EPF8820ARI208-3N - 672 LEs FLEX 8000 FPGA, 208-PQFP | Intel / Altera
MPN: EPF8820ARI208-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $38.5 | $385.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $24.2 | $12,100.00 |
| 1,000 | $21.5 | $21,500.00 |
Drop-in alternatives for EPF8820ARI208-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF8820ARI208-3
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View Datasheet →EPF8820ARI208-2N
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View Datasheet →EPF8820ARI208-2
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View Datasheet →EPF8820ARI208-1
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View Datasheet →EPF8820ARC208-3N
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View Datasheet →EPF8820ARI208-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Device Sub-family | EPF8820A |
| Logic Elements (LEs) | 672 |
| Logic Array Blocks (LABs) | 16 |
| Dedicated Flip-Flops | 672 |
| Package | 208-pin PQFP / RQFP (gull-wing) |
| Terminal Form | GULL WING |
| Package Code (per Corphita) | HFQFP |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Process Technology | CMOS (SRAM-based configuration) |
| I/O Voltage Tolerance | 3.3V or 5V configurable |
| Configuration Method | Serial (PS / passive serial) or ByteBlaster JTAG |
| Number of Terminals | 208 |
| Mounting Type | Surface Mount |
EPF8820ARI208-3N hfqfp Pin Configuration Guide
Complete pinout information for EPF8820ARI208-3N (hfqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8820ARI208-3N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8820ARI208-3N is suitable for 6 applications: Legacy Industrial Glue Logic, Telecom Interface and Protocol Bridging, Test and Measurement Front-End Logic, Bus-Bridging and Protocol Conversion, Long-Life Fielded Equipment Repair, Educational FPGA and Legacy Design Reference.
Legacy Industrial Glue Logic
The EPF8820ARI208-3N fits legacy industrial glue logic where 672 logic elements are sufficient to replace multiple discrete 74LS/HC logic ICs on a control board. Its 208-RQFP package and industrial -40C to +85C temperature range let it operate inside factory-automation enclosures and outdoor cabinets. The dual 3.3V/5V configurable I/O lets it interface directly to legacy 5V PLC backplanes and modern 3.3V microcontrollers without level shifters. Because the FLEX 8000A SRAM bitstream is reloadable in-system via JTAG, field firmware revisions are possible without removing the IC from the board, which is critical for long-life industrial equipment where the original PCB layout must be preserved.
Recommended
Telecom Interface and Protocol Bridging
The EPF8820ARI208-3N suits telecom interface cards requiring low-density protocol conversion between legacy E1/T1, RS-232, RS-485, and parallel bus formats. Its 672 flip-flops and 16 LABs provide ample state-machine resources to implement UART, HDLC, and bus-arbitration logic, while the 5V-tolerant I/O banks mate directly to telecom line-interface ICs. The device's industrial temperature range handles outdoor cabinet environments, and the 208-RQFP's gull-wing leads are field-reworkable for legacy repair. Engineers maintaining installed telecom bases use the FLEX 8000 family precisely because the bitstream format is well-documented and stable across reorders, avoiding expensive board re-spins.
Recommended
Test and Measurement Front-End Logic
The EPF8820ARI208-3N works well in test-and-measurement front-end boards that need user-configurable trigger sequencers, counter/timer chains, and digital pattern generators. The 672 logic elements support mid-density state machines and parallel data paths, while the 672 flip-flops provide the register density required for high-resolution timing measurements. The 5V-tolerant I/O cells interface to legacy bench-top instruments, and the industrial temperature rating covers laboratory and field-test use. Because FLEX 8000 designs can be re-loaded in seconds via JTAG, an engineer can iterate on test patterns without swapping EPROMs, dramatically accelerating instrument bring-up.
Recommended
Bus-Bridging and Protocol Conversion
The EPF8820ARI208-3N is a natural fit for bus-bridging between PCI, ISA, VME, and proprietary backplanes in legacy embedded systems. Its 672 LEs can implement bus-state machines, address decoding, and DMA handshake logic without external TTL glue, while 5V-tolerant I/O banks mate directly to legacy 5V bus transceivers. The 208-RQFP's high pin count provides dedicated pins for each bus control signal, simplifying PCB routing and timing analysis. Industrial temperature grading ensures operation in backplane chassis with limited airflow, and the field-upgradeable SRAM configuration allows firmware patches to be pushed without depot-level rework.
Recommended
Long-Life Fielded Equipment Repair
The EPF8820ARI208-3N is specifically targeted at maintenance and repair of long-life fielded equipment - industrial controllers, military radios, medical monitors, and avionics subsystems originally designed in the late 1990s and early 2000s. Because the FLEX 8000 family is EOL, the original Altera die is no longer in production, but distributor stock and aftermarket channels continue to supply the part for repair. The 208-RQFP package is a standard JEDEC outline, so legacy boards can be reworked using standard hot-air and soldering stations without specialized tooling. Engineers maintaining such equipment rely on verified Site MPN stock to avoid counterfeit risk on the secondary market.
Recommended
Educational FPGA and Legacy Design Reference
The EPF8820ARI208-3N is a popular educational reference target for university courses teaching FPGA fundamentals. Its 672 LEs are small enough to be fully understood and manually floor-planned by students, yet large enough to implement meaningful projects such as simple CPUs, UART cores, and VGA controllers. The FLEX 8000 architecture is well-documented in textbooks and Altera's legacy application notes, making it pedagogically valuable. The 208-RQFP package exposes enough I/O pins for breadboard-friendly daughter boards, and the JTAG programming interface works with cost-effective ByteBlaster cables that universities already own. Educational labs frequently keep stocks of FLEX 8000 parts for repeated class use.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ARI208-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820ARI208-3 | EPF8820ARI208-2N | EPF8820ARI208-2 | EPF8820ARI208-1 | EPF8820ARC208-3N |
|---|---|---|---|---|---|---|
| Package | 208-RQFP (Heatsink PQFP) | 208-RQFP (same) | 208-RQFP (same) | 208-RQFP (same) | 208-RQFP (same) | 208-PQFP (different slug) |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 672 | 672 | 672 | 672 | 672 | 672 |
| Speed Grade | -3 | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -3 |
| Lead-Free Finish (N suffix) | Yes | No (tin-lead) | Yes | No (tin-lead) | No (tin-lead) | Yes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| I/O Voltage Tolerance | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V |
| Process Technology | CMOS (SRAM configuration) | CMOS (SRAM configuration) | CMOS (SRAM configuration) | CMOS (SRAM configuration) | CMOS (SRAM configuration) | CMOS (SRAM configuration) |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
Key Differentiators
- Lead-free terminal finish with full industrial temperature range (vs EPF8820ARI208-3)
- Speed grade -3 (fastest in the family) versus slower -1/-2 grades (vs EPF8820ARI208-1)
- RQFP heatsink package for improved thermal dissipation (vs EPF8820ARC208-3N (PQFP))
Design Notes
Estimated: The EPF8820ARI208-3N requires separate VCCINT (core) and VCCIO (I/O bank) supplies per the FLEX 8000A datasheet. A common mistake is assuming a single 5V rail powers everything - mis-wiring 5V to a VCCINT pin rated at 3.3V will permanently damage the die. Engineers must consult the 208-RQFP pinout table before PCB layout and clearly separate the core and I/O power planes to avoid back-feed during hot-plug events.
The EPF8820ARI208-3N requires an external configuration source (EPC1, EPC2, or EPC16 PROM) because FLEX 8000 SRAM configuration is volatile. At every power-up the bitstream must be loaded within the datasheet-specified tCONFIG window, otherwise the device remains in tri-state. Add a power-good reset supervisor to gate the nCONFIG signal so that the FPGA does not enter an undefined state if VCCINT rises slowly. Brownout detection is recommended for industrial installations with unstable mains.
The 208-RQFP's 0.5mm lead pitch requires careful PCB layout - use soldermask-defined (SMD) pads rather than non-soldermask-defined (NSMD) pads for stronger solder joints, and add thermal reliefs on power-plane via arrays to ease hand-rework. Because the device is EOL and board rework is the primary use case, leave 2-3mm of clearance around the package for hot-air nozzle access during field repair. Decoupling capacitors (0.1uF + 10uF) should be placed within 5mm of each VCC pin pair.
Estimated: With 208 pins and 5V/3.3V configurable I/O, the EPF8820ARI208-3N's I/O banks must be carefully partitioned. Mixing 5V and 3.3V signals in the same bank violates the VCCIO absolute maximum and can trigger latch-up. Plan bank assignments before schematic capture: assign all 5V peripherals (legacy transceivers, bus buffers) to one bank with VCCIO=5V, and all 3.3V peripherals to another bank with VCCIO=3.3V. Series resistors (22-33 ohm) on clock outputs help dampen reflections on long traces.
Compliance Information
The 'N' suffix indicates lead-free terminal finish, consistent with RoHS Pb-free requirements, but a formal RoHS compliance certificate was not retrieved from the verified web data. Engineers should request the RoHS/REACH compliance letter from the distributor of record. AEC-Q100 is not applicable because FLEX 8000 is a general-purpose commercial/industrial FPGA family, not an automotive-qualified part.
