GX36420 - 64 Gbps Quad Linear TIA for 400G/600G Coherent | Renesas
부품 번호: GX36420 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $135.92 | $135.92 |
| 10 | $128.5 | $1,285.00 |
| 100 | $118.75 | $11,875.00 |
| 500 | $105.2 | $52,600.00 |
| 1,000 | $92.4 | $92,400.00 |
GX36420 개요
A transimpedance amplifier (TIA) is the analog front-end stage that converts the small photocurrent from a photodiode into a usable differential voltage swing. Quad linear TIAs sit at the input of coherent DSP-based optical modules (typically CFP2-DCO, CFP2-ACO, OSFP, QSFP-DD) where four parallel optical channels (two polarizations x in-phase/quadrature) feed the analog-to-digital converter. The GX36420 belongs to the linear-TIA family because it preserves amplitude information for the downstream high-speed ADC, as opposed to a limiting TIA which would clip the signal.
Key features of the GX36420 include 64 Gbps per-lane linear bandwidth, four-channel differential outputs, integrated DC bias and gain-control interface, and a single-die footprint that minimizes channel-to-channel skew in coherent optical assemblies. Renesas (formerly IDT) has shipped the device in volume to optical-module OEMs building 400ZR / 400ZR+ / OpenZR+ transceivers.
The GX36420 is fabricated in a high-speed SiGe BiCMOS process chosen for low input-referred noise current, broadband transimpedance flatness, and low power per lane. On-die DC control circuitry lets the host DSP or microcontroller program TIA gain, peaking, and bandwidth over a serial interface, simplifying module calibration during production test.
Typical applications for the GX36420 include 400G/600G coherent optical transceivers (CFP2-DCO, OSFP, QSFP-DD), DWDM line-card receivers, pluggable coherent modules for long-haul and metro DCI links, and laboratory test equipment for coherent optical signal analysis. The quad topology is preferred for dual-polarization I/Q receivers where matched channel response is critical.
Design consideration: The GX36420 is a bare die (DNT suffix = die, no test package). PCB integration must use a hybrid substrate or chip-on-board process with controlled-impedance differential traces to the downstream ADC. RF grounding, supply decoupling, and thermal management are the primary design risks for the bare-die form factor.
This page synthesizes distributor stock levels, package notes, and design considerations that go beyond the short-form datasheet, helping optical-module hardware engineers evaluate the GX36420 for next-generation coherent transceiver designs.
드롭인 대체품: GX36420 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: GX36420 (동일 폼 팩터 및 풋프린트) — 차이점: Number of Channels, Target Application, Device Type, MSL Level, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
GX36420-DNT
✅ 드롭인✓ 재고 있음
$135.92 / 개
데이터시트 보기 →GX36420-F-DNT
✅ 드롭인✓ 재고 있음
$359 / 개
데이터시트 보기 →GN2555
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
GX36420 최대 정격 & 전기적 특성
| Device Type | Linear Transimpedance Amplifier (TIA) |
| Number of Channels | 4 (quad: XI, XQ, YI, YQ) |
| Per-Lane Data Rate | 64 Gbps (symbol rate, NRZ/PAM) |
| Aggregate Bandwidth | 256 Gbps (4 x 64 Gbps) |
| 토폴로지 | Linear (preserves amplitude for coherent ADC) |
| Output Interface | Differential, per lane |
| Integrated DC Control | Yes (on-die digital control interface) |
| Target Application | 400G / 600G coherent optical receivers |
| Form Factor | Bare die (DNT = die, no package) |
| Process Technology | SiGe BiCMOS |
| RoHS 상태 | Compliant (assumed; bare die) |
| MSL 레벨 | In-pack die / wafer |
GX36420 standard 핀 구성 가이드
GX36420(standard 패키지)의 핀 구성입니다. 이 아날로그 부품에는 입력, 출력, 전원 공급 핀이 있습니다. 오프셋 널, 보상, 인에이블 핀 구성은 제조사 데이터시트를 참조하십시오. 신호 컨디셔닝 및 증폭기 회로에 이상적입니다.
다음에 대한 상세 핀아웃 데이터 없음: GX36420.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
GX36420 적합 용도: 6 애플리케이션s: 400G/600G Coherent Optical Transceiver, DWDM Line-Card Receiver, Pluggable Coherent Module (CFP2-DCO, OSFP, QSFP-DD), Data Center Interconnect (DCI) Long-Haul / DCI, Optical Test and Measurement Instrumentation, Coherent LiDAR / Sensing Front-End.
400G/600G Coherent Optical Transceiver
The GX36420's four 64 Gbps linear TIA lanes match the symbol rate and dual-polarization I/Q architecture of 400G and 600G coherent pluggable modules. The four-channel integration (XI/XQ/YI/YQ) maps directly to a dual-polarization coherent mixer assembly, simplifying the analog front-end. Linear (non-limiting) topology preserves amplitude information for downstream soft-decision FEC DSPs used in OpenZR+, 400ZR+, and Open ROADM. On-die DC control lets the host DSP program gain and bandwidth during module calibration.
추천
DWDM Line-Card Receiver
Long-haul and metro DWDM line cards need quad linear TIAs at the input of coherent receivers to preserve amplitude for digital signal processing. The GX36420's 64 Gbps per lane supports 64 GBd operation required by next-generation 600G/800G line-side wavelengths. SiGe BiCMOS technology provides the noise figure and bandwidth flatness needed for cascaded DWDM amplifier chains. Bare-die form factor allows hybrid integration with a coherent mixer subassembly inside the line card housing.
추천
Pluggable Coherent Module (CFP2-DCO, OSFP, QSFP-DD)
Pluggable coherent modules (CFP2-DCO, OSFP, QSFP-DD) need small-footprint quad TIAs that fit inside the module housing without compromising performance. The GX36420 integrates four TIAs and DC control on a single die, reducing module board area versus discrete quad TIA designs. Per-lane 64 Gbps rate supports 400ZR / 400ZR+ / OpenZR+ optical specs. The SiGe BiCMOS process keeps per-lane power low enough for pluggable thermal budgets.
추천
Data Center Interconnect (DCI) Long-Haul / DCI
DCI links between data centers use coherent optics at 100G/200G/400G to span 80-120 km without amplification. The GX36420's quad 64 Gbps linear TIA front-end preserves the signal integrity needed for high-baud-rate transmission over DCI distances. Linear response supports both QPSK and 16-QAM modulation formats, allowing the same hardware to scale from 100G to 400G. Bare-die integration enables compact DCI module designs at competitive cost.
추천
Optical Test and Measurement Instrumentation
Lab instruments analyzing 64 GBd coherent optical signals need linear TIAs with broadband flat response and low noise. The GX36420's 64 Gbps per-lane bandwidth and linear topology allow direct sampling of coherent optical constellations in optical test sets. Four matched channels enable simultaneous I/Q analysis on dual-polarization signals. The integrated DC control simplifies gain-ranging during automated test calibration procedures.
추천
Coherent LiDAR / Sensing Front-End
Emerging FMCW and coherent LiDAR architectures use coherent optical detection similar to telecom coherent receivers. The GX36420's four-channel linear TIA topology supports dual-polarization coherent detection required by FMCW LiDAR signal processing. 64 Gbps bandwidth supports high-resolution chirp processing for long-range LiDAR. Linear response preserves the beat-frequency amplitude information used for velocity and distance extraction.
추천
추천 제품 요약
엔지니어링 참조 데이터: GX36420 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | GX36420-DNT | GX36420-F-DNT | GN2555 |
|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics (legacy Semtech) |
| Package | Bare Die (DNT) | Bare Die (DNT) - same | Bare Die (DNT) - same | Bare Die - same form factor |
| Topology | Linear (amplitude-preserving) | Linear | Linear | Linear |
| Integrated DC Control | Yes | Yes | Yes | Yes |
| Target Application | 400G/600G coherent | 400G/600G coherent | 400G/600G coherent | Coherent optical |
주요 차별점
- 64 Gbps per-lane linear quad TIA with on-die DC control (vs Discrete quad-TIA designs)
- Bare-die form factor optimized for hybrid integration (vs Packaged coherent TIAs)
- Linear (amplitude-preserving) topology for coherent DSP (vs Limiting TIAs used in OOK NRZ links)
설계 노트
The GX36420-DNT is supplied as a bare die (DNT = die, no package). Hybrid integration on a ceramic or silicon interposer is required, with controlled-impedance differential traces (typically 100 ohm differential) from the die pads to the downstream coherent ADC. Wire bonds should be kept short (under 1 mm) to maintain 64 GHz bandwidth and avoid resonance above the Nyquist band.
Estimated: at 3.3 V supply and approximately 250 mW per lane (1 W total per die), the bare die junction temperature will be strongly influenced by the substrate thermal path. Ensure the optical subassembly housing provides a thermal resistance of less than 20 C/W to ambient to keep Tj below 110 C in a typical 70 C pluggable-module environment.
The bare-die format requires an NDA-protected controlled datasheet from Renesas; do not assume the public short-form datasheet lists full DC-control register maps. Confirm bump/pad layout, ESD rating (typically <500 V HBM for bare-die coherent parts), and recommended storage conditions (nitrogen-purged, MSL-rated) before PCB assembly. Verify the DC-control serial-interface protocol matches your host DSP/MCU before committing to layout.
규정 준수 정보
Bare die part (DNT suffix). RoHS compliance assumed per Renesas product line policy; AEC-Q100 not applicable for telecom coherent die. Reach and conflict-minerals compliance per Renesas corporate policy.
