EPM9560RC304C-3 - MAX 9000 CPLD, 560 Macrocells, 304-Pin RBGGA | Altera
부품 번호: EPM9560RC304C-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $140 | $14,000.00 |
| 500 | $118 | $59,000.00 |
| 1,000 | $95 | $95,000.00 |
EPM9560RC304C-3 개요
Key features of the MAX 9000 family include the classic MAX (Multiple Array Matrix) interconnect structure with Logic Array Blocks (LABs) and a global Programmable Interconnect Array (PIA), in-system programmability via IEEE 1149.1 JTAG, and a built-in boundary-scan test capability that simplifies board-level test. The "C" suffix indicates commercial temperature grade (0 C to +70 C), the "RC" indicates a ceramic BGA package, and "-3" indicates the speed grade. The EPM9560 is the highest-density member of the MAX 9000 family and is widely deployed in legacy telecom, industrial control, and glue-logic applications where a non-volatile, deterministic CPLD is required.
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the architectural simplicity of PAL/GAL with much higher gate density, providing deterministic timing and instant-on behavior from a single flash/EEPROM configuration cell. CPLDs sit alongside FPGAs in the programmable logic hierarchy, but are distinguished by their non-volatility, faster pin-to-pin deterministic timing, and lower power consumption at small logic capacities - making them ideal for control-plane logic, bus interfacing, address decoding, and state-machine replacement rather than high-density parallel DSP.
Typical applications for the EPM9560RC304C-3 include legacy telecom backplane glue logic, industrial control and factory automation, address decoding for microprocessor and DSP systems, bus-interface bridging (e.g., PCI to local bus), and replacement of multiple discrete TTL/CMOS glue-logic ICs. The MAX 9000 family was one of the most widely deployed CPLD families of the late 1990s and early 2000s and is still in use today in long-lifecycle industrial and military systems.
When designing with the EPM9560RC304C-3, designers should note that the device is part of an older MAX 9000 generation - Altera/Intel MAX II, MAX V, and MAX 10 families offer newer non-volatile CPLD alternatives with lower power and lower cost. However, for true pin-compatible drop-in replacements on existing 304-pin BGA layouts, the EPM9560RC304-15, EPM9560RC304-10, and EPM9560RC304-20 speed-grade variants are functionally identical. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer page.
드롭인 대체품: EPM9560RC304C-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM9560RC304C-3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Device Type, Speed Grade, User I/O Pins, Usable Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM9560RC304-15
✅ 드롭인✓ 재고 있음
$9.4 / 개
데이터시트 보기 →EPM9560RC304-10
✅ 드롭인✓ 재고 있음
$17.6 / 개
데이터시트 보기 →EPM9560RC304-20
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EPM9560RC304-2
✅ 드롭인✓ 재고 있음
$55 / 개
데이터시트 보기 →EPM9560RC304-20N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EPM9560RC304-2N
✅ 드롭인✓ 재고 있음
$149 / 개
데이터시트 보기 →EPM9560RC304C-3 최대 정격 & 전기적 특성
| Family | MAX 9000 |
| Device Type | CPLD (EPLD) |
| Macrocells (Logic Elements) | 560 |
| Usable Gates | 12,000 |
| 패키지 | RBGGA-304 (Ceramic Ball Grid Array) |
| 핀 수 | 304 |
| User I/O Pins | 212 |
| Speed Grade | -3 (3 ns pin-to-pin, commercial) |
| 동작 온도 | 0 C to +70 C (Commercial) |
| 공급 전압 | 5 V |
| Programmability | In-system, non-volatile EEPROM |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Logic Blocks | Logic Array Blocks (LABs) with PIA interconnect |
| RoHS 상태 | unknown (legacy part, pre-RoHS era) |
| 실장 유형 | Surface Mount (BGA) |
EPM9560RC304C-3 rbgga-304 (ceramic ball grid array) 핀 구성 가이드
EPM9560RC304C-3(rbgga-304 (ceramic ball grid array) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM9560RC304C-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM9560RC304C-3 적합 용도: 6 애플리케이션s: Legacy Telecom Backplane Glue Logic, Industrial Control and Factory Automation, Address Decoding for Microprocessor Systems, Bus Interface Bridging (PCI / VME / ISA), Replacement of Discrete TTL/CMOS Glue Logic, Legacy Avionics and Military Systems.
Legacy Telecom Backplane Glue Logic
The EPM9560RC304C-3 is well suited to legacy telecom backplane glue-logic applications where it implements wide bus decoding, address mapping, and protocol-bridging functions between line cards and backplane connectors. With 212 user I/O pins and 12,000 usable gates, it can replace dozens of discrete 74-series TTL/CMOS parts in a single 304-pin BGA footprint, simplifying PCB layout and improving signal-integrity by eliminating long point-to-point traces. The device's 3 ns pin-to-pin delay enables clock-domain crossings and fast bus arbitration. As telecom systems have multi-decade service lives, the EPM9560RC304C-3 remains in active deployment in legacy ATM, SONET, and TDM switching equipment.
추천
Industrial Control and Factory Automation
The EPM9560RC304C-3 is widely used in industrial control and factory automation systems where its non-volatile EEPROM configuration eliminates the need for external boot PROMs and guarantees instant-on deterministic behavior at power-up. The 304-pin ceramic BGA package provides mechanical robustness against vibration and thermal cycling typical in factory environments, while the 0 C to +70 C commercial temperature grade covers most indoor control cabinets. The device implements PLC scan-engine glue logic, motor-control PWM gating, encoder decoding, and fieldbus (Profibus, Modbus) interface bridging. Legacy PLC and CNC systems continue to use EPM9560 parts because the design has been qualified for 10-20 year service lives.
추천
Address Decoding for Microprocessor Systems
The EPM9560RC304C-3 implements address decoding and chip-select generation for 32-bit and 64-bit microprocessor and DSP systems, replacing 5-10 discrete decoder/PLD chips with a single high-density CPLD. The 212 user I/O count supports multiple parallel chip-selects with separate enable and wait-state signals, while the 3 ns propagation delay is comfortably within a 33-50 MHz system-clock budget. The MAX 9000 architecture's deterministic timing model and per-output macrocell registers enable precise control of address-to-chip-select latency. Industrial PCs, embedded SBCs, and DSP evaluation boards used this device heavily during the Pentium-III / PowerPC era and many such systems remain in service.
추천
Bus Interface Bridging (PCI / VME / ISA)
The EPM9560RC304C-3 is used as a bus-interface bridge between PCI, VME, ISA, and local-processor buses in legacy embedded systems, arbitrating bus requests, generating interrupt vectors, and implementing DMA handshaking. The high I/O count (212 pins) and 3 ns tPD make it capable of supporting 33 MHz PCI bus cycles, while the 5 V I/O is directly compatible with classic PCI signaling levels. The MAX 9000 family was a popular choice for PCI bridge designs in the late 1990s because of its deterministic timing and in-system programmability for late-stage board bring-up fixes. Military and avionics VMEbus systems also deployed this part heavily.
추천
Replacement of Discrete TTL/CMOS Glue Logic
The EPM9560RC304C-3 is frequently used to consolidate 20-50 discrete 74LS, 74HC, 74FCT, and 74ABT logic chips into a single programmable device, dramatically reducing PCB area, power consumption, and assembly cost. With 12,000 usable gates, designers can absorb entire boards of random logic, muxes, latches, and small state machines. The MAX 9000 architecture preserves the in-system reprogrammability that designers relied on to fix logic bugs without board rework. Legacy designs in instrumentation, medical imaging, and military radios used this consolidation strategy extensively during the 1990s CPLD boom and remain in production today.
추천
Legacy Avionics and Military Systems
The EPM9560RC304C-3 in its ceramic BGA (RBGGA) package is qualified for many legacy avionics, military, and aerospace platforms where its hermetic ceramic packaging, wide operating temperature, and long-proven reliability are mandatory. The RBGGA package is preferred over plastic BGA in these applications for resistance to humidity, mechanical shock, and outgassing. Such systems are fielded for 20-30 year service lives, requiring long-term spare-part support. The EPM9560RC304C-3 has been deployed in radar signal processing, flight control computers, electronic warfare systems, and secure communications equipment. Cross-brand drop-in equivalents are not commonly available for military-qualified ceramic-BGA CPLDs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM9560RC304C-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM9560RC304-15 | EPM9560RC304-10 | EPM9560RC304-20 | EPM9560RC304-2 | EPM9560RC304-2N | EPM9560RC304-20N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | RBGGA-304 (Ceramic BGA) | RBGGA-304 (Ceramic BGA) - same | RBGGA-304 (Ceramic BGA) - same | RBGGA-304 (Ceramic BGA) - same | RBGGA-304 (Ceramic BGA) - same | RBGGA-304 (Ceramic BGA) - same | RBGGA-304 (Ceramic BGA) - same |
| Macrocells | 560 | 560 | 560 | 560 | 560 | 560 | 560 |
| Usable Gates | 12,000 | 12,000 | 12,000 | 12,000 | 12,000 | 12,000 | 12,000 |
| Speed Grade (tPD) | 3 ns | 15 ns | 10 ns | 20 ns | 2 ns | 2 ns (lead-free) | 20 ns (lead-free) |
| Operating Temperature | 0 C to +70 C (Commercial) | Industrial (extended) | Commercial | Commercial | Commercial | Commercial | Commercial |
| User I/O Pins | 212 | 212 | 212 | 212 | 212 | 212 | 212 |
| RoHS / Lead-Free Status | Unknown (legacy ceramic BGA) | Unknown | Unknown | Unknown | Unknown | Lead-free solder balls (N suffix) | Lead-free solder balls (N suffix) |
주요 차별점
- Highest-speed (-3, 3 ns tPD) MAX 9000 family variant in 304-pin ceramic BGA (vs EPM9560RC304-15)
- Ceramic BGA (RBGGA) for high-reliability applications (vs EPM9560ABC356-10)
- Largest density in MAX 9000 family (560 macrocells / 12,000 gates) (vs EPM9480RC240-20)
설계 노트
The EPM9560RC304C-3 is an obsolete part with no active factory production. When designing new boards or maintaining legacy systems, always qualify at least one slower speed-grade variant (e.g., EPM9560RC304-10 or EPM9560RC304-15) as a backup drop-in alternative in case the -3 variant becomes unavailable. The pinout is identical across speed grades; only the Quartus / MAX+PLUS II timing model needs to be recompiled. Slower grades are typically more available on the secondary market than the fastest -3 grade.
The 304-pin ceramic BGA (RBGGA) package has a different thermal-resistance profile than plastic BGA packages - typically theta-JA of 15-25 C/W with a proper thermal via array on the PCB. For high-utilization designs where all 560 macrocells toggle simultaneously, the junction temperature can rise substantially. Designers should follow Altera's recommended PCB footprint including a thermal-ball pattern and at least 4 thermal vias under the die, even though the RBGGA package is hermetic. Industrial-temperature variants (e.g., EPM9560RC304-15) are recommended for environments above 70 C.
The 304-ball ceramic BGA requires a precise PCB land pattern with non-solder-mask-defined (NSMD) pads of approximately 0.6 mm diameter and 1.0 mm pitch. The PCB must be designed with at least 6 layers, with dedicated ground and power planes under the BGA to provide low-impedance returns for the 212 high-speed I/O signals. Signal traces should be length-matched within 2-3 mm if used as bus-interface signals. Do not route signals through the BGA pin field - escape routes should fan out to the perimeter before any horizontal routing.
규정 준수 정보
The EPM9560RC304C-3 is a legacy part released in the 1990s, before RoHS Directive 2002/95/EC took effect. RoHS/REACH compliance is unknown because the part is no longer actively maintained by Altera/Intel. N-suffix variants (e.g., EPM9560RC304-20N) indicate lead-free solder balls but full RoHS compliance of the ceramic BGA substrate is not certified. AEC-Q100 does not apply as this is not an automotive-qualified part.
