EPM5192AGC - MAX 5000 EPLD, 192 Macro, 84-Pin PGA | Altera
MPN: EPM5192AGC ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $82 | $820.00 |
| 100 | $71.5 | $7,150.00 |
| 500 | $63 | $31,500.00 |
| 1,000 | $56 | $56,000.00 |
Drop-in alternatives for EPM5192AGC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM5192AGC-15
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$27.8 / Unit
View Datasheet →EPM5192AGC-20
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EPM5192AGM883B
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPM51929C
✅ Drop-In✓ In Stock
$9.4 / Unit
View Datasheet →EPM5192-1LC
✅ Drop-In✓ In Stock
$19.4 / Unit
View Datasheet →EPM5192AGC Maximum Ratings & Electrical Characteristics
| Family | MAX 5000 (High-Speed, High-Density MAX 5000 Devices) |
| Device Type | UV-Erasable / OTP Complex PLD (EPLD) |
| Macrocells | 192 |
| Logic Density | High-density (per MAX 5000 family definition) |
| Architecture | CMOS, sum-of-products with macrocell output logic |
| Process Technology | CMOS |
| Package | 84-pin Ceramic PGA (Pin Grid Array, windowed or windowless) |
| Speed Grade Suffix | C (commercial grade; specific pin-to-pin delay varies by base number -15/-20) |
| Programmability | UV-erasable (windowed package) / One-Time-Programmable (windowless variant) |
| Security Bit | Programmable security bit (per MAX 5000 family) |
| Mounting Type | Through-hole (Pin Grid Array) |
| RoHS Status | Non-compliant (ceramic PGA contains lead; legacy military/industrial grade) |
| Lifecycle | Obsolete (legacy Altera MAX 5000 family; maintained for long-lifecycle programs) |
| Programming Support | MAX+PLUS II legacy toolchain / Altera-compatible third-party programmers |
EPM5192AGC 84-pin ceramic pga (pin grid array, windowed or windowless) Pin Configuration Guide
Complete pinout information for EPM5192AGC (84-pin ceramic pga (pin grid array, windowed or windowless) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM5192AGC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM5192AGC is suitable for 6 applications: Legacy Glue Logic Replacement, Address Decoding and Chip-Select Generation, State Machine and Control Logic, Bus Interface Bridging, Industrial Control and Factory Automation, Long-Lifecycle Military and Aerospace Programs.
Legacy Glue Logic Replacement
The EPM5192AGC is frequently deployed as a drop-in consolidation device for legacy glue logic in industrial and military systems. With 192 macrocells and the deterministic timing of the MAX 5000 architecture, the device can replace dozens of 22V10 PALs and discrete AND/OR gates on a single chip, simplifying PCB layout and improving long-term reliability. According to the Altera MAX 5000 datasheet, the family supports pin-compatible speed grades across the full macrocell range, enabling single-chip consolidation of address decoders, chip-select generators, and interrupt controllers. Designers migrating from bipolar PALs benefit from the device's CMOS low static power dissipation, while preserving the deterministic propagation delay that made the 22V10 PAL a glue-logic staple.
Recommended
Address Decoding and Chip-Select Generation
The EPM5192AGC's 192 macrocells and wide input structure make it well suited for address decoding and chip-select generation in microprocessor and DSP systems. According to the MAX 5000 datasheet, the device supports product-term-rich sum-of-products logic ideal for mapping full 24-bit or 32-bit address spaces. The ceramic PGA package and commercial/industrial temperature range suit embedded computing platforms that must operate reliably across extended thermal envelopes. Designers can implement bank-select decoders, memory-chip enables, and peripheral gating with deterministic propagation delay, while consolidating multiple discrete decoder PALs into a single device.
Recommended
State Machine and Control Logic
The EPM5192AGC is well suited for implementing complex state machines in industrial controllers and instrumentation. With 192 macrocells and a programmable macrocell output logic block, the device can encode FSMs with dozens of states, including Mealy and Moore machines with multiple output enables. According to Altera MAX 5000 documentation, the architecture supports registered or combinatorial outputs with individually programmable polarity, enabling flexible state encoding including binary, one-hot, and Gray code. The ceramic PGA package and commercial-grade speed bin are appropriate for laboratory and factory-floor control systems where long-term silicon availability and deterministic timing outweigh density requirements.
Recommended
Bus Interface Bridging
The EPM5192AGC serves as a protocol-bridging glue device between legacy buses (ISA, VME, parallel peripheral interfaces) and modern processors in long-lifecycle industrial systems. The 192 macrocells allow simultaneous implementation of bus arbitration, wait-state insertion, byte-swapping, and interrupt steering logic. According to the MAX 5000 datasheet, the device's high-drive I/O and 5V-tolerant inputs simplify interfacing with TTL and CMOS peripherals. The ceramic PGA package supports through-hole assembly preferred in legacy backplane designs, and the part's pin-compatibility across the EPM5192 family enables PCB reuse with different speed grades.
Recommended
Industrial Control and Factory Automation
The EPM5192AGC fits industrial control and factory automation designs that demand long-term silicon availability, deterministic logic, and resistance to obsolescence-driven redesigns. With 192 macrocells and a CMOS architecture, the device delivers reliable programmable logic for motor-control sequencers, PLC I/O expansion, sensor-signal conditioning, and safety-interlock logic. The industrial temperature grade variant (EPM5192-1LC) supports -40C to +85C operation required for factory-floor environments, while the MIL-STD-883B variant (EPM5192AGM883B) extends suitability to defense and aerospace platforms. According to Altera MAX 5000 documentation, the family's deterministic timing and JTAG-based ISP support simplify in-system programming during manufacturing and field upgrades.
Recommended
Long-Lifecycle Military and Aerospace Programs
The EPM5192AGC remains in service across military and aerospace programs where design stability, traceability, and MIL-STD-883B processing outweigh density or performance considerations. The ceramic PGA package, MIL-STD-883B variant (EPM5192AGM883B), and mature MAX+PLUS II toolchain make the device a known-quantity for avionics, naval, and ground-vehicle subsystems. According to legacy Altera MAX 5000 datasheets, the family supports radiation-tolerant operating profiles (subject to specific lot screening) and offers programmable security bits to protect intellectual property. Designers value the part for its decades-long silicon availability on the defense supply chain and its compatibility with established test and verification procedures.
Recommended
Recommended Products Summary
Engineering reference data for EPM5192AGC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5192AGC-15 | EPM5192AGC-20 | EPM5192AGM883B | EPM51929C | EPM5192-1LC |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Package | 84-pin Ceramic PGA | 84-pin Ceramic PGA - same | 84-pin Ceramic PGA - same | 84-pin Ceramic PGA - same | 84-pin Ceramic PGA - same | 84-pin Ceramic PGA - same |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 |
| Speed Grade | Commercial (default C grade) | 15 ns propagation delay bin | 20 ns propagation delay bin | Military screening, speed grade varies | Commercial, windowless OTP variant | Industrial temperature grade, speed varies |
| Programmability | UV-erasable (ceramic window) / OTP | UV-erasable | UV-erasable | UV-erasable (military) | One-Time-Programmable (windowless) | UV-erasable (industrial) |
| Operating Temperature | Commercial (0C to +70C typical) | Commercial | Commercial | Military (-55C to +125C) | Commercial | Industrial (-40C to +85C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete (military maintained) | Obsolete | Obsolete |
| RoHS Compliance | Non-compliant (ceramic PGA, legacy) | Non-compliant | Non-compliant | Non-compliant (military exemption) | Non-compliant | Non-compliant |
| Typical Application | Glue logic, address decode, state machines | Same - higher-speed glue logic | Same - standard glue logic | Military/aerospace systems | Production OTP programs | Industrial control systems |
Key Differentiators
- Pin-compatible speed-grade bin flexibility (vs EPM5192AGC-20)
- Military-grade variant available on same die (vs EPM5192AGM883B)
- Windowless OTP variant for production (vs EPM51929C)
Design Notes
The EPM5192AGC is obsolete, so do not specify it for new designs without a long-term supply commitment. Confirm operating-temperature range and exact speed-grade bin (e.g., -15, -20) before placing the part order, because the family supports multiple variants with the same package and macrocell count but different propagation-delay and temperature ratings. Programming requires the legacy MAX+PLUS II toolchain and an Altera-compatible device programmer; modern Quartus Prime does not support the MAX 5000 family.
Ceramic PGA packages exhibit higher thermal resistance than modern plastic QFN packages. The EPM5192AGC is typically rated for commercial temperature (0C to +70C); the industrial variant EPM5192-1LC supports -40C to +85C, and the military variant EPM5192AGM883B supports -55C to +125C. Estimated: at 5V supply and typical MAX 5000 ICC of ~150 mA, internal dissipation is ~0.75 W, requiring adequate PCB copper area or forced-air cooling in sealed enclosures.
The 84-pin PGA package requires through-hole plated-through-hole (PTH) pads on a 2.54 mm (100 mil) grid. Confirm socket compatibility before PCB layout; PGA sockets with machined pins are preferred over stamped pins for reliability in military and aerospace programs. Decoupling: place one 0.1 uF ceramic and one 10 uF tantalum capacitor per VCC pin within 5 mm of the package, and provide a solid ground plane beneath the device for noise immunity on high-speed signal paths.
Assign JTAG/ISP programming pins (typically TDI, TDO, TMS, TCK) to dedicated PCB test points for in-system programming and boundary-scan testing. Provide a clear routing path to all global clock and global clear pins, because unrouted global signals can degrade timing on high-fanout nets. For UV-erasable variants, ensure the ceramic window is accessible for erasure if iterative programming is required during development.
Compliance Information
Ceramic PGA package contains lead (Pb) and is therefore not RoHS-compliant; legacy military and industrial programs are exempt under RoHS directive Annex IV. The MIL-STD-883B variant (EPM5192AGM883B) is the only screening-qualified option for defense applications. REACH compliance depends on specific distributor documentation; conflict-mineral status compliant per legacy Altera disclosures.
