M7AFS600-2FG256 - Fusion FPGA, ARM CoreMP7, 600K Gates | Microchip
부품 번호: M7AFS600-2FG256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $171.5 | $1,715.00 |
| 100 | $158.6 | $15,860.00 |
| 500 | $146.2 | $73,100.00 |
| 1,000 | $135.1 | $135,100.00 |
M7AFS600-2FG256 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks and reconfigurable interconnects that the designer programs to implement custom digital circuits. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), above CPLDs in density and below ASICs in unit cost efficiency. The Fusion family from Actel (now Microchip) is unique in combining flash-based FPGA fabric, an ARM hard core, and mixed-signal analog peripherals in a single chip, eliminating the need for external configuration devices.
Key features of the M7AFS600-2FG256 include the ARM7-class CoreMP7 hard processor running system logic, 600K system gates of flash-based fabric, 119 available user I/O in the 256-ball FG256 footprint, and non-volatile flash configuration that makes the device instantly operational at power-up with no external boot PROM. Flash programming technology also provides inherent resistance to configuration data corruption and single-event effects compared to SRAM FPGAs.
Technically, the Fusion fabric is built on Actel's proven flash-switch architecture at the 130 nm node, combining look-up-table logic, embedded flash RAM blocks, and analog conditioning blocks. The -2 speed grade defines the timing bin for worst-case propagation delays, and the 1.5V core keeps dynamic power moderate while supporting 3.3V I/O signaling.
Typical applications include industrial automation and motor control, power supply monitoring and management, portable instrumentation, aerospace and defense subsystems, and medical equipment where mixed-signal integration and instant-on behavior are required.
A key design consideration: the FG256 (17x17 mm) package offers fewer I/O than the FG484 variant, so verify that 119 I/O satisfies your pin budget before layout freeze.
This page synthesizes verified distributor listings, drop-in alternatives from the Microchip Fusion family, pricing tiers, and practical design guidance not found in the manufacturer datasheet.
드롭인 대체품: M7AFS600-2FG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M7AFS600-2FG256 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, System Gates, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M7AFS600-2FGG256
✅ 드롭인✓ 재고 있음
$274.05 / 개
데이터시트 보기 →M7AFS600-FGG256I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M7AFS600-1FG256I
✅ 드롭인✓ 재고 있음
$308.6 / 개
데이터시트 보기 →M7AFS600-1FGG256
✅ 드롭인✓ 재고 있음
$92 / 개
데이터시트 보기 →M7AFS600-FG256
✅ 드롭인✓ 재고 있음
$198.75 / 개
데이터시트 보기 →M7AFS600-FG256I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M7AFS600-2FG256 최대 정격 & 전기적 특성
| Family | Fusion (Actel/Microsemi/Microchip) |
| System Gates | 600000 |
| Embedded Processor | ARM CoreMP7 |
| On-Chip Flash RAM | 110592 bit |
| Number of I/O | 119 |
| Core Voltage | 1.5 V |
| Speed Grade | -2 |
| Process Technology | 130 nm |
| Configuration Memory | Flash (non-volatile, instant-on) |
| 패키지 | 256-LBGA (FG256), 17x17x1.7 mm |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| RoHS 상태 | Compliant (RoHS Compliant: Yes per Newark) |
M7AFS600-2FG256 256-lbga (fg256), 17x17x1.7 mm 핀 구성 가이드
M7AFS600-2FG256(256-lbga (fg256), 17x17x1.7 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M7AFS600-2FG256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M7AFS600-2FG256 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Power Supply Monitoring and Management, Portable and Battery-Powered Instrumentation, Aerospace and Defense Subsystems, Medical Equipment and Patient-Connected Devices, Networking and Communications Line Cards.
Industrial Automation and Motor Control
The M7AFS600-2FG256 fits industrial motor control because the Fusion architecture merges 600K gates of flash fabric, the ARM CoreMP7 hard processor, and mixed-signal monitoring in one 256-ball device, cutting BOM count versus a discrete MCU plus CPLD combination. The 119 user I/O implement multi-axis PWM generation, quadrature-encoder capture, and hardwired fault-shutdown interlocks in deterministic fabric, while the CoreMP7 runs protocol stacks such as CANopen or Modbus. Non-volatile flash configuration provides instant-on recovery after power dips common on factory floors, with no boot device to fail. Budget the 1.5V core rail with Libero SmartPower estimates, since fabric toggle rates during PWM switching dominate core current.
추천
Power Supply Monitoring and Management
Fusion FPGAs were purpose-built for intelligent power management: the M7AFS600-2FG256 integrates analog conditioning blocks that monitor multiple voltage, current, and temperature channels on-board, evaluated against thresholds set in the flash fabric. With 600K gates and the ARM CoreMP7, the device can sequence rails, log events, and close the loop on telemetry over UART/I2C/SMBus without a separate supervisory MCU. The 110592-bit flash RAM buffers event histories, and instant-on flash configuration means supervision starts at the first millisecond of power-up when SRAM-based solutions are still blank. This makes it a strong fit for backplane, base-station, and server power-tree controllers.
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Portable and Battery-Powered Instrumentation
The M7AFS600-2FG256 suits portable instrumentation because its 130 nm flash process and 1.5V core keep dynamic power moderate, while single-chip integration of processor, fabric, and analog monitoring eliminates several quiescent loads from the power budget. The compact 17x17x1.7 mm 256-ball package conserves board area in handheld enclosures, and the 119 I/O drive displays, keypad matrices, and sensor front ends. Because configuration is non-volatile, the instrument is fully operational immediately after power-on, which matters for field tools that are switched on demand. Verify sleep and I/O static currents against the Fusion datasheet when designing battery-run profiles.
추천
Aerospace and Defense Subsystems
Flash-based Fusion FPGAs are frequently selected for aerospace and defense subsystems because the non-volatile flash configuration is inherently more resistant to configuration upset than SRAM bitstreams, eliminating the need for external scrubbing hardware. The M7AFS600-2FG256 provides 600K gates plus the ARM CoreMP7 for on-board processing of sensor, telemetry, and bus-interface functions, with 119 I/O for MIL-STD-style discrete and serial interfaces. Industrial-grade variants such as M7AFS600-FG256I extend temperature range for harsh environments. For radiation-critical missions, pair the board-level approach with Microchip RTAX-series parts (e.g., RTAX4000S) rather than relying on commercial Fusion alone.
추천
Medical Equipment and Patient-Connected Devices
Medical equipment benefits from the M7AFS600-2FG256's combination of mixed-signal monitoring, deterministic fabric logic, and embedded ARM CoreMP7 processing for devices such as patient monitors, infusion pumps, and diagnostic instruments. The analog blocks track supply and sensor-health parameters for self-diagnostic routines required by safety reviews, while flash configuration guarantees known-good startup behavior at every power cycle. The 17x17 mm footprint and high integration shrink front-end boards, and 119 I/O connect displays, sensors, and communication ports. Freeze I/O bank assignments early and document them for regulatory design history files, since flash FPGAs cannot be re-pinout-ed without re-verification.
추천
Networking and Communications Line Cards
In networking and communications equipment, the M7AFS600-2FG256 serves as a system-controller and glue-logic consolidation device on line cards and blades: the CoreMP7 handles management protocols (I2C/SMBus, UART console, board telemetry), while the 600K-gate fabric implements clock distribution glue, hot-swap control, LED driving, and FPGA configuration bridges. Flash instant-on configuration lets the controller bring up and supervise the card's main SRAM FPGAs at power-on, a common Fusion architecture pattern documented in Actel/Microchip reference designs. The 119 I/O in a compact 17x17 mm BGA fit dense card layouts where the FG484 footprint will not fit.
추천
추천 제품 요약
엔지니어링 참조 데이터: M7AFS600-2FG256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M7AFS600-2FGG256 | M7AFS600-FGG256I | M7AFS600-1FG256I | M7AFS600-1FGG256 | M7AFS600-FG256I |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FG256), 17x17x1.7 mm | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| Speed Grade | -2 | -2 | -2 | -1 (faster) | -1 (faster) | -2 |
| Number of I/O | 119 | 119 | 119 | 119 | 119 | 119 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS / Lead Finish | Compliant (FG finish) | FGG (RoHS lead-free finish) | FGG (RoHS lead-free finish) | FG finish | FGG (RoHS lead-free finish) | FG finish |
| Configuration Memory | Flash (non-volatile, instant-on) | Flash | Flash | Flash | Flash | Flash |
주요 차별점
- Unique ARM CoreMP7 hard core in this footprint (vs M7AFS600-2FGG256)
- Faster speed-grade upgrade path on the same PCB (vs M7AFS600-1FG256I)
- RoHS lead-free finish option without redesign (vs M7AFS600-2FGG256)
설계 노트
Estimated: core current for the 600K-gate, 1.5V core depends on clock frequency and toggle rate; do not size the core regulator from the 119-I/O headline number. Run Microchip Libero SoC SmartPower with your actual RTL and constraint set to estimate core, I/O, and static power, then add 30-50% margin on the 1.5V rail. Follow the Fusion datasheet power-up ramp-rate requirement on VCC so flash configuration completes reliably; a brown-out during configuration can leave the device blank until the next full power cycle.
The FG256 package (17x17 mm, 1.0 mm or finer ball pitch per datasheet) requires a verified land pattern per Microchip's package mechanical drawing - do not scale a generic 256-BGA footprint. Place 0.1 uF ceramic decoupling on every core and I/O bank supply ball with solid return planes; Fusion flash devices also specify an on-chip voltage reference that needs clean 3.3V analog supply per the datasheet recommendations. Fan out with via-in-pad or dog-bone escapes and confirm ball-map assignment against the official pin tables before routing.
Do not interchange FG and FGG parts blindly in programs with solder-process or compliance constraints: FGG denotes the RoHS lead-free ball finish, while FG may be a legacy finish - confirm with the ordering-code table in the Fusion datasheet. Also remember that the -2 speed grade is slower than -1; designs timing-closed on an -1 part will meet timing on -2, but the reverse is not guaranteed. Re-run static timing in Libero SoC whenever substituting across speed grades or temperature ranges (commercial vs I suffix).
규정 준수 정보
RoHS Compliant: Yes explicitly stated on Newark listing for M7AFS600-2FG256. FGG-suffix family variants denote lead-free ball finish. REACH, halogen-free, and conflict-minerals status not stated in provided data.
