EPM3512AFC256-3N - MAX 3000A CPLD 512 Macrocells | Altera
부품 번호: EPM3512AFC256-3N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.75 | $2,975.00 |
| 500 | $26.1 | $13,050.00 |
| 1,000 | $23.4 | $23,400.00 |
EPM3512AFC256-3N 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the architectural simplicity of PAL/GAL with higher density macrocell arrays and on-chip EEPROM configuration memory. Within the broader hierarchy, a CPLD belongs to programmable logic devices (PLDs) and sits alongside FPGAs, which are SRAM-based and require external boot memory; CPLDs are typically used for glue logic, bus decoding, interface bridging, and power-up sequencing functions where deterministic timing and instant-on behavior matter more than raw logic density.
Key features include the MultiVolt I/O interface supporting mixed-voltage buses (2.5 V / 3.3 V / 5.0 V) on the same die, a JTAG-based IEEE 1149.1 boundary-scan test interface, and the speed grade ‘-3’ indicating a tPD of approximately 3.5 ns and an fCNT in the 116 MHz range. The 256-ball FineLine BGA package provides compact board integration with low parasitic inductance, suitable for high-speed bus interface designs. The device supports up to 16 logic array blocks (LABs) and offers JTAG-based programming via the dedicated JTAG pins.
Typical applications include bus decoding and address latch logic in microcontroller and DSP systems, glue logic replacement for 7400-series TTL on legacy boards, power-on reset / sequencing controllers, and I/O expansion bridges between processors and peripherals. The instant-on non-volatile configuration makes the EPM3512AFC256-3N particularly suitable for industrial control, telecommunications line cards, and white-goods controllers where deterministic boot behavior is mandatory.
When designing with this device, ensure the VCCINT (3.3 V core) and VCCIO (I/O driver) rails are properly decoupled with 0.1 µF and 10 µF capacitors placed close to the package. The -3 speed grade is the slowest of the MAX 3512 family; verify timing closure carefully for clock frequencies above 80 MHz. Boundary-scan test vectors should be generated using Quartus II or the legacy MAX+PLUS II toolchain.
드롭인 대체품: EPM3512AFC256-3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM3512AFC256-3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Programming Interface, Pin-to-Pin Delay (tPD), User I/O Pins, In-System Programmability.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM3512AFC256-2N
✅ 드롭인✓ 재고 있음
$25.8 / 개
데이터시트 보기 →EPM3512AFC256-10N
✅ 드롭인✓ 재고 있음
$43.22 / 개
데이터시트 보기 →EPM3512AFC256-7N
✅ 드롭인✓ 재고 있음
$61 / 개
데이터시트 보기 →EPM3512AFC256-10
✅ 드롭인✓ 재고 있음
$17.5 / 개
데이터시트 보기 →EPM3512AFC256-2
✅ 드롭인✓ 재고 있음
$14.85 / 개
데이터시트 보기 →EPM3512AFC256-3N 최대 정격 & 전기적 특성
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| Logic Array Blocks (LABs) | 16 |
| Maximum Operating Frequency | 116.3 MHz |
| Pin-to-Pin Delay (tPD) | 3.5 ns (speed grade -3) |
| Speed Grade | -3 (slowest in family) |
| Core Supply Voltage (VCCINT) | 3.3 V |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| 패키지 | 256-ball FineLine BGA (FC-256) |
| 실장 유형 | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE Std. 1532 ISP |
| Configuration Memory | Non-volatile EEPROM |
EPM3512AFC256-3N 256-ball fineline bga (fc-256) 핀 구성 가이드
EPM3512AFC256-3N(256-ball fineline bga (fc-256) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM3512AFC256-3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM3512AFC256-3N 적합 용도: 6 애플리케이션s: Microcontroller Bus Decoder and Address Latch, Industrial Control Glue Logic Replacement, Telecommunications Line-Card Interface Bridge, Power-Up Sequencing and Reset Controller, Legacy Peripheral Emulation and I/O Expansion, DSP and Processor Bus Arbiter.
Microcontroller Bus Decoder and Address Latch
The EPM3512AFC256-3N is well suited to decode multiplexed address/data buses and generate chip-select signals for microcontroller systems. With 512 macrocells and 116.3 MHz maximum operating frequency, the device can implement complex address maps and handshake protocols that would otherwise consume dozens of 7400-series TTL gates. The MultiVolt I/O interface (2.5 V / 3.3 V / 5.0 V) allows direct connection to legacy 5 V peripheral buses as well as modern 3.3 V MCUs without external level shifters. The non-volatile EEPROM configuration ensures deterministic boot behavior with no FPGA-style boot delay.
추천
Industrial Control Glue Logic Replacement
Industrial PLCs and motor-control boards often require large amounts of discrete glue logic that the EPM3512AFC256-3N can consolidate into a single chip. The 256-ball FineLine BGA package fits within a 17 mm × 17 mm footprint, replacing dozens of SOIC and TSSOP packages and improving long-term reliability by eliminating solder-joint count. The industrial operating temperature range (when specified) and EEPROM-based configuration make the device tolerant to vibration and power-line disturbances typical of factory-floor installations.
추천
Telecommunications Line-Card Interface Bridge
Telecommunications line cards require deterministic, low-latency glue logic between network processors, PHYs, and framer ICs. The EPM3512AFC256-3N’s 3.5 ns pin-to-pin delay and 116.3 MHz maximum frequency comfortably handle 77.76 MHz STS-12/STM-4 overhead processing. The IEEE 1149.1 JTAG boundary-scan interface simplifies board-level testing on densely populated line cards, and the non-volatile EEPROM configuration eliminates the boot-time risk associated with SRAM-based FPGAs in carrier-grade equipment.
추천
Power-Up Sequencing and Reset Controller
Multi-rail systems require strict power-up and power-down sequencing to prevent latch-up and bus-contention damage. The EPM3512AFC256-3N can implement a state-machine-based sequencer that monitors each rail’s PG (power-good) signal and asserts enable signals in the correct order with programmable delay taps. The 512-macrocell capacity allows sequencing of 8-16 rails simultaneously, while the non-volatile configuration ensures the sequencer is active before any MCU or ASIC boots, eliminating the classic ‘MCU boots before rails are stable’ failure mode.
추천
Legacy Peripheral Emulation and I/O Expansion
Many long-life-cycle embedded designs require emulation of legacy peripherals that have reached end-of-life. The EPM3512AFC256-3N can re-implement parallel ports, ISA bus interfaces, and proprietary peripheral protocols in a single programmable device, extending product lifecycles without PCB redesign. The MultiVolt I/O and 5 V tolerance allow direct connection to legacy buses, and the FC-256 BGA package supports both 3.3 V and 5 V mixed-voltage environments that are common in industrial retrofits and medical equipment.
추천
DSP and Processor Bus Arbiter
Multi-master systems with shared memory buses require deterministic arbitration logic that software cannot reliably provide. The EPM3512AFC256-3N implements fixed-priority or round-robin arbiters with sub-3.5 ns decision latency, ensuring no bus starvation even under heavy DMA traffic from DSPs and PCI peripherals. The 512-macrocell capacity supports complex arbitration trees with burst-mode awareness, and the JTAG interface simplifies bring-up debugging through Quartus II’s logic-analyzer SignalTap integration.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM3512AFC256-3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM3512AFC256-2N | EPM3512AFC256-10N | EPM3512AFC256-7N | EPM3512AFC256-10 | EPM3512AFC256-2 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-ball FineLine BGA (FC-256) | 256-ball FineLine BGA (FC-256) - same | 256-ball FineLine BGA (FC-256) - same | 256-ball FineLine BGA (FC-256) - same | 256-ball FineLine BGA (FC-256) - same | 256-ball FineLine BGA (FC-256) - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Pin-to-Pin Delay (tPD) | 3.5 ns | ~3 ns (faster) | ~3.5 ns (fastest grade) | ~7.5 ns (slower) | ~3.5 ns (fastest, non-N finish) | ~3 ns (faster, non-N finish) |
| Maximum Frequency | 116.3 MHz | >116.3 MHz | >116.3 MHz | ~100 MHz | >116.3 MHz | >116.3 MHz |
| Core Voltage (VCCINT) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lead-Free Finish | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (non-N finish) | No (non-N finish) |
주요 차별점
- Highest-density member of the legacy MAX 3000A family (vs EPM3256AFC256-10N)
- Slowest commercial speed grade in the family (vs EPM3512AFC256-10N)
- MultiVolt I/O supports 5 V mixed-voltage buses without level shifters (vs EPM2210F256C5N (MAX V))
- Non-volatile EEPROM configuration eliminates boot delay (vs SRAM-based FPGAs)
설계 노트
The EPM3512AFC256-3N requires two separate supply rails: VCCINT (3.3 V core) and VCCIO (2.5 V, 3.3 V, or 5.0 V I/O drivers). Per the MAX 3000A datasheet, place a 0.1 µF decoupling capacitor within 3 mm of each VCCINT/VCCIO ball and bulk 10 µF tantalum or ceramic capacitors on each supply rail near the device. Power sequencing is not required: VCCIO can be applied before, simultaneously with, or after VCCINT without damaging the device, although logic behavior during partial-power conditions is undefined.
The 256-ball FineLine BGA package has a 1.0 mm ball pitch requiring 4-6 layer PCB construction with microvia or via-in-pad technology for reliable assembly. Per IPC-7351 guidelines, the PCB land-pad diameter should be 0.45 mm with a non-solder-mask-defined (NSMD) pad geometry for best joint reliability. Keep all signal traces on inner layers for controlled impedance routing of high-speed buses, and provide a continuous ground plane directly beneath the BGA to minimize power-loop inductance.
Estimated: I/O bank assignment in MAX 3000A devices must match VCCIO supply voltage — mixing 5 V and 3.3 V signals on the same I/O bank will damage the device. The JTAG pins (TCK, TMS, TDI, TDO, TRST) must be pulled to defined logic levels through 10 kΩ resistors; floating TCK or TMS will cause unpredictable JTAG state-machine behavior. The ‘N’ suffix indicates lead-free finish; the non-‘N’ variants (EPM3512AFC256-2, -10) use SnPb solder and are not RoHS-compliant.
Route JTAG signals away from high-speed clock and data lines to avoid crosstalk during in-system programming. The TRST pin should be tied low through a 1 kΩ resistor for normal operation, or driven by the JTAG programmer during ISP sessions. The dedicated input clock pins (GCLK1, GCLK2) have lower skew than general-purpose I/O and should be used for all global clock distribution within the design.
규정 준수 정보
The ‘N’ suffix denotes lead-free / Pb-free finish consistent with RoHS-compliant assembly, but explicit RoHS and REACH documentation was not available in the verified web data as of 2026-09-12. Engineers should request the Material Declaration Sheet from Intel FPGA support for compliance-sensitive designs. Not AEC-Q100 qualified; the MAX 3000A family is not marketed for automotive applications.
