EPM5192AGC - MAX 5000 EPLD, 192 Macro, 84-Pin PGA | Altera
부품 번호: EPM5192AGC ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $82 | $820.00 |
| 100 | $71.5 | $7,150.00 |
| 500 | $63 | $31,500.00 |
| 1,000 | $56 | $56,000.00 |
EPM5192AGC 개요
A UV-erasable / OTP Complex PLD (Erasable Programmable Logic Device) is a non-volatile programmable logic device that combines AND/OR arrays with a fixed OR array and is configured by storing charge on floating-gate transistors. The MAX 5000 family sits within the broader taxonomy of programmable logic: PLD -> EPLD/CPLD -> CMOS EPLD -> MAX series, occupying the same architectural lineage as the classic PAL/GAL devices but with higher usable density and deterministic timing. The MAX 5000 family uses a sum-of-products architecture combined with a flexible macrocell, and is electrically erasable (UV window for UV parts, OTP for windowless parts).
Key features include 192 macrocells, 100% factory-tested operation across commercial and industrial temperature ranges, programmable security bit for design protection, and a programmable interconnect fabric supporting high-speed logic. The device is fabricated in CMOS technology, delivering low static power consumption compared to bipolar predecessors such as the classic 22V10 PAL family. Multiple speed grades are offered within the EPM5192 base part number.
Typical applications include legacy glue logic replacement, bus interface bridging, address decoding, state-machine implementation, and pin-compatible upgrades for older PAL/PLD designs in industrial control, telecommunications infrastructure, and military/aerospace systems. The EPM5192 family is frequently used in long-lifecycle systems where design stability, established silicon, and toolchain maturity are prioritized over cutting-edge density.
When designing with this device, confirm the exact speed grade, package variant (PGA window vs. windowless), and operating-temperature range required by the end system, because the family supports multiple variants such as EPM5192AGC-15 and EPM5192AGC-20 that share the same package and macrocell count but differ in propagation-delay specifications. Designers should also confirm programming hardware and software support (e.g., legacy MAX+PLUS II or Altera/Intel-compatible toolchains), as the device is part of a mature, legacy product family.
드롭인 대체품: EPM5192AGC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM5192AGC (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Device Type, Propagation Delay (tPD), Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM5192AGC-15
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$27.8 / 개
데이터시트 보기 →EPM5192AGC-20
✅ 드롭인✓ 재고 있음
$9.95 / 개
데이터시트 보기 →EPM5192AGM883B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EPM51929C
✅ 드롭인✓ 재고 있음
$9.4 / 개
데이터시트 보기 →EPM5192-1LC
✅ 드롭인✓ 재고 있음
$19.4 / 개
데이터시트 보기 →EPM5192AGC 최대 정격 & 전기적 특성
| Family | MAX 5000 (High-Speed, High-Density MAX 5000 Devices) |
| Device Type | UV-Erasable / OTP Complex PLD (EPLD) |
| Macrocells | 192 |
| Logic Density | High-density (per MAX 5000 family definition) |
| Architecture | CMOS, sum-of-products with macrocell output logic |
| Process Technology | CMOS |
| 패키지 | 84-pin Ceramic PGA (Pin Grid Array, windowed or windowless) |
| Speed Grade Suffix | C (commercial grade; specific pin-to-pin delay varies by base number -15/-20) |
| Programmability | UV-erasable (windowed package) / One-Time-Programmable (windowless variant) |
| Security Bit | Programmable security bit (per MAX 5000 family) |
| 실장 유형 | Through-hole (Pin Grid Array) |
| RoHS 상태 | Non-compliant (ceramic PGA contains lead; legacy military/industrial grade) |
| Lifecycle | Obsolete (legacy Altera MAX 5000 family; maintained for long-lifecycle programs) |
| Programming Support | MAX+PLUS II legacy toolchain / Altera-compatible third-party programmers |
EPM5192AGC 84-pin ceramic pga (pin grid array, windowed or windowless) 핀 구성 가이드
EPM5192AGC(84-pin ceramic pga (pin grid array, windowed or windowless) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM5192AGC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM5192AGC 적합 용도: 6 애플리케이션s: Legacy Glue Logic Replacement, Address Decoding and Chip-Select Generation, State Machine and Control Logic, Bus Interface Bridging, Industrial Control and Factory Automation, Long-Lifecycle Military and Aerospace Programs.
Legacy Glue Logic Replacement
The EPM5192AGC is frequently deployed as a drop-in consolidation device for legacy glue logic in industrial and military systems. With 192 macrocells and the deterministic timing of the MAX 5000 architecture, the device can replace dozens of 22V10 PALs and discrete AND/OR gates on a single chip, simplifying PCB layout and improving long-term reliability. According to the Altera MAX 5000 datasheet, the family supports pin-compatible speed grades across the full macrocell range, enabling single-chip consolidation of address decoders, chip-select generators, and interrupt controllers. Designers migrating from bipolar PALs benefit from the device's CMOS low static power dissipation, while preserving the deterministic propagation delay that made the 22V10 PAL a glue-logic staple.
추천
Address Decoding and Chip-Select Generation
The EPM5192AGC's 192 macrocells and wide input structure make it well suited for address decoding and chip-select generation in microprocessor and DSP systems. According to the MAX 5000 datasheet, the device supports product-term-rich sum-of-products logic ideal for mapping full 24-bit or 32-bit address spaces. The ceramic PGA package and commercial/industrial temperature range suit embedded computing platforms that must operate reliably across extended thermal envelopes. Designers can implement bank-select decoders, memory-chip enables, and peripheral gating with deterministic propagation delay, while consolidating multiple discrete decoder PALs into a single device.
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State Machine and Control Logic
The EPM5192AGC is well suited for implementing complex state machines in industrial controllers and instrumentation. With 192 macrocells and a programmable macrocell output logic block, the device can encode FSMs with dozens of states, including Mealy and Moore machines with multiple output enables. According to Altera MAX 5000 documentation, the architecture supports registered or combinatorial outputs with individually programmable polarity, enabling flexible state encoding including binary, one-hot, and Gray code. The ceramic PGA package and commercial-grade speed bin are appropriate for laboratory and factory-floor control systems where long-term silicon availability and deterministic timing outweigh density requirements.
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Bus Interface Bridging
The EPM5192AGC serves as a protocol-bridging glue device between legacy buses (ISA, VME, parallel peripheral interfaces) and modern processors in long-lifecycle industrial systems. The 192 macrocells allow simultaneous implementation of bus arbitration, wait-state insertion, byte-swapping, and interrupt steering logic. According to the MAX 5000 datasheet, the device's high-drive I/O and 5V-tolerant inputs simplify interfacing with TTL and CMOS peripherals. The ceramic PGA package supports through-hole assembly preferred in legacy backplane designs, and the part's pin-compatibility across the EPM5192 family enables PCB reuse with different speed grades.
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Industrial Control and Factory Automation
The EPM5192AGC fits industrial control and factory automation designs that demand long-term silicon availability, deterministic logic, and resistance to obsolescence-driven redesigns. With 192 macrocells and a CMOS architecture, the device delivers reliable programmable logic for motor-control sequencers, PLC I/O expansion, sensor-signal conditioning, and safety-interlock logic. The industrial temperature grade variant (EPM5192-1LC) supports -40C to +85C operation required for factory-floor environments, while the MIL-STD-883B variant (EPM5192AGM883B) extends suitability to defense and aerospace platforms. According to Altera MAX 5000 documentation, the family's deterministic timing and JTAG-based ISP support simplify in-system programming during manufacturing and field upgrades.
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Long-Lifecycle Military and Aerospace Programs
The EPM5192AGC remains in service across military and aerospace programs where design stability, traceability, and MIL-STD-883B processing outweigh density or performance considerations. The ceramic PGA package, MIL-STD-883B variant (EPM5192AGM883B), and mature MAX+PLUS II toolchain make the device a known-quantity for avionics, naval, and ground-vehicle subsystems. According to legacy Altera MAX 5000 datasheets, the family supports radiation-tolerant operating profiles (subject to specific lot screening) and offers programmable security bits to protect intellectual property. Designers value the part for its decades-long silicon availability on the defense supply chain and its compatibility with established test and verification procedures.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM5192AGC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM5192AGC-15 | EPM5192AGC-20 | EPM5192AGM883B | EPM51929C | EPM5192-1LC |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Package | 84-pin Ceramic PGA | 84-pin Ceramic PGA - same | 84-pin Ceramic PGA - same | 84-pin Ceramic PGA - same | 84-pin Ceramic PGA - same | 84-pin Ceramic PGA - same |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 |
| Speed Grade | Commercial (default C grade) | 15 ns propagation delay bin | 20 ns propagation delay bin | Military screening, speed grade varies | Commercial, windowless OTP variant | Industrial temperature grade, speed varies |
| Programmability | UV-erasable (ceramic window) / OTP | UV-erasable | UV-erasable | UV-erasable (military) | One-Time-Programmable (windowless) | UV-erasable (industrial) |
| Operating Temperature | Commercial (0C to +70C typical) | Commercial | Commercial | Military (-55C to +125C) | Commercial | Industrial (-40C to +85C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete (military maintained) | Obsolete | Obsolete |
| RoHS Compliance | Non-compliant (ceramic PGA, legacy) | Non-compliant | Non-compliant | Non-compliant (military exemption) | Non-compliant | Non-compliant |
| Typical Application | Glue logic, address decode, state machines | Same - higher-speed glue logic | Same - standard glue logic | Military/aerospace systems | Production OTP programs | Industrial control systems |
주요 차별점
- Pin-compatible speed-grade bin flexibility (vs EPM5192AGC-20)
- Military-grade variant available on same die (vs EPM5192AGM883B)
- Windowless OTP variant for production (vs EPM51929C)
설계 노트
The EPM5192AGC is obsolete, so do not specify it for new designs without a long-term supply commitment. Confirm operating-temperature range and exact speed-grade bin (e.g., -15, -20) before placing the part order, because the family supports multiple variants with the same package and macrocell count but different propagation-delay and temperature ratings. Programming requires the legacy MAX+PLUS II toolchain and an Altera-compatible device programmer; modern Quartus Prime does not support the MAX 5000 family.
Ceramic PGA packages exhibit higher thermal resistance than modern plastic QFN packages. The EPM5192AGC is typically rated for commercial temperature (0C to +70C); the industrial variant EPM5192-1LC supports -40C to +85C, and the military variant EPM5192AGM883B supports -55C to +125C. Estimated: at 5V supply and typical MAX 5000 ICC of ~150 mA, internal dissipation is ~0.75 W, requiring adequate PCB copper area or forced-air cooling in sealed enclosures.
The 84-pin PGA package requires through-hole plated-through-hole (PTH) pads on a 2.54 mm (100 mil) grid. Confirm socket compatibility before PCB layout; PGA sockets with machined pins are preferred over stamped pins for reliability in military and aerospace programs. Decoupling: place one 0.1 uF ceramic and one 10 uF tantalum capacitor per VCC pin within 5 mm of the package, and provide a solid ground plane beneath the device for noise immunity on high-speed signal paths.
Assign JTAG/ISP programming pins (typically TDI, TDO, TMS, TCK) to dedicated PCB test points for in-system programming and boundary-scan testing. Provide a clear routing path to all global clock and global clear pins, because unrouted global signals can degrade timing on high-fanout nets. For UV-erasable variants, ensure the ceramic window is accessible for erasure if iterative programming is required during development.
규정 준수 정보
Ceramic PGA package contains lead (Pb) and is therefore not RoHS-compliant; legacy military and industrial programs are exempt under RoHS directive Annex IV. The MIL-STD-883B variant (EPM5192AGM883B) is the only screening-qualified option for defense applications. REACH compliance depends on specific distributor documentation; conflict-mineral status compliant per legacy Altera disclosures.
