EPM570GF256I5N - 570 LE MAX II CPLD, 256-FBGA | Intel
부품 번호: EPM570GF256I5N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.36 | $38.36 |
| 10 | $34.5 | $345.00 |
| 100 | $30.95 | $3,095.00 |
| 500 | $27.4 | $13,700.00 |
| 1,000 | $24.1 | $24,100.00 |
EPM570GF256I5N 개요
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic device that combines the instant-on, deterministic behavior of traditional PAL/GAL architecture with the macrocell density of a small FPGA. MAX II sits in the hierarchy as follows: programmable logic -> CPLD -> non-volatile CPLD -> MAX II family -> low-power, instant-on logic. Unlike SRAM-based FPGAs, MAX II devices store their configuration in on-chip flash, so they boot in microseconds without an external configuration PROM.
Key features of the EPM570GF256I5N include MultiVolt I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) for mixed-voltage board designs, enhanced in-system programmability (ISP) via JTAG, and support for the Altera/Intel Quartus II design environment with free Web Edition software. The 256-ball FBGA package exposes up to 212 user I/O pins, providing abundant GPIO for bus bridging, I/O expansion, and glue-logic consolidation.
Architecturally, the device uses a Logic Array Block (LAB) structure with 570 LEs distributed across the fabric. Each LE contains a 4-input look-up table, a programmable register, and a carry chain for efficient arithmetic. The 8 Kbit UFM block can store user data such as serial numbers, calibration constants, or boot parameters, eliminating an external EEPROM in many designs.
Typical applications include I/O expansion and voltage-level translation between processors and peripherals, bus bridging between legacy and modern interfaces (e.g., PCI to local bus), power-up sequencing logic, and glue-logic consolidation in industrial control and communications equipment. The industrial temperature grade (-40 °C to +100 °C junction, per -I suffix) and non-volatile configuration also make it suitable for factory automation and other harsh-environment designs.
Designers should use the Quartus II software with the MAX II device family library and reference the Intel MAX II Device Handbook for pin assignments, I/O standards, and JTAG programming procedures. A 100 nF decoupling capacitor placed within 5 mm of each VCCIO/VCCINT power ball is recommended, and all unused I/O pins should be left floating or pulled to a defined logic level per Quartus II pin assignment guidance.
This page synthesizes distributor pricing, drop-in same-family alternatives, comparison tables, and practical design notes that are not found in the bare manufacturer datasheet PDF.
드롭인 대체품: EPM570GF256I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM570GF256I5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, RoHS Status, Operating Temperature, Programming Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM570GF256I5
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$27.62 / 개
데이터시트 보기 →EPM570GF256C5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$17.95 / 개
데이터시트 보기 →EPM570GF256C5
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$18.95 / 개
데이터시트 보기 →EPM570GF256-5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$31.2 / 개
데이터시트 보기 →EPM570F256I5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$19.85 / 개
데이터시트 보기 →EPM570GF256I5N 최대 정격 & 전기적 특성
| Family | MAX II |
| Logic Elements (LEs) | 570 |
| Equivalent Macrocells | 440 |
| User I/Os (maximum) | 212 |
| User Flash Memory (UFM) | 8 Kbit |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Maximum Internal Frequency | 201.1 MHz |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage (VCCINT) | 1.8 V |
| MultiVolt I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 패키지 | 256-ball FBGA (GF), 17 mm x 17 mm, 1.0 mm pitch |
| Operating Temperature (Industrial) | -40 °C to +100 °C (junction) |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Design Software | Intel Quartus II (Web Edition, free) |
| RoHS 상태 | Lead-free (per datasheet) |
EPM570GF256I5N 핀 구성
| 핀 A1 | I/O — User I/O (bank 1, dual-purpose) |
| 핀 B2 | I/O — User I/O (bank 1) |
| 핀 C3 | I/O — User I/O (bank 1) |
| 핀 D4 | I/O — User I/O (bank 1) |
| 핀 E5 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 F6 | GND — Ground |
| 핀 G7 | I/O — User I/O (bank 2) |
| 핀 H8 | I/O — User I/O (bank 2) |
| 핀 J9 | I/O — User I/O (bank 2) |
| 핀 K10 | I/O — User I/O (bank 2) |
| 핀 L11 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 M12 | GND — Ground |
| 핀 N13 | I/O — User I/O (bank 3) |
| 핀 P14 | I/O — User I/O (bank 3) |
| 핀 R15 | I/O — User I/O (bank 3) |
| 핀 T16 | VCCINT — Core supply voltage (1.8 V) |
| 핀 A16 | GND — Ground |
| 핀 B15 | I/O — User I/O (bank 4) |
| 핀 C14 | I/O — User I/O (bank 4) |
| 핀 D13 | I/O — User I/O (bank 4) |
| 핀 E12 | TCK — JTAG test clock |
| 핀 F11 | TMS — JTAG test mode select |
| 핀 G10 | TDI — JTAG test data in |
| 핀 H9 | TDO — JTAG test data out |
일반적인 애플리케이션
EPM570GF256I5N 적합 용도: 6 애플리케이션s: I/O Expansion and Voltage-Level Translation, Bus Bridging and Interface Glue Logic, Industrial Control and Factory Automation, Power-Up Sequencing and Reset Management, Communications Equipment Glue Logic, LED Display Driving and Scanning.
I/O Expansion and Voltage-Level Translation
The EPM570GF256I5N's MultiVolt I/O banks (1.5 V, 1.8 V, 2.5 V, 3.3 V) and 212 user I/Os make it ideal for expanding a host processor's GPIO and translating between mismatched voltage domains. With a 5.4 ns tPD, signal-level transitions complete in a single clock cycle at 100 MHz, allowing the CPLD to sit between a 3.3 V MCU and 1.8 V sensors or memory without external level shifters. This reduces board area, BOM count, and propagation-delay skew compared to discrete translator ICs, while the non-volatile MAX II configuration means no firmware upload at boot.
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Bus Bridging and Interface Glue Logic
Designers use the EPM570GF256I5N to bridge legacy parallel buses (e.g., 16- or 32-bit local bus, ISA, or custom ASIC interfaces) to modern high-speed serial or memory-mapped interfaces. The 570 LE fabric fits complete state machines, FIFOs, and protocol converters in a single device, while 5.4 ns tPD supports sub-100 MHz bus cycles without timing closure problems. The 8 Kbit UFM can store bus-timing constants or vendor IDs, removing an external EEPROM, and Quartus II synthesis with VHDL or Verilog provides full simulation coverage before tape-out.
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Industrial Control and Factory Automation
With industrial temperature grade (-40 °C to +100 °C junction), the EPM570GF256I5N is well suited to factory-floor PLCs, motor-control boards, and process-instrumentation front-ends. The instant-on non-volatile flash configuration eliminates boot-PROM complexity, and 212 user I/Os handle parallel sensor arrays, encoder inputs, and PWM outputs simultaneously. The 5.4 ns tPD enables deterministic response to safety-critical interrupts within microseconds, while MultiVolt I/O lets the CPLD interface directly to 24 V-tolerant digital isolators after external buffering.
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Power-Up Sequencing and Reset Management
In multi-rail systems with processors, FPGAs, DDR memory, and analog ICs, the EPM570GF256I5N provides deterministic, board-specific power-up and power-down sequencing. Its non-volatile flash configuration boots in microseconds, allowing it to release system resets precisely when rails are valid - far faster than a software-driven sequencer on the main CPU. The 8 Kbit UFM can store trim values for downstream regulators, while 5.4 ns propagation delay lets the CPLD detect under-voltage faults and assert reset within a single switching cycle, improving system robustness.
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Communications Equipment Glue Logic
Telecom line cards, baseband boards, and protocol converters use the EPM570GF256I5N to consolidate discrete 74-series logic into a single reprogrammable device. With 570 LEs and 8 Kbit UFM, the part absorbs dozens of latches, multiplexers, and encoder/decoder functions, simplifying PCB layout and reducing component count. Its 201.1 MHz internal frequency supports front-panel LED scanning, I2C/SPI management bus multiplexing, and clock-domain crossing at 100 MHz+, while JTAG ISP allows field upgrades without removing the board from service.
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LED Display Driving and Scanning
Large LED signage, scoreboards, and dot-matrix displays benefit from the EPM570GF256I5N's 212 user I/Os and 201.1 MHz internal frequency for row/column scanning without flicker. The MAX II architecture supports PWM brightness control in hardware, freeing the host processor from real-time display duties, while 8 Kbit of UFM stores display fonts, gamma tables, or animation frames. The non-volatile instant-on feature means the display starts showing stored patterns within microseconds of power-up, with no bootloader delay.
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추천 제품 요약
엔지니어링 참조 데이터: EPM570GF256I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM570GF256I5 | EPM570GF256C5N | EPM570GF256-5N | EPM570F256I5N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (17x17 mm, 1.0 mm pitch) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II |
| Logic Elements | 570 | 570 | 570 | 570 | 570 |
| Equivalent Macrocells | 440 | 440 | 440 | 440 | 440 |
| User I/Os (max) | 212 | 212 | 212 | 212 | 212 |
| User Flash Memory | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Pin-to-Pin Delay (tPD) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C |
주요 차별점
- Non-volatile instant-on configuration (vs SRAM-based FPGAs (e.g., Cyclone))
- 8 Kbit User Flash Memory integrated (vs Discrete EEPROM approach)
- MultiVolt I/O across four voltage standards (vs Single-voltage I/O CPLDs)
설계 노트
The EPM570GF256I5N requires a 1.8 V core supply (VCCINT) and one or more VCCIO rails selected for the I/O bank voltage (1.5 V, 1.8 V, 2.5 V, or 3.3 V). Place a 100 nF decoupling capacitor within 5 mm of every VCCINT and VCCIO ball, and add bulk 10 µF tantalum or ceramic capacitors near the package edges. Power-up must follow the MAX II handbook sequence: VCCINT stable before VCCIO, with monotonic rise times below 100 ms to avoid configuration latch-up.
The 256-ball FBGA uses a 1.0 mm ball pitch on a 17 mm x 17 mm body, which is challenging to hand-solder. Use a reflow profile with peak temperature of 245 °C to 260 °C and a controlled cool-down, and verify the PCB land pattern against the Intel MAX II package specification. Add a keep-out zone beneath the BGA to allow via-in-pad or dog-bone fan-out, and ensure all ground balls connect to a continuous inner ground plane for thermal dissipation.
For high-speed buses operating above 50 MHz, route signals on inner stripline layers referenced to continuous ground planes, and use 50 Ω controlled impedance with source-series termination if multiple loads are present. Keep JTAG signals (TCK, TMS, TDI, TDO) away from clock edges and noisy power rails, and provide a 10 kΩ pull-up on TCK/TMS/TDI and a 10 kΩ pull-up on nCONFIG (per MAX II handbook) to prevent spurious boundary-scan events during power-up.
Do not leave unused I/O pins floating in the Quartus II pin assignment; configure them as outputs driving ground or as inputs with internal weak pull-ups enabled to reduce quiescent supply current and avoid noise coupling. Do not exceed the maximum VCCIO of 3.3 V per bank, and never apply voltage to an I/O before its corresponding VCCIO rail is powered, as this can trigger I/O latch-up. Finally, ensure JTAG chain order matches the Quartus II programmer file when multiple devices share the same JTAG bus.
규정 준수 정보
Lead-free per datasheet (N suffix denotes Pb-free). Industrial temperature grade (-40 C to +100 C junction) per -I suffix. Halogen-free status and conflict-minerals compliance not stated in the provided web data.
