EPM570ZF256C7N - MAX II CPLD, 440 LEs, 256-MBGA | Altera (Intel)
MPN: EPM570ZF256C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.4 | $9,700.00 |
| 1,000 | $17.85 | $17,850.00 |
Drop-in alternatives for EPM570ZF256C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPM570ZF256C7N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Programmable Type | In System Programmable |
| Macro Cells | 440 |
| Logic Elements (LE) | 440 |
| Embedded Flash Memory | 8 Kbit |
| Pin-to-Pin Logic Delay (tPD) | 9 ns |
| Maximum Operating Frequency | 201 MHz (internal) |
| Maximum User I/O Pins | 160 |
| Supply Voltage - Internal (VCCINT) | 1.71 V to 1.89 V |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Supplier Device Package | 256-MBGA (11x11 mm) |
| Package Type Code | 256-FBGA / 256-TFBGA |
| Ball Pitch | 1.0 mm |
| Process Technology | 0.18 µm flash-based CMOS |
| Programming Interface | JTAG (IEEE 1149.1) |
| Operating Temperature Range | 0 °C to +85 °C (commercial, suffix 'C') |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free Status | Lead free |
EPM570ZF256C7N 256-fbga / 256-tfbga Pin Configuration Guide
Complete pinout information for EPM570ZF256C7N (256-fbga / 256-tfbga package) with 160 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570ZF256C7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 160 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570ZF256C7N is suitable for 7 applications: Power-Up Sequencing & Reset Logic, Bus Bridging & Protocol Translation, I/O Expansion & GPIO Multiplexing, LED Display & Signage Drivers, Glue Logic Replacement & Board Re-Designs, Motor Control & PWM Generation, Boot Multiplexing & Firmware Update Path.
Power-Up Sequencing & Reset Logic
The EPM570ZF256C7N's 9 ns pin-to-pin delay and non-volatile instant-on configuration make it ideal for power-up sequencing in multi-rail systems. With 440 LEs and up to 160 user I/O pins, the device can monitor up to 16 enable signals and produce time-staggered PGOOD outputs with deterministic 9 ns propagation - critical for processors, FPGAs, and DDR memory requiring strict rail-order. Designers typically implement 4 to 8 sequenced rails in a single 256-MBGA part, replacing discrete RC-delay networks. The MultiVolt I/O allows the CPLD to interface directly with 3.3 V POL controllers while running from a 1.8 V core, eliminating level shifters.
Recommended
Bus Bridging & Protocol Translation
The EPM570ZF256C7N bridges legacy parallel buses (PCI, ISA, EPP) to modern serial interfaces (I2C, SPI, UART) in industrial controller designs. With 160 user I/O and 8 Kbit of embedded flash, the CPLD fits state machines up to 440 LEs while storing boot configuration. The 1.5 V / 1.8 V / 2.5 V / 3.3 V MultiVolt I/O banks connect a 3.3 V microcontroller directly to a 1.8 V application processor without external level shifters. The 9 ns tPD keeps bus-turnaround latency below 20 ns, satisfying most legacy-bus AC timing.
Recommended
I/O Expansion & GPIO Multiplexing
Embedded processors with limited GPIO (often 30-60 pins) gain 100+ additional pins via the EPM570ZF256C7N, which acts as a parallel I/O expander over SPI or I2C. The 440 LEs implement 128 to 160 virtual GPIO with 9 ns response, supporting switch debouncing, pulse stretching, and PWM generation in hardware. Industrial PLCs frequently use this topology to scan 32 to 64 digital inputs while generating 16 PWM outputs at 25 kHz. The 1.0 mm ball pitch on the 256-MBGA requires microvia PCB technology for clean signal escape on high-pin-count designs.
Recommended
LED Display & Signage Drivers
The EPM570ZF256C7N drives multiplexed LED matrices (32x64 to 64x128 single-color) by generating row-scan timing and column data latches. Its 9 ns tPD supports row-refresh rates above 1 kHz, eliminating visible flicker at 60 Hz frame rate with 16-row multiplexing. The 160 user I/Os source/sink 8 mA per pin (LVTTL), sufficient to drive constant-current LED drivers like TLC5941 directly. Designers combine the CPLD with a small microcontroller over SPI to push frame buffers while the CPLD handles the time-critical row scanning.
Recommended
Glue Logic Replacement & Board Re-Designs
Replacing 5 to 20 discrete 74HC/74LVC logic packages with a single EPM570ZF256C7N reduces PCB area by 60-80% and eliminates chip-to-chip skew. The 440-LE fabric holds equivalent of ~500 gate equivalents with deterministic 9 ns propagation, perfect for address decoding, interrupt steering, and FIFO flag generation in legacy upgrades. The 8 Kbit embedded flash stores board-revision ID, allowing factory test fixtures to identify PCB variants. Hot-socketing capability lets the CPLD be inserted into live backplanes without disturbing existing traffic.
Recommended
Motor Control & PWM Generation
The EPM570ZF256C7N generates complementary PWM pairs with programmable dead-time insertion for 3-phase BLDC or stepper motor drives up to 50 kHz switching. Up to 12 PWM channels fit within the 440 LEs, each with independent duty cycle, phase shift, and fault-input handling. The 9 ns tPD enables sub-microsecond dead-time control, critical for high-current FET bridges. The CPLD also handles Hall-sensor decoding and quadrature encoding for closed-loop position control, offloading real-time tasks from the host MCU.
Recommended
Boot Multiplexing & Firmware Update Path
The EPM570ZF256C7N implements a SPI flash multiplexer that lets a system boot from one of two firmware images for fail-safe over-the-air updates. The 8 Kbit embedded flash holds the bootloader state machine and image-selection register, while the 160 user I/Os switch SPI signals between two external flash chips in <10 ns. The CPLD's non-volatile configuration guarantees the boot-mux logic is active at first power-on without external boot flash - a major advantage over SRAM-based FPGAs that need boot ROM.
Recommended
Recommended Products Summary
Engineering reference data for EPM570ZF256C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570F256C5N | EPM570F256C4N | EPM570F256C3N | EPM570GF256C5N | EPM570GM256I5N |
|---|---|---|---|---|---|---|
| Package | 256-MBGA (11x11 mm) | 256-MBGA (11x11 mm) - same | 256-MBGA (11x11 mm) - same | 256-MBGA (11x11 mm) - same | 256-MBGA (11x11 mm) - same | 256-MBGA (11x11 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 440 LE | 440 LE | 440 LE | 440 LE | 440 LE | 440 LE |
| tPD (Pin-to-Pin Delay) | 9 ns | 5 ns | 4 ns | 3 ns | 5 ns | 5 ns |
| Embedded Flash Memory | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Maximum User I/O | 160 | 160 | 160 | 160 | 160 | 160 |
| Operating Temperature Range | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) |
| Internal Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Approx. Unit Price (qty 1) | USD 28.50 | USD 24.10 | USD 21.50 | USD 19.80 | USD 26.40 | USD 31.20 |
Key Differentiators
- Fastest tPD speed grade in the EPM570 256-MBGA family (vs EPM570F256C5N)
- Non-volatile instant-on configuration versus SRAM-based FPGAs (vs Cyclone IV EP4CE6 (small FPGA))
- MultiVolt I/O eliminates external level shifters (vs XC9500XL family CPLD (Xilinx))
- Industrial-temp variant available in same footprint (vs EPM570GM256I5N)
Design Notes
The 256-MBGA package uses a 1.0 mm ball pitch, which requires microvia (laser-drilled) PCB technology. On standard 4-layer FR-4 stackups, escape routing must use 0.1 mm laser vias in pad with 0.4 mm pad-to-pad clearance. On 6+ layer boards, conventional 0.2 mm mechanical vias with 0.5 mm capture pads can escape the inner two rows. Always provide a continuous ground plane directly under the BGA to control return-current paths and reduce simultaneous-switching-noise (SSN) by 4-6 dB.
Decouple the EPM570ZF256C7N with at least 100 µF of bulk capacitance plus 0.1 µF + 1 nF high-frequency capacitors placed within 5 mm of the VCCINT and VCCIO pin groups. The internal core draws up to 30 mA active / 1 mA standby; using low-ESR ceramic capacitors (X5R or X7R) avoids inrush-triggered brownouts during flash programming over JTAG.
Series-terminate clock outputs from the EPM570ZF256C7N with 33 Ω resistors when driving traces longer than 50 mm or when more than 8 loads are connected. The MAX II I/O drivers have ~5 ns edge rates at 50 pF load - too fast for unterminated stubs. Place the series resistor within 10 mm of the CPLD pin, and avoid daisy-chained clock distribution; use star topology from a single clock-driver pin instead.
Do not confuse the 256-MBGA package pinout with the legacy 256-Pin FBGA used on MAX 3000A devices - the ball map differs even though both packages have 256 balls. Also note the 'N' suffix in 'C7N' indicates tray packaging; ordering C7N vs C7 (tape-and-reel) is purely a packaging detail and does not affect silicon behavior. Finally, ensure JTAG TCK is pulled up through 10 kΩ to VCCIO if the device is used in a multi-device JTAG chain.
Compliance Information
RoHS compliant and lead-free per distributor data. Not AEC-Q100 qualified (industrial and automotive grades available as EPM570GM256I5N and other 'I' suffix variants).
