Yes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| I/O Voltage Tolerance | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V |
| Process Technology | CMOS (SRAM configuration) | CMOS (SRAM configuration) | CMOS (SRAM configuration) | CMOS (SRAM configuration) | CMOS (SRAM configuration) | CMOS (SRAM configuration) |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
주요 차별점
- Lead-free terminal finish with full industrial temperature range (vs EPF8820ARI208-3)
- Speed grade -3 (fastest in the family) versus slower -1/-2 grades (vs EPF8820ARI208-1)
- RQFP heatsink package for improved thermal dissipation (vs EPF8820ARC208-3N (PQFP))
설계 노트
Estimated: The EPF8820ARI208-3N requires separate VCCINT (core) and VCCIO (I/O bank) supplies per the FLEX 8000A datasheet. A common mistake is assuming a single 5V rail powers everything - mis-wiring 5V to a VCCINT pin rated at 3.3V will permanently damage the die. Engineers must consult the 208-RQFP pinout table before PCB layout and clearly separate the core and I/O power planes to avoid back-feed during hot-plug events.
The EPF8820ARI208-3N requires an external configuration source (EPC1, EPC2, or EPC16 PROM) because FLEX 8000 SRAM configuration is volatile. At every power-up the bitstream must be loaded within the datasheet-specified tCONFIG window, otherwise the device remains in tri-state. Add a power-good reset supervisor to gate the nCONFIG signal so that the FPGA does not enter an undefined state if VCCINT rises slowly. Brownout detection is recommended for industrial installations with unstable mains.
The 208-RQFP's 0.5mm lead pitch requires careful PCB layout - use soldermask-defined (SMD) pads rather than non-soldermask-defined (NSMD) pads for stronger solder joints, and add thermal reliefs on power-plane via arrays to ease hand-rework. Because the device is EOL and board rework is the primary use case, leave 2-3mm of clearance around the package for hot-air nozzle access during field repair. Decoupling capacitors (0.1uF + 10uF) should be placed within 5mm of each VCC pin pair.
Estimated: With 208 pins and 5V/3.3V configurable I/O, the EPF8820ARI208-3N's I/O banks must be carefully partitioned. Mixing 5V and 3.3V signals in the same bank violates the VCCIO absolute maximum and can trigger latch-up. Plan bank assignments before schematic capture: assign all 5V peripherals (legacy transceivers, bus buffers) to one bank with VCCIO=5V, and all 3.3V peripherals to another bank with VCCIO=3.3V. Series resistors (22-33 ohm) on clock outputs help dampen reflections on long traces.
규정 준수 정보
The 'N' suffix indicates lead-free terminal finish, consistent with RoHS Pb-free requirements, but a formal RoHS compliance certificate was not retrieved from the verified web data. Engineers should request the RoHS/REACH compliance letter from the distributor of record. AEC-Q100 is not applicable because FLEX 8000 is a general-purpose commercial/industrial FPGA family, not an automotive-qualified part.
