M7AFS600-FG256 - Fusion FPGA 600K Gates, 119 I/O | Microchip
부품 번호: M7AFS600-FG256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $237.8 | $237.80 |
| 10 | $229.5 | $2,295.00 |
| 100 | $219.9 | $21,990.00 |
| 500 | $209.5 | $104,750.00 |
| 1,000 | $198.75 | $198,750.00 |
M7AFS600-FG256 개요
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. Within the programmable-logic hierarchy, the Fusion family sits in the mixed-signal FPGA class: unlike standard FPGAs, it adds analog building blocks (ADCs, voltage/temperature monitoring) and Flash-based configuration storage, making it a system-on-chip-style power management and control platform.
Key features include the embedded ARM CoreMP7 32-bit processor core for soft-control functions, 600K system gates of programmable fabric, 119 user I/O pins brought out on the 256-ball substrate, and integrated analog mixed-signal capability that offloads external supervisory components. Flash-based configuration means the device is instant-on, non-volatile, and inherently more secure against bitstream interception than SRAM FPGAs.
Technically, the device is fabricated on a 130 nm Flash process with a 1.5 V core operating supply. The commercial-grade M7AFS600-FG256 is rated for 0 C to +70 C operation; the industrial -40 C to +85 C variant carries the -I suffix (e.g., M7AFS600-FG256I). Per Microsemi documentation, all devices within the same package are pin compatible, which simplifies family migration.
Typical applications include power-supply management and board-level monitoring, industrial control and motor supervision, portable instrumentation, and embedded systems requiring an instant-on processor plus FPGA fabric in one die.
Design consideration: budget the 1.5 V core rail carefully with adequate decoupling, and verify that the 119 available I/O meet your bank voltage requirements before finalizing the 256-ball footprint.
This page synthesizes distributor pricing (as of 2026-09-02), drop-in alternatives within the Fusion/ProASIC3 FG256 ecosystem, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: M7AFS600-FG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M7AFS600-FG256 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Process Technology, System Gates, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M7AFS600-FGG256
✅ 드롭인✓ 재고 있음
$232.4 / 개
데이터시트 보기 →M7AFS600-FG256I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS600-FG256
✅ 드롭인✓ 재고 있음
$22 / 개
데이터시트 보기 →M1AFS1500-1FGG256
✅ 드롭인✓ 재고 있음
$172.23 / 개
데이터시트 보기 →M1AFS250-2FGG256I
✅ 드롭인✓ 재고 있음
$83.12 / 개
데이터시트 보기 →M1AFS250-2FGG256
✅ 드롭인✓ 재고 있음
$83.12 / 개
데이터시트 보기 →M7AFS600-FG256 최대 정격 & 전기적 특성
| Series | M7AFS600 (Fusion) |
| System Gates | 600000 gates |
| D Flip-Flops / Registers | 110592 |
| User I/O | 119 |
| Embedded Processor | ARM CoreMP7 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm Flash |
| Configuration Type | Flash-based, non-volatile |
| Maximum Operating Frequency | 1098.9 MHz (per FPGAkey listing) |
| 패키지 / 케이스 | 256-LBGA (FBGA), 17x17x1.7 mm |
| Terminal Form | Ball (SMD/SMT) |
| 동작 온도 | 0 C to +70 C (commercial) |
| 장착 스타일 | Surface Mount |
| Packaging | Tray |
| RoHS 상태 | Compliant |
| Product Type | Mixed-Signal FPGA |
M7AFS600-FG256 256-lbga (fbga), 17x17x1.7 mm 핀 구성 가이드
M7AFS600-FG256(256-lbga (fbga), 17x17x1.7 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M7AFS600-FG256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M7AFS600-FG256 적합 용도: 6 애플리케이션s: Power Supply Management and Board Monitoring, Industrial Control and Motor Supervision, Portable and Battery-Powered Instrumentation, Embedded System-On-Chip Prototyping, Test and Measurement Equipment, Aerospace-Adjacent Ground Equipment and Rugged Systems.
Power Supply Management and Board Monitoring
The M7AFS600-FG256 was explicitly architected for power management: its Fusion mixed-signal fabric integrates ADC blocks and voltage/temperature monitoring channels that track multiple rails in real time, replacing a discrete microcontroller-plus-monitor-IC pair. With 600K gates and an ARM CoreMP7 core, the device implements sequencing state machines, fault logging, and PMBus-style control logic in a single 1.5 V-core, 256-ball LBGA device. The Flash-based configuration is instant-on at power-up, which is essential for a supervisor that must observe rail behavior before other circuitry stabilizes. Place the analog monitoring inputs close to the sense points and calibrate the ADC channels against the on-chip reference during Libero design bring-up for best accuracy.
추천
Industrial Control and Motor Supervision
In industrial controllers, the M7AFS600-FG256 combines 119 user I/O with the ARM CoreMP7 processor to implement PWM generation, encoder interfacing, and safety interlocks while simultaneously sampling analog feedback through its on-chip ADCs. The 130 nm Flash fabric is immune to configuration upset from a single-event latch of external SRAM bitstreams, an advantage in noisy motor-drive environments. For ambient conditions outside 0 C to +70 C, choose the pin-compatible M7AFS600-FG256I industrial variant rated -40 C to +85 C with no PCB change. Its non-volatile configuration also shortens machine startup time compared with SRAM FPGAs that require a bootloader fetch from external flash on every power cycle.
추천
Portable and Battery-Powered Instrumentation
Handheld instruments benefit from the Fusion architecture's consolidation: the M7AFS600-FG256 provides programmable glue logic, the CoreMP7 processor, and analog measurement blocks in one 17x17 mm 256-ball package, cutting board area versus a discrete MCU plus FPGA-plus-monitor split. The 1.5 V core reduces internal power, and the Flash fabric draws no configuration current from external memory. Designers should budget I/O bank voltages across the 119 available balls early, since portable designs typically mix 3.3 V sensors and 1.8 V processors on one die. Non-volatile, tamper-resistant configuration also protects firmware IP in fielded instruments where SRAM bitstream files could otherwise be extracted.
추천
Embedded System-On-Chip Prototyping
The embedded ARM CoreMP7 on the M7AFS600-FG256 lets system architects prototype processor-plus-FPGA subsystems on a single die before committing to an ASIC or discrete split. The 600K-gate fabric accommodates peripherals, bus bridges, and accelerators around the processor, while the integrated analog channels model mixed-signal interfaces. Because configuration is stored in on-chip Flash, design iterations program directly through the JTAG chain without external configuration PROMs, accelerating lab bring-up. Same-package pin compatibility across the Fusion family means a prototype socketed footprint for AFS600 can later accept M1AFS1500 or M1AFS250 silicon simply by recompiling the Libero project for the new device.
추천
Test and Measurement Equipment
Bench and rack instruments use the M7AFS600-FG256 as a control-plane FPGA: it sequences power domains, samples fan speed and temperature through its ADC blocks, and implements communication bridges over its 119 I/O. The listed 1098.9 MHz maximum operating frequency (per FPGAkey listing) reflects internal fabric timing capability sufficient for fast state machines, while the CoreMP7 handles command parsing and housekeeping. Instant-on Flash configuration means the instrument control plane is alive within milliseconds of plug-in, unlike SRAM FPGAs that wait for a bitstream load. Commercial 0 C to +70 C grading suits laboratory environments; migrate to the FG256I variant for field-portable testers.
추천
Aerospace-Adjacent Ground Equipment and Rugged Systems
While the commercial M7AFS600-FG256 is not space-qualified, the Flash-based Fusion architecture is widely used in ground support equipment, test benches, and benign rugged systems that sit alongside Microchip RTAX and ProASIC3 flight hardware. Engineers value that a single Libero toolchain and code base spans the ground Fusion controller and the flight device, reducing qualification risk. The instant-on, single-chip nature of the 256-ball Fusion part simplifies conduction-cooled enclosures where boot-flash components are undesirable. For harsher ambient conditions, the pin-compatible industrial M7AFS600-FG256I covers -40 C to +85 C on the identical footprint and BOM layout.
추천
추천 제품 요약
엔지니어링 참조 데이터: M7AFS600-FG256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M7AFS600-FGG256 | M7AFS600-FG256I | M1AFS600-FG256 | M1AFS1500-1FGG256 |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-LBGA (FG256), 17x17x1.7 mm | 256-LBGA (FGG256) - same footprint | 256-LBGA (FG256) - same footprint | 256-LBGA (FG256) - same footprint | 256-LBGA (FGG256) - same footprint |
| System Gates | 600 K | 600 K | 600 K | 600 K | 1500 K |
| Speed Grade | -7 (faster grade) | -7 (same die) | -7 (same die) | -1 (standard) | -1 (standard) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) |
| Embedded Processor | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 |
주요 차별점
- Integrated mixed-signal analog blocks with ARM CoreMP7 (vs A3P600-FG256)
- Industrial temperature availability on identical footprint (vs M7AFS600-FG256I)
- Faster speed grade than standard family parts (vs M1AFS600-FG256)
설계 노트
The M7AFS600-FG256 requires a regulated 1.5 V core supply in addition to I/O bank and analog rails. Size the core regulator with margin for simultaneous switching noise across 119 I/O, and use a star or plane-fed distribution with bulk capacitance near the LBGA balls plus 0.1 uF ceramics on each supply ball group. Fusion's integrated analog block has its own clean supply requirement - isolate it with an RC filter or ferrite bead from the digital 1.5 V rail to preserve ADC accuracy.
The 256-ball LBGA (17x17x1.7 mm) typically requires via-in-pad or dogbone fanout on a fine-pitch BGA breakout. Plan at least one internal layer as an unbroken 1.5 V core plane and one as ground to minimize loop area. The package is commercial-grade with a recommended tray reflow profile per JEDEC MSL markings on the label; verify moisture barrier bags and bake time if floor life is exceeded before reflow.
Two frequent mistakes: first, ordering the commercial M7AFS600-FG256 for enclosures that reach -20 C or +85 C - the correct part is the pin-compatible M7AFS600-FG256I; second, assuming drop-in means design-identical when migrating to M1AFS250/M1AFS1500 family members - hardware is pin compatible per the datasheet, but the Libero project must be retargeted and timing re-verified for the new gate count and speed grade.
규정 준수 정보
Newark listing states 'RoHS Compliant: Yes'. Other compliance attributes not stated in provided data.
