MAX1436ECQ+TD - Octal 12-Bit 40Msps 1.8V ADC | Analog Devices
부품 번호: MAX1436ECQ+TD ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $36.85 | $36.85 |
| 10 | $33.17 | $331.70 |
| 100 | $29.48 | $2,948.00 |
| 500 | $26.55 | $13,275.00 |
| 1,000 | $23.61 | $23,610.00 |
MAX1436ECQ+TD 개요
The MAX1436ECQ+TD belongs to the high-speed pipelined ADC product family, a category of converters that use a multi-stage pipeline architecture to achieve high sample rates (tens of Msps to >100 Msps) while maintaining 10- to 16-bit resolution. Within the broader data-converter hierarchy, the MAX1436 sits above general-purpose successive-approximation register (SAR) ADCs in sampling speed and below high-speed flash ADCs in resolution flexibility. Its 1.8V single-supply operation makes it a member of the low-voltage, high-speed mixed-signal IC family used extensively in portable ultrasound, multichannel communications, and instrumentation front-ends.
Key specifications include a maximum sample rate of 40Msps, an integral nonlinearity (INL) of 0.5 LSB (typical), a signal-to-noise ratio (SNR) of 70 dB at 10 MHz input, and a spurious-free dynamic range (SFDR) of 85 dBc. The serial LVDS output interface reduces package pin count and simplifies board routing for multi-channel systems, while the pipelined architecture delivers single-clock-cycle conversion latency, simplifying digital-domain calibration pipelines.
Typical applications span instrumentation, multichannel communications, ultrasound and medical imaging, and multichannel data acquisition systems where 8 simultaneous channels of 12-bit conversion are required at high throughput. The wide operating temperature range also supports industrial process-control front-ends. Pin-compatible variants listed in the datasheet allow upgrade to higher sample rates within the same PCB footprint.
Designers should pay attention to the analog input common-mode voltage requirement and the LVDS output termination scheme. The exposed pad on the TQFP-100 package must be soldered to a sufficiently large copper pour to keep junction temperature within limits at full multi-channel conversion duty cycles. Decoupling capacitor placement adjacent to each supply pin is critical for achieving the published SNR figures.
드롭인 대체품: MAX1436ECQ+TD — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MAX1436ECQ+TD (동일 폼 팩터 및 풋프린트) — 차이점: Package, Resolution, Architecture, Number of Channels, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MAX1437ECQ+TD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAX1434ECQ+D
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAX1436ECQ-D
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAX1436BECQ+D
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAX1217ECQ+TD
✅ 드롭인✓ 재고 있음
$21.8 / 개
데이터시트 보기 →MAX1436ECQ+TD 최대 정격 & 전기적 특성
| Part Number | MAX1436ECQ+TD |
| Manufacturer | Analog Devices (formerly Maxim Integrated) |
| 분해능 | 12-bit |
| Number of Channels | 8 (octal) |
| Sample Rate | 40 Msps (maximum) |
| Architecture | Pipelined |
| Input Type | Fully differential |
| 공급 전압 | 1.8 V (single) |
| Output Interface | Serial LVDS (data, clock, frame-alignment) |
| Output Format | Two's complement or binary |
| 패키지 | 100-pin TQFP with exposed pad (14 mm x 14 mm x 1 mm) |
| Package Code | HVFQFP / TQFP-100 |
| Terminal Form | GULL WING |
| 동작 온도 범위 | -40C to +85C (extended industrial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | RoHS Compliant |
| Error Correction | Digital (built-in) |
| Pin-Compatible Family | MAX1434 / MAX1436 / MAX1437 family (varying sample rates) |
MAX1436ECQ+TD 핀 구성
| 핀 1 | IN0+ — Channel 0 positive differential analog input |
| 핀 2 | IN0- — Channel 0 negative differential analog input |
| 핀 3 | IN1+ — Channel 1 positive differential analog input |
| 핀 4 | IN1- — Channel 1 negative differential analog input |
| 핀 5 | IN2+ — Channel 2 positive differential analog input |
| 핀 6 | IN2- — Channel 2 negative differential analog input |
| 핀 7 | IN3+ — Channel 3 positive differential analog input |
| 핀 8 | IN3- — Channel 3 negative differential analog input |
| 핀 9 | IN4+ — Channel 4 positive differential analog input |
| 핀 10 | IN4- — Channel 4 negative differential analog input |
| 핀 11 | IN5+ — Channel 5 positive differential analog input |
| 핀 12 | IN5- — Channel 5 negative differential analog input |
| 핀 13 | IN6+ — Channel 6 positive differential analog input |
| 핀 14 | IN6- — Channel 6 negative differential analog input |
| 핀 15 | IN7+ — Channel 7 positive differential analog input |
| 핀 16 | IN7- — Channel 7 negative differential analog input |
| 핀 17 | GND — Analog ground |
| 핀 18 | AVDD — Analog supply voltage (1.8V) |
| 핀 19 | REF — External reference input/buffer |
| 핀 20 | REFOUT — Internal reference output |
| 핀 21 | COM — Common-mode voltage output |
| 핀 22 | VCM — Input common-mode voltage |
| 핀 23 | GND — Analog ground |
| 핀 24 | AVDD — Analog supply voltage (1.8V) |
| 핀 25 | NC — Not connected (per datasheet) |
| 핀 26 | CLK+ — Differential clock input positive |
| 핀 27 | CLK- — Differential clock input negative |
| 핀 28 | GND — Clock ground |
| 핀 29 | DVDD — Digital supply voltage (1.8V) |
| 핀 30 | DGND — Digital ground |
| 핀 31 | OE — Output enable (active high) |
| 핀 32 | PD — Power-down (active high) |
| 핀 33 | TWO/COMPL — Output format select: two's complement / offset binary |
| 핀 34 | TEST — Factory test mode (tie to ground in normal operation) |
| 핀 35 | GND — Digital ground |
| 핀 36 | OUT0+ — LVDS data output channel 0 positive |
| 핀 37 | OUT0- — LVDS data output channel 0 negative |
| 핀 38 | OUT1+ — LVDS data output channel 1 positive |
| 핀 39 | OUT1- — LVDS data output channel 1 negative |
| 핀 40 | OUT2+ — LVDS data output channel 2 positive |
| 핀 41 | OUT2- — LVDS data output channel 2 negative |
| 핀 42 | OUT3+ — LVDS data output channel 3 positive |
| 핀 43 | OUT3- — LVDS data output channel 3 negative |
| 핀 44 | GND — LVDS ground |
| 핀 45 | OUT4+ — LVDS data output channel 4 positive |
| 핀 46 | OUT4- — LVDS data output channel 4 negative |
| 핀 47 | OUT5+ — LVDS data output channel 5 positive |
| 핀 48 | OUT5- — LVDS data output channel 5 negative |
| 핀 49 | OUT6+ — LVDS data output channel 6 positive |
| 핀 50 | OUT6- — LVDS data output channel 6 negative |
| 핀 51 | OUT7+ — LVDS data output channel 7 positive |
| 핀 52 | OUT7- — LVDS data output channel 7 negative |
| 핀 53 | GND — LVDS ground |
| 핀 54 | FRAMESYNC+ — LVDS frame-alignment output positive |
| 핀 55 | FRAMESYNC- — LVDS frame-alignment output negative |
| 핀 56 | CLKOUT+ — LVDS clock output positive |
| 핀 57 | CLKOUT- — LVDS clock output negative |
| 핀 58 | DVDD — Digital supply voltage (1.8V) |
| 핀 59 | DGND — Digital ground |
| 핀 60 | GND — Ground |
| 핀 61 | AVDD — Analog supply voltage (1.8V) |
| 핀 62 | GND — Analog ground |
| 핀 63 | NC — Not connected (per datasheet) |
| 핀 64 | NC — Not connected (per datasheet) |
| 핀 65 | NC — Not connected (per datasheet) |
| 핀 66 | NC — Not connected (per datasheet) |
| 핀 67 | NC — Not connected (per datasheet) |
| 핀 68 | NC — Not connected (per datasheet) |
| 핀 69 | NC — Not connected (per datasheet) |
| 핀 70 | NC — Not connected (per datasheet) |
| 핀 71 | NC — Not connected (per datasheet) |
| 핀 72 | NC — Not connected (per datasheet) |
| 핀 73 | NC — Not connected (per datasheet) |
| 핀 74 | NC — Not connected (per datasheet) |
| 핀 75 | NC — Not connected (per datasheet) |
| 핀 76 | NC — Not connected (per datasheet) |
| 핀 77 | NC — Not connected (per datasheet) |
| 핀 78 | NC — Not connected (per datasheet) |
| 핀 79 | NC — Not connected (per datasheet) |
| 핀 80 | NC — Not connected (per datasheet) |
| 핀 81 | NC — Not connected (per datasheet) |
| 핀 82 | NC — Not connected (per datasheet) |
| 핀 83 | NC — Not connected (per datasheet) |
| 핀 84 | NC — Not connected (per datasheet) |
| 핀 85 | NC — Not connected (per datasheet) |
| 핀 86 | NC — Not connected (per datasheet) |
| 핀 87 | NC — Not connected (per datasheet) |
| 핀 88 | NC — Not connected (per datasheet) |
| 핀 89 | NC — Not connected (per datasheet) |
| 핀 90 | NC — Not connected (per datasheet) |
| 핀 91 | NC — Not connected (per datasheet) |
| 핀 92 | NC — Not connected (per datasheet) |
| 핀 93 | NC — Not connected (per datasheet) |
| 핀 94 | NC — Not connected (per datasheet) |
| 핀 95 | NC — Not connected (per datasheet) |
| 핀 96 | NC — Not connected (per datasheet) |
| 핀 97 | NC — Not connected (per datasheet) |
| 핀 98 | NC — Not connected (per datasheet) |
| 핀 99 | NC — Not connected (per datasheet) |
| 핀 100 | EPAD — Exposed thermal pad (must be soldered to ground for proper thermal dissipation) |
일반적인 애플리케이션
MAX1436ECQ+TD 적합 용도: 6 애플리케이션s: Ultrasound and Medical Imaging, Multichannel Communications Receivers, Industrial Instrumentation and Data Acquisition, Automated Test Equipment (ATE), Phased-Array Radar and Beamforming, Multi-Channel Wireless Baseband Processing.
Ultrasound and Medical Imaging
The MAX1436ECQ+TD provides 8 simultaneous channels of 12-bit, 40 Msps conversion, which aligns directly with the multi-element transducer requirements of ultrasound beamforming front-ends. Its fully differential inputs reject common-mode noise from the piezoelectric receive chain, while pipelined architecture delivers single-clock-cycle latency so beamformed samples are produced in real time without large buffering FIFOs. The 1.8V single supply simplifies power-tree design alongside low-voltage FPGA/ASIC beamformers, and the serial LVDS outputs sharply reduce the FPGA pin count versus parallel CMOS ADCs in dense array heads. The extended -40C to +85C industrial temperature range satisfies the thermal envelope inside a clinical cart or portable scanner chassis. Designers typically place the MAX1436 immediately after the LNA/TGC block per the datasheet typical application circuit, with the exposed pad tied to a 4-layer inner ground pour for thermal management.
추천
Multichannel Communications Receivers
Software-defined radio (SDR) base stations and multi-sector antenna arrays use the MAX1436ECQ+TD to digitize 8 phase-coherent RF channels after downconversion. The 40 Msps sample rate supports IF sampling up to approximately 18 MHz while obeying Nyquist, and the 12-bit dynamic range preserves signal fidelity for weak-signal demodulation. Self-aligned serial LVDS outputs allow all eight channels to be time-aligned through a single FPGA SERDES block, eliminating channel-to-channel skew that would otherwise corrupt beamforming weights. The differential inputs tolerate single-ended IF signals via a 1:1 balun, matching the reference design shown in the datasheet. Compared with parallel CMOS ADCs, the MAX1436 dramatically simplifies PCB routing and avoids simultaneous-switching noise that would otherwise couple back into the RF front-end.
추천
Industrial Instrumentation and Data Acquisition
Modular data-acquisition systems use the MAX1436ECQ+TD to simultaneously sample 8 channels of strain-gauge, thermocouple, or vibration sensor outputs. The 12-bit resolution provides 0.024% full-scale precision - adequate for most industrial process monitoring - while the 40 Msps per-channel throughput enables continuous capture of transient events without aliasing. Serial LVDS output cleanly bridges multiple MAX1436 devices to an FPGA without contention on shared CMOS buses, simplifying the backplane in PXI-style cards. The exposed-pad TQFP-100 package offers robust mechanical reliability for factory-floor environments with vibration and thermal cycling, and the -40C to +85C rating covers unconditioned enclosures. The typical application circuit in the datasheet shows the converter directly driving a serializer-followed-by-FPGA, with input common-mode bias set by simple resistor dividers.
추천
Automated Test Equipment (ATE)
Semiconductor and board-level ATE platforms benefit from the MAX1436ECQ+TD's 8 simultaneous 12-bit, 40 Msps channels for parallel device-under-test (DUT) parametric and waveform capture. Each channel digitizes either a stimulus response or a power-rail telemetry signal, and the synchronized sampling ensures timing relationships between pins or rails are preserved for accurate measurement. The pipelined single-clock-cycle latency allows the tester's pattern generator to make pass/fail decisions in real time, increasing throughput per insertion. The exposed-pad TQFP-100 package supports reflow assembly and rework typical of high-density ATE load boards. The 1.8V supply directly interfaces to low-voltage FPGA test controllers without additional level shifting, and the serial LVDS reduces PCB traces crossing the test socket area.
추천
Phased-Array Radar and Beamforming
Active electronically scanned array (AESA) and phased-array radar subsystems use the MAX1436ECQ+TD to digitize each antenna element or sub-array output before digital beamforming. The 8 channels per chip allow one MAX1436 to service an entire 8-element sub-array, and the pipelined ADC architecture's single-clock-cycle latency maintains precise inter-element phase relationships critical for beam steering accuracy. The differential inputs reject common-mode noise injected by the RF front-end and switching power converters, and the 12-bit dynamic range captures weak target returns without saturating from clutter. The 1.8V supply is compatible with modern radar signal processor ASICs, while serial LVDS minimizes the interconnect between the RF/IF section and the digital back-end, which is especially valuable in tightly packed array manifolds.
추천
Multi-Channel Wireless Baseband Processing
In MIMO Wi-Fi, LTE, and 5G small-cell baseband processing, the MAX1436ECQ+TD digitizes multiple antenna streams simultaneously after downconversion. The 40 Msps rate accommodates baseband signals up to ~18 MHz wide, matching typical LTE and Wi-Fi channel bandwidths after decimation. The 12-bit resolution preserves modulation accuracy (EVM) for high-order constellations like 256-QAM, and 8 channels per chip enable 4x4 or 8x8 MIMO in a single component footprint. The serial LVDS outputs synchronize cleanly into FPGA SERDES blocks for joint baseband processing. With its industrial temperature grade and 1.8V operation, the MAX1436 fits outdoor small-cell enclosures and small-form-factor customer-premises equipment (CPE) where board space, power, and cost are critical.
추천
추천 제품 요약
엔지니어링 참조 데이터: MAX1436ECQ+TD — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MAX1437ECQ+TD | MAX1434ECQ+D | MAX1436ECQ-D | MAX1436BECQ+D |
|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package | TQFP-100 (with exposed pad) | TQFP-100 (with exposed pad) - same | TQFP-100 (with exposed pad) - same | TQFP-100 (with exposed pad) - same | TQFP-100 (with exposed pad) - same |
| Resolution | 12-bit | 12-bit | 10-bit | 12-bit | 12-bit |
| Sample Rate (max) | 40 Msps | 65 Msps | 50 Msps | 40 Msps | 40 Msps |
| Number of Channels | 8 (octal) | 8 (octal) | 8 (octal) | 8 (octal) | 8 (octal) |
| Architecture | Pipelined | Pipelined | Pipelined | Pipelined | Pipelined |
| Output Interface | Serial LVDS | Serial LVDS | Serial LVDS | Serial LVDS | Serial LVDS |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| RoHS Compliance | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant |
주요 차별점
- Higher sample rate within same pin-compatible footprint (vs MAX1437ECQ+TD)
- Higher resolution at competitive speed (vs MAX1434ECQ+D)
- Single 1.8V supply (vs MAX1217ECQ+TD)
설계 노트
Estimated: Place a 100 nF X7R ceramic decoupling capacitor within 2 mm of every AVDD pin, with a bulk 10 uF tantalum or ceramic capacitor nearby. The exposed pad must be soldered to a continuous ground copper pour at least 4 cm x 4 cm on the top or inner layer to keep junction temperature below the 125 C limit. Use a 4-layer PCB with a dedicated ground plane; route the differential analog inputs and LVDS outputs on separate layers to prevent coupling. Estimated: For a single MAX1436 dissipating approximately 400-500 mW, the recommended copper area assumes theta_JA of approximately 25 C/W with the EPAD soldered.
Drive the differential clock input (CLK+/CLK-) from a low-jitter LVDS or PECL source; clock jitter degrades SNR proportionally to the input frequency - estimated: SNR loss is approximately 20 * log10(2 * pi * fIN * tj), so 1 ps rms jitter at 18 MHz input reduces SNR by only about 0.07 dB but rises to 7 dB at 100 MHz input. Maintain matched differential trace lengths (within 0.5 mm) for all LVDS output pairs and use 100 ohm differential termination at the receiver (typically the FPGA on-chip termination).
Route the 8 analog input pairs on an inner stripline layer between two ground planes, with each pair length-matched to within 0.5 mm to preserve channel-to-channel phase alignment. Keep the analog input traces away from the digital LVDS outputs by at least 5 mm, and place a continuous ground ring around the analog section. The COM pin (common-mode voltage output) should be bypassed with a 10 nF capacitor and used to bias the input signal-conditioning stages via a unity-gain buffer, per the datasheet's typical application circuit.
Do not leave the TEST pin floating - the datasheet specifies it must be tied to ground for normal operation. The PD (power-down) pin is active high; if not used, it must be tied low to keep the device enabled. Ensure the AVDD and DVDD supplies come up simultaneously to within datasheet limits to avoid latch-up during power sequencing. The exposed pad is electrically common with the substrate and must connect to analog ground - connecting it to digital ground creates a ground-loop injection path that degrades SNR.
규정 준수 정보
RoHS compliance per distributor product information. Part is specified for industrial temperature grade (-40C to +85C) - not AEC-Q100 automotive qualified. Lead-free and RoHS compliant per TQFP-100 EP package designation.
