EPM570F256I5N - MAX II 570 LEs 440 Macrocells CPLD | Intel / Altera
부품 번호: EPM570F256I5N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $40.08 | $40.08 |
| 10 | $35.5 | $355.00 |
| 100 | $27.9 | $2,790.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $19.85 | $19,850.00 |
EPM570F256I5N 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/PLA-like macrocell blocks with a central interconnect matrix. CPLDs sit between simple SPLDs/gates and high-density FPGAs in the programmable logic hierarchy (CPLD -> programmable logic -> logic IC -> integrated circuit), offering instant-on behavior, deterministic timing, and excellent pin-to-pin performance for glue-logic, interface bridging, and bus decoding tasks. The MAX II architecture is built on a low-power 1.8 V core process and is widely used as a board-level companion to microcontrollers, ASICs, and FPGAs.
Key features of the EPM570F256I5N include 440 macrocells with 9 kbits of user flash memory, hot-socketing support for live insertion, multiVolt I/O banks supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V, and PCI signaling, and an industrial operating temperature range of -40C to +100C junction. The device offers multi-track routing between Logic Array Blocks (LABs) and supports 4 global clock networks plus 2 global clear/reset signals. Unlike SRAM-based FPGAs, MAX II instant-on operation requires no external configuration memory.
In practical designs the EPM570F256I5N is typically deployed for high-speed address decoding, bus width conversion (e.g., 8-bit to 16-bit multiplexing), I/O expansion, timing-sensitive control logic, and as a power-sequencer companion to larger microprocessors. Its deterministic 5.4 ns tPD makes it ideal for pipelined memory and parallel-bus interfaces where software-driven GPIO bit-banging would be too slow.
When designing, plan for 1.8 V core and 2.5 V/3.3 V I/O rails; both JTAG and ISP programming require a 3.3 V VCCIO during configuration. Quartus II (or the newer Quartus Prime) software is required for synthesis, fitting, and programming. Compared with discrete 74-series glue logic the EPM570F256I5N consolidates dozens of packages into a single 17 mm x 17 mm BGA.
드롭인 대체품: EPM570F256I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM570F256I5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Programming Interface, Operating Temperature, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM570F256I5
✅ 드롭인✓ 재고 있음
$12.6 / 개
데이터시트 보기 →EPM570F256C5N
✅ 드롭인✓ 재고 있음
$17.03 / 개
데이터시트 보기 →EPM570F256I3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPM570F256C5NRR
✅ 드롭인✓ 재고 있음
$10.9 / 개
데이터시트 보기 →EPM570F256C4N
✅ 드롭인✓ 재고 있음
$26.85 / 개
데이터시트 보기 →EPM570F256I5N 최대 정격 & 전기적 특성
| Family | MAX II |
| Logic Elements | 570 |
| Macrocells | 440 |
| User I/O Count | 160 |
| User Flash Memory | 8 kbits (9220 bits) |
| Pin-to-Pin Delay (tPD1) | 5.4 ns |
| Maximum Internal Frequency | 304 MHz |
| Global Clock Networks | 4 |
| Global Clear/Reset Signals | 2 |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt) |
| 패키지 | 256-ball FineLine BGA (17 mm x 17 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (TJ, industrial) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP (IEEE 1532) |
| Configuration Memory | Internal Flash (non-volatile, instant-on) |
| RoHS 상태 | Compliant (N suffix = Pb-free) |
EPM570F256I5N 256-ball fineline bga (17 mm x 17 mm) 핀 구성 가이드
EPM570F256I5N(256-ball fineline bga (17 mm x 17 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM570F256I5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM570F256I5N 적합 용도: 7 애플리케이션s: High-Speed Address Decoding for Microprocessor Systems, Bus Width Conversion and Protocol Bridging, I/O Expansion for Microcontrollers, Power Sequencing and Reset Distribution, Industrial Control Logic and Machine Interfaces, PCI Bus Interface and Legacy Peripheral Bridging, LED Matrix and Display Multiplexing Drivers.
High-Speed Address Decoding for Microprocessor Systems
The EPM570F256I5N excels at memory-mapped address decoding for microprocessors, FPGAs, and ASICs where deterministic 5.4 ns pin-to-pin delay enables clean chip-select generation. With 570 logic elements and 440 macrocells, it can implement dozens of address comparator banks (each consuming ~10-20 LEs) for systems with multiple banks of SRAM, Flash, and peripheral devices. The MAX II instant-on behavior from internal Flash eliminates the boot-time latency of SRAM-based FPGAs - critical for systems that must respond to the host CPU on the first clock cycle after reset, such as BIOS chipsets and DDR memory controllers in legacy industrial PCs.
추천
Bus Width Conversion and Protocol Bridging
When interfacing 8-bit microcontrollers to 16-bit or 32-bit peripheral buses, the EPM570F256I5N serves as a deterministic protocol bridge. Its 160 user I/Os handle multiplexed 8-bit/16-bit data plus address and control signals, while the 5.4 ns tPD supports bus-cycle frequencies up to 304 MHz internal. Multi-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) lets the same CPLD bridge between 1.8 V ARM Cortex processors and legacy 5 V-tolerant 3.3 V peripherals without level-shifters. The 8 kbit user flash stores non-volatile configuration bits, ideal for storing bridge-mode selection registers that survive power cycles.
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I/O Expansion for Microcontrollers
Many modern microcontrollers ship with limited GPIO pins, but designs often need 50-200 additional GPIOs for LED arrays, keypads, relay drivers, or sensor multiplexing. The EPM570F256I5N provides 160 user I/Os that can be configured as inputs, outputs, or bidirectional with pull-ups, bus-hold, and Schmitt trigger options per the MAX II datasheet. Each I/O bank supports independent VCCIO voltages from 1.5 V to 3.3 V, allowing mixed-voltage designs on a single CPLD. Hot-socketing support means the device can be inserted into a live backplane without current surges - ideal for industrial I/O modules that are field-replaceable.
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Power Sequencing and Reset Distribution
Multi-rail systems (CPU + DDR + ASIC + RF) require precise power-up and power-down sequencing to prevent latch-up and in-rush damage. The EPM570F256I5N implements multi-rail sequencing state machines with deterministic timing - its non-volatile Flash ensures the sequence starts correctly on every power cycle without external boot memory. With 570 LEs, designers can implement windowed watchdog timers, voltage-rail good-signal qualification, and Brown-Out-Detect (BOD) logic for each rail. The industrial -40C to +100C temperature range makes the part suitable for outdoor telecom, automotive under-hood, and factory-floor applications.
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Industrial Control Logic and Machine Interfaces
In industrial automation, the EPM570F256I5N replaces legacy 74-series TTL glue logic with a single integrated solution. It can implement encoder quadrature decoders, PWM generators, stepper-motor pulse trains, and isolated digital I/O conditioning - all in one 17 mm x 17 mm BGA. The 5.4 ns tPD enables real-time response to encoder edges at speeds exceeding 50 MHz, supporting high-resolution CNC and robotics applications. JTAG ISP (IEEE 1532) allows field firmware updates over industrial Ethernet or USB without removing the CPLD from the control board, dramatically simplifying machine servicing.
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PCI Bus Interface and Legacy Peripheral Bridging
The EPM570F256I5N supports 66 MHz 32-bit PCI signaling per the MAX II family datasheet, making it ideal for legacy PCI adapter cards, CompactPCI backplanes, and PXI instrumentation. With 160 I/Os, it can implement a full 32-bit PCI target device interface plus GPIO expansion in a single CPLD. Multi-voltage I/O banks accept 3.3 V PCI signaling directly and can interface to 5 V tolerant devices with external resistors. The non-volatile Flash configuration allows the part to instantly claim the PCI bus at power-up, eliminating the long enumeration latency of SRAM-based FPGA PCI solutions.
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LED Matrix and Display Multiplexing Drivers
Large LED matrix displays, video walls, and seven-segment arrays require precise time-multiplexed row/column scanning. The EPM570F256I5N provides 160 I/Os that can drive 8 rows x 20 columns directly, or chain multiple devices for wider arrays. The 5.4 ns tPD allows scan frequencies up to 304 MHz, far exceeding the ~1 kHz needed for 1000-row LED refresh. Designers can store display patterns in the 8 kbit user flash memory and update them via JTAG, eliminating the need for external pattern-storage SRAM. Industrial temperature grade supports outdoor digital signage and stadium scoreboard applications.
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추천 제품 요약
엔지니어링 참조 데이터: EPM570F256I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM570F256I5 | EPM570F256C5N | EPM570F256I3N | EPM570F256C5NRR | EPM570F256C4N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/Os | 160 | 160 | 160 | 160 | 160 | 160 |
| Pin-to-Pin Delay (tPD1) | 5.4 ns | 5.4 ns | 5.4 ns | 3.3 ns (faster) | 5.4 ns | 4.2 ns |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| RoHS Compliance (Pb-free) | Yes (N suffix) | No (tin/lead finish) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
주요 차별점
- Highest density MAX II CPLD in 256-ball BGA package (vs EPM570F100A5N (100-ball BGA, 100 LEs))
- Industrial temperature grade with Pb-free RoHS compliance (vs EPM570F256I5 (non-N suffix))
- Instant-on non-volatile Flash configuration (vs SRAM-based FPGAs (e.g., Cyclone, Xilinx Spartan))
설계 노트
The EPM570F256I5N requires two power rails: VCCINT at 1.8 V (typical) for the core logic and VCCIO at 2.5 V or 3.3 V for the I/O banks. During JTAG/ISP programming, VCCIO must be at 3.3 V; using 2.5 V during programming will cause configuration failures. Each I/O bank has an independent VCCIO pin, allowing mixed-voltage designs (e.g., 1.8 V on Bank 1 for ARM interface, 3.3 V on Bank 2 for legacy peripherals). Decoupling: place one 0.1 uF X7R ceramic plus one 10 uF tantalum within 5 mm of each VCC pin group, with a single 100 uF bulk capacitor at the regulator output.
The 256-ball FineLine BGA package uses 1.0 mm ball pitch on a 17 mm x 17 mm body. PCB layout must use laser-drilled or mechanically drilled micro-vias to fan out from the inner ball array. Use a 4-layer or 6-layer stack-up with continuous ground plane beneath the BGA for return-path integrity. Match trace lengths within each bus group to ±0.5 mm to preserve setup/hold margins at 66 MHz PCI. Route JTAG signals (TCK, TMS, TDI, TDO, TRST) on a dedicated layer or keep them short and away from clock edges to avoid programming failures.
MAX II I/O pins support 66 MHz 32-bit PCI and various LVCMOS/LVTTL standards. For 66 MHz PCI operation, source-terminate the PCI bus with the recommended 25 Ohm series resistors per the PCI specification. For LVDS or HSTL signaling, consult the MAX II device handbook for IBIS models - simulation is required because internal on-die termination (if used) interacts with PCB stubs. The 8 kbit user Flash memory is shared with the configuration Flash; do not use the entire 8 kbits for non-volatile data storage without checking Quartus fitter reports to avoid configuration overflow.
The EPM570F256I5N is specified for junction temperature up to +100C (industrial grade). Estimated: at maximum toggle activity on all 160 I/Os at 3.3 V VCCIO and 100 MHz, core power dissipation is approximately 200-300 mW. The BGA package theta_JA is typically 30-35 C/W on a 4-layer PCB with thermal vias. For sealed enclosures with no airflow, derate I/O switching frequency or add a heatsink if junction temperature could exceed +90C. Always validate thermal performance in worst-case corner (highest VCCIO, fastest fMAX, all I/O toggling).
Common pitfalls with the EPM570F256I5N include: (1) forgetting that VCCIO must be 3.3 V during JTAG programming - a 2.5 V-only board will fail to program, (2) using the user Flash memory without first reserving space for configuration in Quartus fitter settings, (3) assuming all 160 I/Os are simultaneously accessible - some balls are dedicated JTAG/clock/MSELn and reduce usable GPIOs, (4) not enabling bus-hold or pull-ups on tri-stated outputs leads to floating input leakage, and (5) using the wrong Quartus version for legacy MAX II support - Quartus Prime 18.1 and earlier still support MAX II but newer versions may drop device support.
규정 준수 정보
Pb-free per N suffix in MPN, RoHS compliant per Mouser/DigiKey listings. Industrial temp grade -40C to +100C. AEC-Q100 not specifically qualified (CPLD family generally not AEC-Q100). Halogen-free and conflict-mineral status not explicitly stated in the verified data; set to unknown pending Intel documentation.
