HMA84GR7CJR4N-PB - 32GB DDR4-2933 ECC RDIMM | SK hynix | Server Memory
부품 번호: HMA84GR7CJR4N-PB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $155 | $155.00 |
| 10 | $149 | $1,490.00 |
| 100 | $142 | $14,200.00 |
| 500 | $136 | $68,000.00 |
| 1,000 | $129 | $129,000.00 |
HMA84GR7CJR4N-PB 개요
An RDIMM (Registered DIMM) is a server memory module that buffers the address and command signals through a register chip before they reach the DRAM devices. This buffering reduces the electrical load presented to the memory controller, allowing more DIMMs per channel and higher capacities than unbuffered UDIMMs. Within the memory hierarchy, RDIMM belongs to the ECC registered DDR4 SDRAM module family used in enterprise servers, workstations, and storage systems.
Key features include DDR4-2933 data rate (PC4-23466), 1.2 V operating voltage, dual rank x4 organization using 36 FBGA (78-ball) 2Gx4 DDR4 devices, on-module ECC for single-bit error correction, and JEDEC-standard 288-pin DIMM edge connector with registered/command-address buffering. The C-die (JR) silicon generation supports the 2933 MT/s speed bin with CL21-class latency typical for this bin.
Architecturally, the module places a register and data buffer between the memory controller and the DRAM arrays, isolating capacitive loading and enabling reliable operation at 8 DIMMs per channel on two-socket platforms. The x4 device organization pairs with the ECC logic so chip-kill-class correction is possible on supporting controllers.
Typical applications include enterprise 2U/1U rack servers, virtualization hosts, database and analytics nodes, and OEM server builds from Dell, HPE, and Lenovo that accept JEDEC-standard PC4-23466R RDIMMs.
Design consideration: this module must only be installed in platforms that explicitly support RDIMMs and the DDR4-2933 speed bin; it will typically down-clock on 2666 MT/s-only platforms. Verify BIOS/QDL support before mixing ranks or generations.
This page adds value beyond the manufacturer datasheet by synthesizing drop-in alternatives, OEM cross-references (Dell 99L0497, HPE P07646-B21, Lenovo 4X77A08633), pricing context, and practical compatibility notes in one place.
드롭인 대체품: HMA84GR7CJR4N-PB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: HMA84GR7CJR4N-PB (동일 폼 팩터 및 풋프린트) — 차이점: Data Rate, ECC, Organization, Form Factor, Memory Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
HMA84GR7CJR4N-WM
✅ 드롭인✓ 재고 있음
$230.6818 / 개
데이터시트 보기 →HMA84GR7CJR4N-XN
✅ 드롭인✓ 재고 있음
$377.3438 / 개
데이터시트 보기 →HMA84GR7CJR4N-VK
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTA18ASF4G72AZ-2G9B1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M393A4K40DB3-CWE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
KSM29RD8/32ME
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
HMA84GR7CJR4N-PB 최대 정격 & 전기적 특성
| Module Type | DDR4 ECC Registered DIMM (RDIMM) |
| Capacity | 32 GB |
| 데이터 속도 | DDR4-2933 (PC4-23466) |
| 메모리 구성 | 4G x 72 |
| Ranks | 2 (Dual Rank, 2Rx4) |
| DRAM Devices | 36 FBGA (78-ball) 2Gx4, 8Gb C-die |
| Operating Voltage | 1.2 V |
| Form Factor | 288-pin DIMM |
| ECC | Yes (registered with ECC) |
| Buffering | Registered / command-address buffered |
| Die Generation | C-die (JR) |
| Finish | Pb-free (PB suffix) |
| JEDEC Compliance | JEDEC-standard DDR4 RDIMM |
| 실장 유형 | Slot-mounted server DIMM |
| RoHS 상태 | Pb-free suffix (PB) |
HMA84GR7CJR4N-PB standard 핀 구성 가이드
HMA84GR7CJR4N-PB(standard 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: HMA84GR7CJR4N-PB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
HMA84GR7CJR4N-PB 적합 용도: 6 애플리케이션s: Enterprise Rack Servers, Virtualization Hosts, Database and Analytics Nodes, OEM Server Upgrades (Dell/HPE/Lenovo), Storage and Backup Systems, Workstations and Edge Compute.
Enterprise Rack Servers
The HMA84GR7CJR4N-PB is purpose-built for 1U/2U enterprise rack servers from Dell, HPE, and Lenovo that accept JEDEC-standard 288-pin DDR4 RDIMMs. Its 32 GB capacity and DDR4-2933 data rate (PC4-23466R) provide 23.4 GB/s per module of theoretical bandwidth at 1.2 V, while registered command-address buffering keeps electrical loading low enough for fully populated channels (typically 8 DIMMs per channel on two-socket platforms). The dual-rank 2Rx4 organization improves memory-level parallelism versus single-rank modules at the same frequency, and ECC protects against single-bit errors that could otherwise crash long-running services. Mixing speed bins causes all channels to train to the lowest common speed, so populate uniformly.
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Virtualization Hosts
For VMware ESXi, KVM, or Hyper-V consolidation hosts, memory capacity per socket directly caps VM density, and the 32 GB per-module density of the HMA84GR7CJR4N-PB lets a dual-socket server reach 512 GB (16 slots) or 1 TB (32 slots) with a single SKU. ECC registered operation is essential here: an uncorrected single-bit error can halt a hypervisor running dozens of guest machines. The x4 device topology supports advanced correction (SDDC/lockstep) on supported controllers, further improving reliability versus x8 modules. At DDR4-2933, sustained bandwidth is sufficient for typical mixed virtual workloads; for bandwidth-bound guests, prefer identical dual-rank modules across all channels to maximize interleaving.
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Database and Analytics Nodes
In-memory databases (SAP HANA-class, Redis, MemSQL) and analytics engines are limited by both RAM capacity and bandwidth. The HMA84GR7CJR4N-PB contributes 32 GB at DDR4-2933 per module; populating all channels with dual-rank modules enables the memory controller to interleave across ranks and channels, approaching the platform's peak bandwidth. ECC is non-negotiable for transactional databases, and the registered interface maintains signal integrity at high slot counts, which unbuffered UDIMMs cannot support. For OEM-locked database appliances from HPE or Lenovo, this module maps directly to OEM SKUs such as P07646-B21 and 4X77A08633, simplifying fleet-standard memory procurement.
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OEM Server Upgrades (Dell/HPE/Lenovo)
Field upgrades of installed server fleets are a primary use case for this exact part number. Cross-reference data confirms that Dell 99L0497-001.A00, HPE P07646-B21, and Lenovo 4X77A08633 are OEM brandings of SK hynix HMA84GR7CJR4N-family modules, so the bare MPN is hardware-identical to the boxed OEM upgrade at a lower price point. Because it is a JEDEC-standard 288-pin RDIMM, installation requires only that the platform support RDIMMs and the DDR4-2933 bin; on 2666-only platforms the module down-clocks automatically with no configuration change. Always match rank and speed class when adding modules to existing populated channels to avoid asymmetric interleaving.
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Storage and Backup Systems
Enterprise storage controllers, NAS heads, and backup appliances rely on large host-side caches where ECC memory prevents silent data corruption in cached writes. The HMA84GR7CJR4N-PB's 32 GB capacity per module lets storage nodes reach multi-hundred-GB cache footprints without exhausting DIMM slots, and the registered interface supports the high slot counts typical of 2U storage platforms. At 1.2 V and DDR4-2933, power per module is modest relative to the capacity delivered, helping keep dense chassis within thermal budgets. x4 ECC organization adds another integrity layer on controllers supporting advanced RAS features, protecting data between disk and cache.
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Workstations and Edge Compute
High-end workstations and edge compute appliances built on server-class chipsets (Intel Xeon W/Scalable, AMD EPYC embedded) that accept RDIMMs can use the HMA84GR7CJR4N-PB for 32 GB per slot of ECC-protected capacity. For CAD, simulation, and AI inference at the edge, dual-rank DDR4-2933 provides strong sustained bandwidth, while ECC prevents error-induced simulation divergence on multi-day compute jobs. Note that consumer desktop boards with UDIMM-only slots are not compatible - this module will not boot there. Edge enclosures with limited airflow benefit from the module's standard-height, single-sided-register thermal profile typical of 2Rx4 RDIMMs.
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추천 제품 요약
엔지니어링 참조 데이터: HMA84GR7CJR4N-PB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | HMA84GR7CJR4N-WM | HMA84GR7CJR4N-XN | MTA18ASF4G72AZ-2G9B1 | M393A4K40DB3-CWE | KSM29RD8/32ME |
|---|---|---|---|---|---|---|
| Package | 288-pin DDR4 RDIMM | 288-pin DDR4 RDIMM - same | 288-pin DDR4 RDIMM - same | 288-pin DDR4 RDIMM - same | 288-pin DDR4 RDIMM - same | 288-pin DDR4 RDIMM - same |
| Brand | SK hynix | SK hynix | SK hynix | Micron Technology | Samsung Electronics | Kingston |
| Capacity | 32 GB | 32 GB | 32 GB | 32 GB | 32 GB | 32 GB |
| Data Rate | DDR4-2933 (PC4-23466R) | DDR4-2933 | DDR4-3200 | DDR4-2933 | DDR4-3200 | DDR4-2933 |
| Organization / Ranks | 4G x 72, 2Rx4 | 4G x 72, 2Rx4 | 4G x 72, 2Rx4 | 4G x 72, 2Rx4 | 4G x 72, 2Rx4 | 4G x 72, 2Rx4 |
| Operating Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| ECC Registered | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Native DDR4-2933 speed bin (vs HMA84GR7CJR4N-VK)
- Direct OEM channel cross-references (vs MTA18ASF4G72AZ-2G9B1)
- Cost efficiency at same bin vs faster variant (vs HMA84GR7CJR4N-XN)
설계 노트
Never install this RDIMM in a platform that only supports UDIMMs or LRDIMMs - RDIMMs and LRDIMMs cannot be mixed, and unbuffered slots will not train registered modules at all. Verify the server QVL before purchase, especially on OEM-locked platforms (HPE, Dell iDRAC/Lifecycle memory validation). Mixing speed bins (-VK 2666 with this 2933 part) causes all channels to run at the slower speed, so keep speed classes uniform per system. Mixing ranks within a channel is generally allowed but may reduce interleaving efficiency.
DDR4 RDIMMs at 1.2 V typically draw roughly 3-5 W per module under load (estimate based on standard 32GB 2Rx4 RDIMM power budgets, not a datasheet figure). In dense 1U platforms with 16-24 modules, aggregate memory power can reach 100 W or more, so verify chassis airflow across DIMM slots and keep inlet air within the module's specified operating temperature. Deploying all channels at DDR4-3200 variants (-XN) slightly increases power versus 2933 operation.
When adding modules to an already populated server, match rank count (2Rx4) and speed class to existing modules so the memory controller can maintain symmetric interleaving across channels. Install pairs or quads per the platform's population rules (white slots first on most OEM boards). After installation, confirm training results and ECC status in BIOS or iDRAC/OneIR logs, and run a full memory diagnostic (for example the OEM offline diagnostic) before returning the system to production.
규정 준수 정보
The -PB suffix denotes Pb-free finish. Full RoHS/REACH declarations were not present in the provided web data.
