EPM3512AFC256-3N - MAX 3000A CPLD 512 Macrocells | Altera
N.º da peça: EPM3512AFC256-3N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.75 | $2.975,00 |
| 500 | $26.1 | $13.050,00 |
| 1.000 | $23.4 | $23.400,00 |
EPM3512AFC256-3N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the architectural simplicity of PAL/GAL with higher density macrocell arrays and on-chip EEPROM configuration memory. Within the broader hierarchy, a CPLD belongs to programmable logic devices (PLDs) and sits alongside FPGAs, which are SRAM-based and require external boot memory; CPLDs are typically used for glue logic, bus decoding, interface bridging, and power-up sequencing functions where deterministic timing and instant-on behavior matter more than raw logic density.
Key features include the MultiVolt I/O interface supporting mixed-voltage buses (2.5 V / 3.3 V / 5.0 V) on the same die, a JTAG-based IEEE 1149.1 boundary-scan test interface, and the speed grade ‘-3’ indicating a tPD of approximately 3.5 ns and an fCNT in the 116 MHz range. The 256-ball FineLine BGA package provides compact board integration with low parasitic inductance, suitable for high-speed bus interface designs. The device supports up to 16 logic array blocks (LABs) and offers JTAG-based programming via the dedicated JTAG pins.
Typical applications include bus decoding and address latch logic in microcontroller and DSP systems, glue logic replacement for 7400-series TTL on legacy boards, power-on reset / sequencing controllers, and I/O expansion bridges between processors and peripherals. The instant-on non-volatile configuration makes the EPM3512AFC256-3N particularly suitable for industrial control, telecommunications line cards, and white-goods controllers where deterministic boot behavior is mandatory.
When designing with this device, ensure the VCCINT (3.3 V core) and VCCIO (I/O driver) rails are properly decoupled with 0.1 µF and 10 µF capacitors placed close to the package. The -3 speed grade is the slowest of the MAX 3512 family; verify timing closure carefully for clock frequencies above 80 MHz. Boundary-scan test vectors should be generated using Quartus II or the legacy MAX+PLUS II toolchain.
Alternativas drop-in para EPM3512AFC256-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM3512AFC256-3N (mesmo formato e footprint) — diferindo em Package, Programming Interface, Pin-to-Pin Delay (tPD), User I/O Pins, In-System Programmability.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM3512AFC256-2N
✅ Drop-In✓ Em estoque
$25.8 / unidade
Ver ficha técnica →EPM3512AFC256-10N
✅ Drop-In✓ Em estoque
$43.22 / unidade
Ver ficha técnica →EPM3512AFC256-7N
✅ Drop-In✓ Em estoque
$61 / unidade
Ver ficha técnica →EPM3512AFC256-10
✅ Drop-In✓ Em estoque
$17.5 / unidade
Ver ficha técnica →EPM3512AFC256-2
✅ Drop-In✓ Em estoque
$14.85 / unidade
Ver ficha técnica →EPM3512AFC256-3N Classificações máximas e características elétricas
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| Logic Array Blocks (LABs) | 16 |
| Maximum Operating Frequency | 116.3 MHz |
| Pin-to-Pin Delay (tPD) | 3.5 ns (speed grade -3) |
| Speed Grade | -3 (slowest in family) |
| Core Supply Voltage (VCCINT) | 3.3 V |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Encapsulamento | 256-ball FineLine BGA (FC-256) |
| Tipo de montagem | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) / IEEE Std. 1532 ISP |
| Configuration Memory | Non-volatile EEPROM |
Guia de Configuração de Pinos do EPM3512AFC256-3N 256-ball fineline bga (fc-256)
Configuração de pinos para EPM3512AFC256-3N (pacote 256-ball fineline bga (fc-256)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPM3512AFC256-3N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPM3512AFC256-3N é adequado para 6 aplicaçãos: Microcontroller Bus Decoder and Address Latch, Industrial Control Glue Logic Replacement, Telecommunications Line-Card Interface Bridge, Power-Up Sequencing and Reset Controller, Legacy Peripheral Emulation and I/O Expansion, DSP and Processor Bus Arbiter.
Microcontroller Bus Decoder and Address Latch
The EPM3512AFC256-3N is well suited to decode multiplexed address/data buses and generate chip-select signals for microcontroller systems. With 512 macrocells and 116.3 MHz maximum operating frequency, the device can implement complex address maps and handshake protocols that would otherwise consume dozens of 7400-series TTL gates. The MultiVolt I/O interface (2.5 V / 3.3 V / 5.0 V) allows direct connection to legacy 5 V peripheral buses as well as modern 3.3 V MCUs without external level shifters. The non-volatile EEPROM configuration ensures deterministic boot behavior with no FPGA-style boot delay.
Recomendado
Industrial Control Glue Logic Replacement
Industrial PLCs and motor-control boards often require large amounts of discrete glue logic that the EPM3512AFC256-3N can consolidate into a single chip. The 256-ball FineLine BGA package fits within a 17 mm × 17 mm footprint, replacing dozens of SOIC and TSSOP packages and improving long-term reliability by eliminating solder-joint count. The industrial operating temperature range (when specified) and EEPROM-based configuration make the device tolerant to vibration and power-line disturbances typical of factory-floor installations.
Recomendado
Telecommunications Line-Card Interface Bridge
Telecommunications line cards require deterministic, low-latency glue logic between network processors, PHYs, and framer ICs. The EPM3512AFC256-3N’s 3.5 ns pin-to-pin delay and 116.3 MHz maximum frequency comfortably handle 77.76 MHz STS-12/STM-4 overhead processing. The IEEE 1149.1 JTAG boundary-scan interface simplifies board-level testing on densely populated line cards, and the non-volatile EEPROM configuration eliminates the boot-time risk associated with SRAM-based FPGAs in carrier-grade equipment.
Recomendado
Power-Up Sequencing and Reset Controller
Multi-rail systems require strict power-up and power-down sequencing to prevent latch-up and bus-contention damage. The EPM3512AFC256-3N can implement a state-machine-based sequencer that monitors each rail’s PG (power-good) signal and asserts enable signals in the correct order with programmable delay taps. The 512-macrocell capacity allows sequencing of 8-16 rails simultaneously, while the non-volatile configuration ensures the sequencer is active before any MCU or ASIC boots, eliminating the classic ‘MCU boots before rails are stable’ failure mode.
Recomendado
Legacy Peripheral Emulation and I/O Expansion
Many long-life-cycle embedded designs require emulation of legacy peripherals that have reached end-of-life. The EPM3512AFC256-3N can re-implement parallel ports, ISA bus interfaces, and proprietary peripheral protocols in a single programmable device, extending product lifecycles without PCB redesign. The MultiVolt I/O and 5 V tolerance allow direct connection to legacy buses, and the FC-256 BGA package supports both 3.3 V and 5 V mixed-voltage environments that are common in industrial retrofits and medical equipment.
Recomendado
DSP and Processor Bus Arbiter
Multi-master systems with shared memory buses require deterministic arbitration logic that software cannot reliably provide. The EPM3512AFC256-3N implements fixed-priority or round-robin arbiters with sub-3.5 ns decision latency, ensuring no bus starvation even under heavy DMA traffic from DSPs and PCI peripherals. The 512-macrocell capacity supports complex arbitration trees with burst-mode awareness, and the JTAG interface simplifies bring-up debugging through Quartus II’s logic-analyzer SignalTap integration.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM3512AFC256-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM3512AFC256-2N | EPM3512AFC256-10N | EPM3512AFC256-7N | EPM3512AFC256-10 | EPM3512AFC256-2 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-ball FineLine BGA (FC-256) | 256-ball FineLine BGA (FC-256) - same | 256-ball FineLine BGA (FC-256) - same | 256-ball FineLine BGA (FC-256) - same | 256-ball FineLine BGA (FC-256) - same | 256-ball FineLine BGA (FC-256) - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Pin-to-Pin Delay (tPD) | 3.5 ns | ~3 ns (faster) | ~3.5 ns (fastest grade) | ~7.5 ns (slower) | ~3.5 ns (fastest, non-N finish) | ~3 ns (faster, non-N finish) |
| Maximum Frequency | 116.3 MHz | >116.3 MHz | >116.3 MHz | ~100 MHz | >116.3 MHz | >116.3 MHz |
| Core Voltage (VCCINT) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lead-Free Finish | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (non-N finish) | No (non-N finish) |
Principais diferenciais
- Highest-density member of the legacy MAX 3000A family (vs EPM3256AFC256-10N)
- Slowest commercial speed grade in the family (vs EPM3512AFC256-10N)
- MultiVolt I/O supports 5 V mixed-voltage buses without level shifters (vs EPM2210F256C5N (MAX V))
- Non-volatile EEPROM configuration eliminates boot delay (vs SRAM-based FPGAs)
Notas de projeto
The EPM3512AFC256-3N requires two separate supply rails: VCCINT (3.3 V core) and VCCIO (2.5 V, 3.3 V, or 5.0 V I/O drivers). Per the MAX 3000A datasheet, place a 0.1 µF decoupling capacitor within 3 mm of each VCCINT/VCCIO ball and bulk 10 µF tantalum or ceramic capacitors on each supply rail near the device. Power sequencing is not required: VCCIO can be applied before, simultaneously with, or after VCCINT without damaging the device, although logic behavior during partial-power conditions is undefined.
The 256-ball FineLine BGA package has a 1.0 mm ball pitch requiring 4-6 layer PCB construction with microvia or via-in-pad technology for reliable assembly. Per IPC-7351 guidelines, the PCB land-pad diameter should be 0.45 mm with a non-solder-mask-defined (NSMD) pad geometry for best joint reliability. Keep all signal traces on inner layers for controlled impedance routing of high-speed buses, and provide a continuous ground plane directly beneath the BGA to minimize power-loop inductance.
Estimated: I/O bank assignment in MAX 3000A devices must match VCCIO supply voltage — mixing 5 V and 3.3 V signals on the same I/O bank will damage the device. The JTAG pins (TCK, TMS, TDI, TDO, TRST) must be pulled to defined logic levels through 10 kΩ resistors; floating TCK or TMS will cause unpredictable JTAG state-machine behavior. The ‘N’ suffix indicates lead-free finish; the non-‘N’ variants (EPM3512AFC256-2, -10) use SnPb solder and are not RoHS-compliant.
Route JTAG signals away from high-speed clock and data lines to avoid crosstalk during in-system programming. The TRST pin should be tied low through a 1 kΩ resistor for normal operation, or driven by the JTAG programmer during ISP sessions. The dedicated input clock pins (GCLK1, GCLK2) have lower skew than general-purpose I/O and should be used for all global clock distribution within the design.
Informações de conformidade
The ‘N’ suffix denotes lead-free / Pb-free finish consistent with RoHS-compliant assembly, but explicit RoHS and REACH documentation was not available in the verified web data as of 2026-09-12. Engineers should request the Material Declaration Sheet from Intel FPGA support for compliance-sensitive designs. Not AEC-Q100 qualified; the MAX 3000A family is not marketed for automotive applications.
