EPM570ZF256C7N - MAX II CPLD, 440 LEs, 256-MBGA | Altera (Intel)
부품 번호: EPM570ZF256C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.4 | $9,700.00 |
| 1,000 | $17.85 | $17,850.00 |
EPM570ZF256C7N 개요
A Complex Programmable Logic Device (CPLD) is a non-volatile, low-power programmable logic IC that combines the deterministic timing of PAL/GLUE logic with the density of a small FPGA. CPLDs sit hierarchically below FPGAs and above discrete logic gates in the digital design toolkit, offering instant-on configuration from on-chip flash, predictable I/O behavior, and a low static-power footprint ideal for bus-bridging, I/O expansion, and power-sequencing glue.
Key features include 440 Logic Elements (LE), 8 Kbits of embedded flash user memory, 160 maximum user I/O pins, 212 programmable I/O pins in the 256-MBGA package, and a maximum internal operating frequency up to 201 MHz. The device supports JTAG (IEEE 1149.1) and in-system programmability through Altera's Quartus II design suite, and integrates Altera's MultiVolt I/O technology that allows 1.5 V, 1.8 V, 2.5 V, and 3.3 V interface on the same die.
Architecturally, the MAX II device uses a non-volatile flash-based Look-Up Table (LUT) fabric combined with a continuous, unbroken interconnect backbone, eliminating the segmented routing of legacy CPLDs and improving pin-to-pin delay consistency. The internal 1.8 V core, paired with MultiVolt I/O banks, lets the part serve as a voltage-level translator between modern SoCs and legacy peripherals.
Typical applications include power-up sequencing in telecom line cards, I/O expansion for industrial controllers, bus-bridging between legacy 3.3 V microcontrollers and 1.8 V application processors, glue logic replacement, and LED display driver interfaces. Designers also use MAX II CPLDs for boot-loader multiplexing between SPI flash and SD cards in low-cost embedded platforms.
Design considerations for the 256-MBGA package center on PCB escape routing: the 1.0 mm ball pitch requires microvia (laser-drilled) via technology on standard 4-layer boards and microvia-in-pad on high-density 6+ layer stackups. Ensure the JTAG chain is accessible through a 10-pin header for in-system programming, and provide a clean 1.8 V core supply with at least 100 µF of bulk decoupling plus 0.1 µF + 1 nF high-frequency capacitors near the core pins.
This page synthesizes distributor stock data, drop-in same-brand alternatives from the MAX II family, and PCB-layout guidance specific to the 256-MBGA footprint not found in the manufacturer datasheet alone.
드롭인 대체품: EPM570ZF256C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM570ZF256C7N (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Maximum Operating Frequency, Operating Temperature, Programming Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM570F256C5N
✅ 드롭인✓ 재고 있음
$17.03 / 개
데이터시트 보기 →EPM570F256C4N
✅ 드롭인✓ 재고 있음
$26.85 / 개
데이터시트 보기 →EPM570F256C3N
✅ 드롭인✓ 재고 있음
$13.75 / 개
데이터시트 보기 →EPM570F256C5
✅ 드롭인✓ 재고 있음
$7.1 / 개
데이터시트 보기 →EPM570GF256C5N
✅ 드롭인✓ 재고 있음
$17.95 / 개
데이터시트 보기 →EPM570GM256I5N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EPM570ZF256C7N 최대 정격 & 전기적 특성
| Series | MAX II |
| Programmable Type | In System Programmable |
| Macro Cells | 440 |
| Logic Elements (LE) | 440 |
| Embedded Flash Memory | 8 Kbit |
| Pin-to-Pin Logic Delay (tPD) | 9 ns |
| Maximum Operating Frequency | 201 MHz (internal) |
| Maximum User I/O Pins | 160 |
| Supply Voltage - Internal (VCCINT) | 1.71 V to 1.89 V |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Supplier Device Package | 256-MBGA (11x11 mm) |
| Package Type Code | 256-FBGA / 256-TFBGA |
| Ball Pitch | 1.0 mm |
| Process Technology | 0.18 µm flash-based CMOS |
| Programming Interface | JTAG (IEEE 1149.1) |
| 동작 온도 범위 | 0 °C to +85 °C (commercial, suffix 'C') |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free Status | Lead free |
EPM570ZF256C7N 256-fbga / 256-tfbga 핀 구성 가이드
EPM570ZF256C7N(256-fbga / 256-tfbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM570ZF256C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM570ZF256C7N 적합 용도: 7 애플리케이션s: Power-Up Sequencing & Reset Logic, Bus Bridging & Protocol Translation, I/O Expansion & GPIO Multiplexing, LED Display & Signage Drivers, Glue Logic Replacement & Board Re-Designs, Motor Control & PWM Generation, Boot Multiplexing & Firmware Update Path.
Power-Up Sequencing & Reset Logic
The EPM570ZF256C7N's 9 ns pin-to-pin delay and non-volatile instant-on configuration make it ideal for power-up sequencing in multi-rail systems. With 440 LEs and up to 160 user I/O pins, the device can monitor up to 16 enable signals and produce time-staggered PGOOD outputs with deterministic 9 ns propagation - critical for processors, FPGAs, and DDR memory requiring strict rail-order. Designers typically implement 4 to 8 sequenced rails in a single 256-MBGA part, replacing discrete RC-delay networks. The MultiVolt I/O allows the CPLD to interface directly with 3.3 V POL controllers while running from a 1.8 V core, eliminating level shifters.
추천
Bus Bridging & Protocol Translation
The EPM570ZF256C7N bridges legacy parallel buses (PCI, ISA, EPP) to modern serial interfaces (I2C, SPI, UART) in industrial controller designs. With 160 user I/O and 8 Kbit of embedded flash, the CPLD fits state machines up to 440 LEs while storing boot configuration. The 1.5 V / 1.8 V / 2.5 V / 3.3 V MultiVolt I/O banks connect a 3.3 V microcontroller directly to a 1.8 V application processor without external level shifters. The 9 ns tPD keeps bus-turnaround latency below 20 ns, satisfying most legacy-bus AC timing.
추천
I/O Expansion & GPIO Multiplexing
Embedded processors with limited GPIO (often 30-60 pins) gain 100+ additional pins via the EPM570ZF256C7N, which acts as a parallel I/O expander over SPI or I2C. The 440 LEs implement 128 to 160 virtual GPIO with 9 ns response, supporting switch debouncing, pulse stretching, and PWM generation in hardware. Industrial PLCs frequently use this topology to scan 32 to 64 digital inputs while generating 16 PWM outputs at 25 kHz. The 1.0 mm ball pitch on the 256-MBGA requires microvia PCB technology for clean signal escape on high-pin-count designs.
추천
LED Display & Signage Drivers
The EPM570ZF256C7N drives multiplexed LED matrices (32x64 to 64x128 single-color) by generating row-scan timing and column data latches. Its 9 ns tPD supports row-refresh rates above 1 kHz, eliminating visible flicker at 60 Hz frame rate with 16-row multiplexing. The 160 user I/Os source/sink 8 mA per pin (LVTTL), sufficient to drive constant-current LED drivers like TLC5941 directly. Designers combine the CPLD with a small microcontroller over SPI to push frame buffers while the CPLD handles the time-critical row scanning.
추천
Glue Logic Replacement & Board Re-Designs
Replacing 5 to 20 discrete 74HC/74LVC logic packages with a single EPM570ZF256C7N reduces PCB area by 60-80% and eliminates chip-to-chip skew. The 440-LE fabric holds equivalent of ~500 gate equivalents with deterministic 9 ns propagation, perfect for address decoding, interrupt steering, and FIFO flag generation in legacy upgrades. The 8 Kbit embedded flash stores board-revision ID, allowing factory test fixtures to identify PCB variants. Hot-socketing capability lets the CPLD be inserted into live backplanes without disturbing existing traffic.
추천
Motor Control & PWM Generation
The EPM570ZF256C7N generates complementary PWM pairs with programmable dead-time insertion for 3-phase BLDC or stepper motor drives up to 50 kHz switching. Up to 12 PWM channels fit within the 440 LEs, each with independent duty cycle, phase shift, and fault-input handling. The 9 ns tPD enables sub-microsecond dead-time control, critical for high-current FET bridges. The CPLD also handles Hall-sensor decoding and quadrature encoding for closed-loop position control, offloading real-time tasks from the host MCU.
추천
Boot Multiplexing & Firmware Update Path
The EPM570ZF256C7N implements a SPI flash multiplexer that lets a system boot from one of two firmware images for fail-safe over-the-air updates. The 8 Kbit embedded flash holds the bootloader state machine and image-selection register, while the 160 user I/Os switch SPI signals between two external flash chips in <10 ns. The CPLD's non-volatile configuration guarantees the boot-mux logic is active at first power-on without external boot flash - a major advantage over SRAM-based FPGAs that need boot ROM.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM570ZF256C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM570F256C5N | EPM570F256C4N | EPM570F256C3N | EPM570GF256C5N | EPM570GM256I5N |
|---|---|---|---|---|---|---|
| Package | 256-MBGA (11x11 mm) | 256-MBGA (11x11 mm) - same | 256-MBGA (11x11 mm) - same | 256-MBGA (11x11 mm) - same | 256-MBGA (11x11 mm) - same | 256-MBGA (11x11 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 440 LE | 440 LE | 440 LE | 440 LE | 440 LE | 440 LE |
| tPD (Pin-to-Pin Delay) | 9 ns | 5 ns | 4 ns | 3 ns | 5 ns | 5 ns |
| Embedded Flash Memory | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Maximum User I/O | 160 | 160 | 160 | 160 | 160 | 160 |
| Operating Temperature Range | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) |
| Internal Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Approx. Unit Price (qty 1) | USD 28.50 | USD 24.10 | USD 21.50 | USD 19.80 | USD 26.40 | USD 31.20 |
주요 차별점
- Fastest tPD speed grade in the EPM570 256-MBGA family (vs EPM570F256C5N)
- Non-volatile instant-on configuration versus SRAM-based FPGAs (vs Cyclone IV EP4CE6 (small FPGA))
- MultiVolt I/O eliminates external level shifters (vs XC9500XL family CPLD (Xilinx))
- Industrial-temp variant available in same footprint (vs EPM570GM256I5N)
설계 노트
The 256-MBGA package uses a 1.0 mm ball pitch, which requires microvia (laser-drilled) PCB technology. On standard 4-layer FR-4 stackups, escape routing must use 0.1 mm laser vias in pad with 0.4 mm pad-to-pad clearance. On 6+ layer boards, conventional 0.2 mm mechanical vias with 0.5 mm capture pads can escape the inner two rows. Always provide a continuous ground plane directly under the BGA to control return-current paths and reduce simultaneous-switching-noise (SSN) by 4-6 dB.
Decouple the EPM570ZF256C7N with at least 100 µF of bulk capacitance plus 0.1 µF + 1 nF high-frequency capacitors placed within 5 mm of the VCCINT and VCCIO pin groups. The internal core draws up to 30 mA active / 1 mA standby; using low-ESR ceramic capacitors (X5R or X7R) avoids inrush-triggered brownouts during flash programming over JTAG.
Series-terminate clock outputs from the EPM570ZF256C7N with 33 Ω resistors when driving traces longer than 50 mm or when more than 8 loads are connected. The MAX II I/O drivers have ~5 ns edge rates at 50 pF load - too fast for unterminated stubs. Place the series resistor within 10 mm of the CPLD pin, and avoid daisy-chained clock distribution; use star topology from a single clock-driver pin instead.
Do not confuse the 256-MBGA package pinout with the legacy 256-Pin FBGA used on MAX 3000A devices - the ball map differs even though both packages have 256 balls. Also note the 'N' suffix in 'C7N' indicates tray packaging; ordering C7N vs C7 (tape-and-reel) is purely a packaging detail and does not affect silicon behavior. Finally, ensure JTAG TCK is pulled up through 10 kΩ to VCCIO if the device is used in a multi-device JTAG chain.
규정 준수 정보
RoHS compliant and lead-free per distributor data. Not AEC-Q100 qualified (industrial and automotive grades available as EPM570GM256I5N and other 'I' suffix variants).
