LFE5U-45F-8BG256I - 44K LUT ECP5 FPGA, 256-BGA Industrial | Lattice
부품 번호: LFE5U-45F-8BG256I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $33.47 | $33.47 |
| 10 | $30.12 | $301.20 |
| 100 | $26.78 | $2,678.00 |
| 250 | $24.5 | $6,125.00 |
| 1,000 | $21.85 | $21,850.00 |
LFE5U-45F-8BG256I 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic function is defined by a user-programmed configuration bitstream rather than fixed at the fab. The LFE5U sits within the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs trade raw performance-per-watt for reconfigurability, making them ideal for evolving interfaces, parallel DSP pipelines, and glue logic that must adapt across product revisions. The ECP5 family in particular uses a 40 nm process and a LUT4-based fabric, optimizing logic density per mW versus prior Lattice generations.
Key specifications include 44,000 LUT4 elements distributed across the fabric, multiple 18 x 18 multipliers for fixed-point DSP, embedded block RAM, and SERDES-capable I/O structures on selected package options. The industrial temperature grade ("I" suffix) extends operation to -40C to +100C, well-suited for factory automation, automotive peripherals, and outdoor networking equipment. The 256-ball caBGA package (17 mm x 17 mm body, 1.0 mm ball pitch) is footprint-compatible with other ECP5 BG256 devices, simplifying PCB reuse across density grades.
Architecturally, the ECP5 fabric uses LUT4-based logic slices, sysDSP blocks for multiply-accumulate, and sysMEM EBR (Embedded Block RAM) for distributed memory. Bitstream configuration is loaded through SPI, JTAG (IEEE 1149.1 boundary-scan), or dual-boot/multi-boot modes, allowing field upgrades via TransFR (Transparent Field Reconfiguration) without halting downstream logic.
Typical applications include low-power video bridging (MIPI CSI-2 to parallel RGB), small-cell baseband signal processing, industrial motor control loops, sensor aggregation hubs, and as a companion logic device to higher-tier processors. Designers value the ECP5 series for its sub-1W active power and instant-on capability for sleep-to-active transitions in battery-powered IoT.
When designing with this FPGA, plan power-rail sequencing (1.1V core, 2.5V/3.3V auxiliary) and reserve decoupling capacitance per Lattice hardware design guidelines. Verify that JTAG and SPI flash footprints match the chosen configuration topology before layout commit; re-use is straightforward when migrating across ECP5 LUT densities within the same BG256 package.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: LFE5U-45F-8BG256I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: LFE5U-45F-8BG256I (동일 폼 팩터 및 풋프린트) — 차이점: Core Voltage, Family, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
LFE5U-45F-8BG256C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE5U-25F-8BG256I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE5U-85F-8BG256I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE5U-12F-8BG256I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LFE5UM-45F-8BG256I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LCMXO3LF-6900E-5MG256I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$15.68 / 개
데이터시트 보기 →LFE5U-45F-8BG256I 최대 정격 & 전기적 특성
| Family | LatticeECP5 |
| Series | LFE5U |
| Logic Elements / LUTs (4-input) | 44000 LUTs (nominal) |
| Total Block RAM | 1944 Kbit (approx. 1,990,656 bits) |
| User I/O (this package) | 197 |
| Core Voltage | 1.1 V |
| 동작 온도 | -40C to +100C (Industrial) |
| 패키지 | 256-LFBGA (caBGA, 17x17 mm, 1.0 mm pitch) |
| 실장 유형 | Surface Mount (BGA) |
| Process Node | 40 nm |
| MSL 레벨 | 3 |
| Peak Reflow Temperature | 260 C |
| Time at Peak Reflow | 30 s |
| Terminal Finish | Tin-Silver-Copper (e1 per JESD-609) |
| Configuration Interface | JTAG (IEEE 1149.1), SPI, Dual-Boot / Multi-Boot |
| TransFR (Transparent Field Reconfiguration) | Supported |
| Boundary Scan | IEEE 1149.1 compliant |
| RoHS 상태 | Compliant |
| 수명 주기 상태 | Active |
LFE5U-45F-8BG256I 256-lfbga (cabga, 17x17 mm, 1.0 mm pitch) 핀 구성 가이드
LFE5U-45F-8BG256I(256-lfbga (cabga, 17x17 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: LFE5U-45F-8BG256I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
LFE5U-45F-8BG256I 적합 용도: 7 애플리케이션s: Embedded Video Bridge (MIPI CSI-2 to Parallel RGB), Industrial Motor Control and Drive Logic, Sensor Aggregation Hub for IoT Edge Devices, Small-Cell and Wireless Baseband Pre-Processing, LED Display and Lighting Control, Automotive Companion Logic and Interface Bridging, Test & Measurement Instrumentation Front-End.
Embedded Video Bridge (MIPI CSI-2 to Parallel RGB)
The LFE5U-45F-8BG256I is well-suited for embedded video bridging between MIPI CSI-2 image sensors and parallel RGB displays or processors. With 44000 LUTs and 197 user I/O, the device can absorb the lane-deserialization logic, pixel FIFOs, and timing-controller state machine in a single fabric, while the BG256 package provides enough balls for both the CSI-2 differential pairs and the parallel RGB data + sync pins. Designers typically instantiate soft CSI-2 RX IPs and soft video-timing controllers, achieving sub-100 mW active power and bypassing the need for an external bridge ASIC. Industrial temperature grade allows deployment in outdoor or vehicle-mounted camera systems.
추천
Industrial Motor Control and Drive Logic
The LFE5U-45F-8BG256I delivers the determinism and parallel DSP capacity required for field-oriented control (FOC) loops driving 3-phase BLDC or PMSM motors. The fabric's 18x18 multipliers and embedded block RAM accelerate the Clarke/Park transforms, SVPWM generation, and PI controller arithmetic at PWM rates up to several hundred kHz. The 197 user I/O accommodate multi-axis encoder feedback (QEP), Hall sensors, and PWM outputs without external mux logic. The industrial -40C to +100C grade ensures stable operation across factory-floor thermal envelopes, while the caBGA package provides robust mechanical attachment for high-vibration mounting typical of industrial servo systems.
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Sensor Aggregation Hub for IoT Edge Devices
The LFE5U-45F-8BG256I serves as a sensor aggregation hub in IoT edge devices, consolidating I2C/SPI/UART sensor buses, applying on-fabric pre-processing (filtering, thresholding, event detection), and forwarding only relevant data upstream to a host MCU or wireless module. The 1944 Kbit of embedded block RAM provides ample buffer space for time-stamping sensor bursts, while the 197 I/O accommodate 10+ sensor channels plus control GPIOs. Designers pair the ECP5 with a low-power host MCU, putting the ECP5 in sleep when sensor traffic is idle - the family's fast wake-up from 1.1V core makes it ideal for duty-cycled battery-powered sensor nodes.
추천
Small-Cell and Wireless Baseband Pre-Processing
The LFE5U-45F-8BG256I is deployed in small-cell baseband pre-processing, where it handles front-end sample-rate conversion, channel filtering, and crest-factor reduction before the data is forwarded to a host processor. The fabric's high-speed I/O structures support LVDS-based ADC interfaces at hundreds of MSPS, while the embedded multipliers accelerate polyphase filter banks. Industrial temperature grade and low sub-watt active power make it suitable for pico-cell and femto-cell deployments where thermal envelope is constrained.
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LED Display and Lighting Control
The LFE5U-45F-8BG256I drives large LED wall and architectural lighting installations, where each output channel controls PWM dimming for thousands of LEDs. The high I/O count (197 pins) accommodates long data chains with minimum external mux logic, while the 44000 LUTs handle per-channel gamma correction, color-space conversion, and frame buffering in embedded block RAM. The industrial temperature grade supports outdoor facade lighting and stage-rig deployments where ambient temperatures swing widely.
추천
Automotive Companion Logic and Interface Bridging
The LFE5U-45F-8BG256I serves as automotive companion logic in infotainment and ADAS subsystems, bridging between automotive SerDes links, Ethernet PHYs, and the host SoC. The fabric's high I/O density supports multiple CAN-FD or FlexRay interfaces alongside LVDS display links, while the LUT4 fabric implements custom protocol translation glue logic. Industrial temperature grade is appropriate for cabin electronics; for under-hood or powertrain applications designers should verify the specific Lattice Q-grade part numbering.
추천
Test & Measurement Instrumentation Front-End
The LFE5U-45F-8BG256I is well-suited for test-and-measurement front-end signal conditioning, providing custom triggering, count-and-time logic, and protocol-aware pattern generation. The 197 I/O accommodate multi-standard digital I/O banks (LVCMOS 1.2V to 3.3V), while the multipliers implement on-sine FFT pre-stages that offload the host processor. The caBGB package supports high-density bench-instrument PCB layouts.
추천
추천 제품 요약
엔지니어링 참조 데이터: LFE5U-45F-8BG256I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | LFE5U-45F-8BG256C | LFE5U-25F-8BG256I | LFE5U-85F-8BG256I | LFE5U-12F-8BG256I | LFE5UM-45F-8BG256I |
|---|---|---|---|---|---|---|
| Package | 256-LFBGA (caBGA, 17x17 mm) | 256-LFBGA (caBGA) - same | 256-LFBGA (caBGA) - same | 256-LFBGA (caBGA) - same | 256-LFBGA (caBGA) - same | 256-LFBGA (caBGA) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| LUTs (4-input) | 44,000 | 44,000 - same | 25,000 (-43%) | 84,000 (+91%) | 12,000 (-73%) | 44,000 - same |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Core Voltage | 1.1 V | 1.1 V - same | 1.1 V - same | 1.1 V - same | 1.1 V - same | 1.1 V - same |
| Family | ECP5 (LFE5U) | ECP5 (LFE5U) | ECP5 (LFE5U) | ECP5 (LFE5U) | ECP5 (LFE5U) | ECP5-5G (LFE5UM) |
| Embedded Block RAM | 1944 Kbit | 1944 Kbit - same | 1086 Kbit (-44%) | 3840 Kbit (+97%) | 756 Kbit (-61%) | 1944 Kbit - same |
주요 차별점
- Mid-density 44K LUT sweet spot in the ECP5 family (vs LFE5U-25F-8BG256I (25K LUTs))
- Industrial temperature grade vs commercial (vs LFE5U-45F-8BG256C (Commercial))
- Lower power than higher-density ECP5 parts (vs LFE5U-85F-8BG256I (84K LUTs))
- Upward-compatible with ECP5-5G SERDES variant (vs LFE5UM-45F-8BG256I)
설계 노트
The LFE5U-45F-8BG256I requires three power rails: 1.1V core (VCC), 2.5V or 3.3V auxiliary (VCCAUX/VCCIO), and a separate VCCIO for each I/O bank. Per the LatticeECP5 hardware design guide, place at least one 10uF bulk + four 0.1uF decoupling caps per supply pin group; keep trace lengths under 5 mm. Power sequencing matters: VCCAUX/VCCIO must ramp before or simultaneously with VCC to avoid I/O latch-up. For battery-powered designs, leverage the ECP5 sleep mode (<5 mW) and instant-on wake-up for duty-cycled operation.
In the 256-LFBGA (caBGA) package, the thermal pad on the bottom of the BGA must be soldered to a thermally-connected copper pour on the PCB to dissipate the FPGA's active power (typically 0.5-1W active). Lattice recommends a minimum 4-layer PCB stack-up with at least 1 square inch of unbroken ground copper under the BGA to keep junction temperature below 100C. In industrial enclosures without forced airflow, derate the operating frequency or reduce logic utilization if junction temperature approaches the 100C industrial limit.
BG256 (1.0 mm ball pitch) requires high-quality PCB fab with microvia stack-ups and ENIG or immersion-silver surface finish for reliable BGA soldering. Break out the inner balls using vias-in-pad with filled-and-capped plating, or use dog-bone fanouts if PCB cost is constrained. Match differential-pair length within 5 mils for SERDES-capable balls (if migrating to LFE5UM-45F-8BG256I variant). Verify the chosen PCB house's BGA pitch process (most handle 1.0 mm pitch; 0.8 mm pitch requires advanced fab).
The LFE5U-45F-8BG256I supports JTAG (IEEE 1149.1), SPI, and dual-boot/multi-boot configuration with TransFR (Transparent Field Reconfiguration). For production programming, place a footprint for a SPI flash (e.g., 16 Mbit Winbond or Macronix) adjacent to the BGA and route the SPI signals with length matching. JTAG should be brought out to a 2x5 1.27 mm header for factory programming and boundary-scan testing.
Common pitfalls when designing with the LFE5U-45F-8BG256I include: (1) forgetting to connect unused I/O banks to a valid VCCIO - per Lattice, all VCCIO pins must be powered even if the bank has no I/O; (2) exceeding the 197-user-I/O ball count when assigning pins (use Lattice Diamond PinPlanner to verify); (3) assuming pinout compatibility with ECP5-5G (LFE5UM) - the SERDES balls differ in function; (4) using a non-Lattice SPI flash that does not support the dual-boot bitstream format.
규정 준수 정보
RoHS compliant per Lattice product page; e1 (Tin-Silver-Copper) terminal finish per JESD-609; MSL-3 floor life 168 hours. AEC-Q100 not applicable for this industrial-grade (non-automotive-qualified) Lattice part number.
