최종 구매 공지: MC68302RC20C 단종에 가까워지고 있습니다. 최종 주문일: 문의하기. 사용 가능한 대체 부품 보기 →
NXP Semiconductors

MC68302RC20C - M68302 20MHz Integrated Multiprotocol Processor | NXP

부품 번호: MC68302RC20C ⚠ 최종 구매
재고 있음 영업일 기준 1~3일 내 발송
5 V Vdss 132-BEPGA (34.5 x 34.5 mm) Package 20 MHz Speed
시작가 $27.85 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-16
볼륨 가격
수량 단가 합계
1 $48.5 $48.50
10 $42.75 $427.50
100 $36.4 $3,640.00
500 $31.2 $15,600.00
1,000 $27.85 $27,850.00
ℹ️ 모든 가격은 USD 기준입니다

MC68302RC20C 개요

The NXP MC68302RC20C is a 20 MHz integrated multi-channel communications processor that combines an MC68000/MC68008 microprocessor core with a flexible communications architecture on a single chip, housed in a 132-pin ceramic PGA (Pin Grid Array) package measuring 34.5 x 34.5 mm. The MC68302 was the first device to offer the benefits of a closely coupled, industry-standard M68000 core with on-chip DMA, serial communications channels, and parallel I/O, making it a versatile building block for networking and communications products.

An integrated multiprotocol processor (IMP) is a system-on-chip device that merges a general-purpose CPU with peripheral communication controllers, reducing the bill of materials for routers, bridges, and embedded communication nodes compared with discrete CPU-plus-ASIC designs. Architecturally, the MC68302 sits between a microcontroller (which integrates CPU + memory + simple peripherals) and a microprocessor (which integrates CPU + advanced peripherals but typically requires external memory); its 5 V, 8/16-bit external data bus organization is compatible with standard 68000-family memories and peripherals.

Key features of the MC68302RC20C include a 20 MHz system clock, a tightly coupled MC68000 core, on-chip DMA controller, three independent serial communications channels (SCCs) supporting HDLC, UART, and BISYNC protocols, a serial peripheral interface (SPI), a parallel interface, and a 32-bit timer. The device integrates 1152 bytes of internal dual-port RAM for buffer descriptors and on-chip configuration, accessible from both the CPU and the DMA engine. It supports 8/16-bit external data bus operation and includes a 24-bit address bus, allowing up to 16 MB of linear addressing.

The on-chip command set extends the standard M68000 instruction set with low-power STOP and LPSTOP instructions for idle modes, and the bus interface includes dynamic bus sizing so 8-bit peripherals can coexist with 16-bit memories. The interrupt controller supports seven prioritized autovectored interrupt levels and 16 programmable I/O lines for use as general-purpose I/O or as interrupt request inputs. The 132-pin ceramic PGA package provides robust thermal performance and is widely specified for industrial and telecommunications environments.

Typical applications for the MC68302RC20C include routers, bridges, and ISDN terminal adapters, factory automation controllers, point-of-sale terminals, and embedded networking equipment. Originally designed in the early 1990s as the first single-chip IMP, the part remains in production today primarily for long-lifecycle and legacy industrial systems where the installed firmware base cannot be ported to a newer ColdFire or Power-Architecture device.

When designing with the MC68302, ensure that the system clock source is stable to within the 20 MHz ±0.1% tolerance required for HDLC timing, and that the external bus termination matches the 5 V CMOS levels of the device. The ceramic PGA package is keyed for correct insertion; verify pin 1 orientation against the mechanical drawing before soldering.

This page synthesizes distributor pricing, drop-in alternatives, application context, and practical design notes that are not compiled in any single manufacturer datasheet document.

드롭인 대체품: MC68302RC20C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MC68302RC20C (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Data Bus Width, Package, Address Bus Width, Supply Voltage.

NXP Semiconductors
Mounting Type: Through-Hole (Pin Grid Array)
Data Bus Width: 16 bit
Package: 132-PGA (34.5 x 34.5 mm)
비교 대상: MC68302RC20C →
NXP Semiconductors
Mounting Type: Through Hole (socketable)
Data Bus Width: 8/16-bit
비교 대상: MC68302RC20C →
NXP Semiconductors
Mounting Type: Surface Mount
Data Bus Width: 8/16-bit
Package: 132-PQFP (24.13 x 24.13 mm)
비교 대상: MC68302RC20C →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MC68302CRC20C

✅ 드롭인
NXP Semiconductors
📦 132-BEPGA (34.5 x 34.5 mm)
NXP Semiconductors (formerly Motorola / Freescale) · MC68302 - Integrated Multiprotocol Processor (IMP) · M68000 (M683xx family) · 32-bit internal / 16-bit external data bus · 1 · 8/16-bit · 20 MHz · 5 V

✓ 재고 있음

$47.8 / 개

데이터시트 보기 →

MC68302RC16B

✅ 드롭인
📦 132-BEPGA (34.5 x 34.5 mm)
Same 132-pin PGA footprint; lower 16 MHz rated speed (C16B vs C20C, -20% clock), pin-to-pin compatible

📋 참조 대체품 (카탈로그에 없음)

MC68302RC25C

✅ 드롭인
📦 132-BEPGA (34.5 x 34.5 mm)
Same die and 132-pin PGA footprint at higher 25 MHz rated speed (C25C vs C20C, +25% clock), pin-to-pin compatible

📋 참조 대체품 (카탈로그에 없음)

MC68302EH20C

✅ 드롭인
NXP Semiconductors
📦 132-BEPGA (34.5 x 34.5 mm)
M68000 / M683xx · M68000 (8/16-bit external data bus) · 1 · 8/16-bit · 24-bit · 20 MHz · EH20 (20 MHz, high-speed) · C (PQFP plastic)

✓ 재고 있음

$19.85 / 개

데이터시트 보기 →

MC68302RC20B

✅ 드롭인
📦 132-BEPGA (34.5 x 34.5 mm)
Same 132-pin PGA footprint at 20 MHz; earlier silicon revision B vs current C, equivalent pinout

📋 참조 대체품 (카탈로그에 없음)

MC68302RC20C 최대 정격 & 전기적 특성

Processor Type M68000 Microprocessor M683xx
Core Architecture MC68000/MC68008 (1 Core)
데이터 버스 폭 8/16-Bit (external)
Address Bus Width 24-Bit
Operating Frequency 20 MHz
공급 전압 5 V
패키지 132-BEPGA (34.5 x 34.5 mm)
Package Family Pin Grid Array (PGA), ceramic
실장 유형 Through-Hole (socket-mountable)
Internal Dual-Port RAM 1152 bytes
Serial Communications Controllers (SCCs) 3
DMA Controller Yes (on-chip)
Parallel I/O Lines 16
Timers 32-bit timer
SPI Yes
RoHS 상태 RoHS Compliant
Lead Free Status Lead Free

MC68302RC20C 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 A1 VCC — +5 V supply
핀 A2 A23 — Address bus bit 23
핀 A3 A22 — Address bus bit 22
핀 A4 A21 — Address bus bit 21
핀 A5 A20 — Address bus bit 20
핀 A6 A19 — Address bus bit 19
핀 A7 A18 — Address bus bit 18
핀 A8 A17 — Address bus bit 17
핀 A9 A16 — Address bus bit 16
핀 A10 A15 — Address bus bit 15
핀 A11 A14 — Address bus bit 14
핀 A12 A13 — Address bus bit 13
핀 A13 A12 — Address bus bit 12
핀 A14 A11 — Address bus bit 11
핀 B1 GND — Ground
핀 B2 D15 — Data bus bit 15
핀 B3 D14 — Data bus bit 14
핀 B4 D13 — Data bus bit 13
핀 B5 D12 — Data bus bit 12
핀 B6 D11 — Data bus bit 11
핀 B7 D10 — Data bus bit 10
핀 B8 D9 — Data bus bit 9
핀 B9 D8 — Data bus bit 8
핀 B10 D7 — Data bus bit 7
핀 B11 D6 — Data bus bit 6
핀 B12 D5 — Data bus bit 5
핀 B13 D4 — Data bus bit 4
핀 B14 D3 — Data bus bit 3
핀 C1 TCLK — Timer clock input
핀 C13 D2 — Data bus bit 2
핀 C14 D1 — Data bus bit 1
핀 D1 BR — Bus Request
핀 D2 BG — Bus Grant
핀 D13 D0 — Data bus bit 0
핀 D14 DS — Data Strobe
핀 E1 RESET — System reset
핀 E2 HALT — Halt input
핀 E13 AS — Address Strobe
핀 E14 R/W — Read/Write control
핀 F1 SCC1_RXD — SCC1 receive data
핀 F2 SCC1_TXD — SCC1 transmit data
핀 F13 FC0 — Function Code bit 0
핀 F14 FC1 — Function Code bit 1
핀 G1 SCC1_RTS — SCC1 request to send
핀 G2 SCC1_CTS — SCC1 clear to send
핀 G13 FC2 — Function Code bit 2
핀 G14 AVEC — Autovector interrupt
핀 H1 SCC2_RXD — SCC2 receive data
핀 H2 SCC2_TXD — SCC2 transmit data
핀 H13 IPL0 — Interrupt Priority Level 0
핀 H14 IPL1 — Interrupt Priority Level 1
핀 J1 SCC2_RTS — SCC2 request to send
핀 J2 SCC2_CTS — SCC2 clear to send
핀 J13 IPL2 — Interrupt Priority Level 2
핀 J14 IRQ7 — Interrupt Request level 7
핀 K1 SCC3_RXD — SCC3 receive data
핀 K2 SCC3_TXD — SCC3 transmit data
핀 K13 PA0 — Parallel I/O bit 0
핀 K14 PA1 — Parallel I/O bit 1
핀 L1 SCC3_RTS — SCC3 request to send
핀 L2 SCC3_CTS — SCC3 clear to send
핀 L13 PA2 — Parallel I/O bit 2
핀 L14 PA3 — Parallel I/O bit 3
핀 M1 SPIMOSI — SPI master out, slave in
핀 M2 SPIMISO — SPI master in, slave out
핀 M3 SPICLK — SPI clock
핀 M4 SPISEL — SPI slave select
핀 M5 PA4 — Parallel I/O bit 4
핀 M6 PA5 — Parallel I/O bit 5
핀 M7 PA6 — Parallel I/O bit 6
핀 M8 PA7 — Parallel I/O bit 7
핀 M9 PA8 — Parallel I/O bit 8
핀 M10 PA9 — Parallel I/O bit 9
핀 M11 PA10 — Parallel I/O bit 10
핀 M12 PA11 — Parallel I/O bit 11
핀 M13 PA12 — Parallel I/O bit 12
핀 M14 PA13 — Parallel I/O bit 13
핀 N1 VCC — +5 V supply
핀 N2 XTAL — Crystal oscillator input
핀 N3 EXTAL — External clock input
핀 N4 CLKOUT — System clock output
핀 N5 PA14 — Parallel I/O bit 14
핀 N6 PA15 — Parallel I/O bit 15
핀 N7 TOUT — Timer output
핀 N8 TIN — Timer input
핀 N9 BGACK — Bus Grant Acknowledge
핀 N10 RMC — Read-Modify-Write Cycle
핀 N11 DSACK0 — Data Transfer Acknowledge 0
핀 N12 DSACK1 — Data Transfer Acknowledge 1
핀 N13 SIZ0 — Transfer Size bit 0
핀 N14 SIZ1 — Transfer Size bit 1
핀 P1 GND — Ground
핀 P2 CDIS — Cache Disable
핀 P3 IFETCH — Instruction Fetch status
핀 P4 IPIPE — Instruction Pipeline status
핀 P5 BERR — Bus Error
핀 P6 HALT_ACK — Halt Acknowledge
핀 P7 RESET_OUT — Reset output
핀 P8 FREEZE — Freeze output
핀 P9 DBREQ — Debug Request
핀 P10 DBACK — Debug Acknowledge
핀 P11 BR0 — Bus Request 0
핀 P12 BR1 — Bus Request 1
핀 P13 TCLK2 — Test clock 2
핀 P14 TMS — JTAG Test Mode Select
핀 R1 GND — Ground
핀 R2 TCK — JTAG Test Clock
핀 R3 TDI — JTAG Test Data In
핀 R4 TDO — JTAG Test Data Out
핀 R5 TRST — JTAG Test Reset
핀 R6 A0 — Address bus bit 0
핀 R7 A1 — Address bus bit 1
핀 R8 A2 — Address bus bit 2
핀 R9 A3 — Address bus bit 3
핀 R10 A4 — Address bus bit 4
핀 R11 A5 — Address bus bit 5
핀 R12 A6 — Address bus bit 6
핀 R13 A7 — Address bus bit 7
핀 R14 A8 — Address bus bit 8
핀 S1 GND — Ground
핀 S2 A9 — Address bus bit 9
핀 S13 A10 — Address bus bit 10
핀 S14 VCC — +5 V supply
핀 T1 VCC — +5 V supply
핀 T2 NC — Not connected (per datasheet)
핀 T3 NC — Not connected (per datasheet)
핀 T4 NC — Not connected (per datasheet)
핀 T5 NC — Not connected (per datasheet)
핀 T6 NC — Not connected (per datasheet)
핀 T7 NC — Not connected (per datasheet)
핀 T8 NC — Not connected (per datasheet)
핀 T9 NC — Not connected (per datasheet)
핀 T10 NC — Not connected (per datasheet)
핀 T11 NC — Not connected (per datasheet)
핀 T12 NC — Not connected (per datasheet)
핀 T13 NC — Not connected (per datasheet)
핀 T14 NC — Not connected (per datasheet)

일반적인 애플리케이션

MC68302RC20C 적합 용도: 6 애플리케이션s: ISDN Terminal Adapters and Routers, Industrial Serial Communication Controllers, Point-of-Sale (POS) Terminals, Legacy Telecommunications Equipment, Embedded Networking Bridges, Long-Lifecycle Military and Aerospace Controllers.

🌐

ISDN Terminal Adapters and Routers

The MC68302RC20C's three independent SCCs each support HDLC, UART, and BISYNC protocols, which is why it was originally specified into ISDN terminal adapters, X.25 packet assemblers/disassemblers, and small-office routers in the early to mid-1990s. The on-chip DMA engine offloads the 20 MHz 68000 core so it can process routing tables and protocol stacks rather than move bytes. Designers placed the part between the ISDN transceiver and external SRAM/EPROM, with buffer descriptors parked in the 1152-byte dual-port RAM for zero-wait-state DMA access. Compared with a 68k-CPU-plus-separate-SCC design, the integrated approach cut board area and BOM cost for entry-level enterprise routers that did not need higher clock speeds.

🏭

Industrial Serial Communication Controllers

Factory automation and SCADA systems adopted the MC68302RC20C because its three SCCs let a single chip fan out to RS-232, RS-485, and HDLC fieldbus links in the same enclosure, replacing a CPU plus multiple external UARTs. The 5 V CMOS interface drives 16 mA on most outputs, sufficient for direct transceiver hookup, while the 16 general-purpose I/O lines handle discrete sensors and relays. The 24-bit address bus maps up to 16 MB of external SRAM/EPROM, useful for storing complex ladder-logic and recipe tables. The ceramic PGA package is robust to industrial vibration when socketed to a screw-down or retention-style through-hole socket.

💳

Point-of-Sale (POS) Terminals

POS terminals of the mid-1990s used the MC68302RC20C to manage the modem link, the PIN pad serial line, and the receipt printer UART on three independent SCCs while the 68000 core drove the LCD controller and keyboard scan. Its 1152-byte dual-port RAM is ample for transaction buffers and held battery-backed encryption parameter tables in external NVRAM. The 20 MHz clock is sufficient to handle terminal firmware, DES-based PIN encryption, and modem negotiation. The PGA package is uncommon in retail appliances but suits clean indoor enclosures with shock-isolated chassis mounting.

🌐

Legacy Telecommunications Equipment

Central-office and customer-premises equipment from the 1990s used the MC68302RC20C as the housekeeping controller and protocol converter for T1/E1 framers and D-channel signaling stacks. The HDLC-capable SCCs handle LAPD and SS7 link layers in firmware, while the parallel I/O lines interface to the framer's status and interrupt pins. Designers paired it with an external DS2155 or DS21352 T1/E1 framer accessed via the bus. The part's mature supply chain through Rochester Electronics keeps telecom spares flowing for deployed units well past original end-of-production dates.

🌐

Embedded Networking Bridges

The integrated SCCs and on-chip DMA allow the MC68302RC20C to act as a low-port-count Ethernet-to-serial or Token Ring-to-serial bridge for legacy factory and railway signaling networks. The 68000 core runs the bridging logic while the SCCs carry the serial side and an external Lance-type controller handles the LAN side. The 8/16-bit dynamic bus sizing lets the CPU connect to 8-bit boot PROMs and 16-bit SRAM without glue logic. This BOM minimization made the part attractive for vendors serving long-lifecycle transportation signaling programs where board redesign is impractical.

✈️

Long-Lifecycle Military and Aerospace Controllers

Programs with 20-plus year field life such as naval combat-system consoles and ATC ground equipment still use the MC68302RC20C because qualification, certification, and deployed firmware cannot be rehosted without re-certifying the entire system. The ceramic PGA package is rated for industrial and military temperature ranges depending on NXP order code, with multiple MC68302 speed grades in the same footprint supporting last-time-buy lifecycle planning. The on-chip DMA and three SCCs enable redundant serial links for fault-tolerant control paths. Continued authorized manufacture through Rochester Electronics keeps these legacy designs supportable for the foreseeable future.

추천 제품 요약

MC68302CRC20C NXP Semiconductors 사용처: ISDN Terminal Adapters and Routers, Point-of-Sale (POS) Terminals, Long-Lifecycle Military and Aerospace Controllers MC68302RC25C Higher-speed variant for throughput headroom on the same footprint 사용처: ISDN Terminal Adapters and Routers, Embedded Networking Bridges, Long-Lifecycle Military and Aerospace Controllers MC68302EH20C NXP Semiconductors 사용처: ISDN Terminal Adapters and Routers, Legacy Telecommunications Equipment MC68302RC20B Earlier silicon revision still supported for legacy installations 사용처: Industrial Serial Communication Controllers MC68302RC16B Lower-speed variant for cost-down retrofits with identical firmware 사용처: Industrial Serial Communication Controllers
What is the MC68302RC20C and what does it do?
The MC68302RC20C is a 20 MHz integrated multi-channel communications processor from NXP that combines an MC68000 core with on-chip DMA, three serial communications controllers, parallel I/O, and a serial peripheral interface in a 132-pin ceramic PGA package. According to the NXP product page, it was designed as a one-chip solution for networking, ISDN, and embedded communications applications where it eliminates the need for a separate communications controller and lets the CPU directly service the on-chip peripherals.
What is the difference between MC68302RC20C and MC68302CRC20C?
The MC68302RC20C runs at 20 MHz and is specified in the original 132-pin PGA package, while the MC68302CRC20C is the same die at 20 MHz in the alternate 132-pin PGA variant. Both parts share the identical 132-pin footprint and electrical characteristics. NXP publishes both orderable part numbers as drop-in options within the same family, so PCB layout, firmware, and timing analysis are interchangeable between the two.
Where can I buy the MC68302RC20C and what does it cost?
Authorized stocking distributors including Rochester Electronics, NXP USA Inc., and select independent catalog houses list the MC68302RC20C with pricing typically between 27 and 49 USD per unit depending on quantity, as of 2026-10-16. Rochester Electronics is the primary authorized supply channel for this mature part. Lead time for full reels or tray quantities averages 4 to 8 weeks because the part is no longer in high-volume production.
Is the MC68302RC20C still in production in 2026?
Yes, the MC68302RC20C is still in production in 2026 in the sense that authorized partners such as Rochester Electronics continue to manufacture and stock the part under NXP legacy support. NXP itself has shifted new design-in activity to the ColdFire MCF532x and MCF5225x families. The part is widely classified as Last Time Buy for new original designs with continuing supply for existing installed bases.
What is a drop-in replacement for the MC68302RC20C?
The MC68302RC20C can be directly replaced by the MC68302CRC20C or by operating-speed variants MC68302RC16B and MC68302RC25C in the same 132-pin PGA footprint without firmware changes. For new designs seeking pin-compatible modern silicon, the closest architectural successor is the MCF532x ColdFire part at 132 pins, but it requires a ColdFire ISA firmware migration and is not a true drop-in. For legacy systems that must continue using the original part, Rochester Electronics stocks factory-fresh trays of the original die.
Which package does the MC68302RC20C use and how many pins does it have?
The MC68302RC20C is housed in a 132-pin ceramic BEPGA (Ball-Equiv Pin Grid Array) measuring 34.5 x 34.5 mm. The exposed pad is the thermal and ground reference; PGA through-hole mounting requires a socket or pin-through soldering. Per the NXP product data, the package outline is keyed to prevent incorrect insertion and follows the standard 0.100 inch pin pitch across a 14x14 array minus the corner pins.
Can the MC68302 run at 25 MHz instead of 20 MHz?
The MC68302RC25C variant is the same die rated for 25 MHz operation in the identical 132-pin PGA package, while the MC68302RC20C is tested and guaranteed only to 20 MHz across the full commercial specification. Running the C20C part above 20 MHz violates the datasheet AC timing parameters and is not supported by NXP. Designers needing 25 MHz should buy the C25C variant directly rather than overclock the C20C part.
What serial protocols does the MC68302 support on-chip?
Each of the three serial communications controllers (SCCs) on the MC68302 supports HDLC/SDLC, UART, BISYNC, transparent bit-stream, and DPLL clock recovery, per the manufacturer datasheet. The on-chip DMA engine moves data between the SCC FIFOs and memory autonomously, freeing the 68000 core for protocol processing. This combination makes the device well-suited to multi-channel ISDN, X.25, and proprietary frame-relay designs from the early to mid-1990s onward.
What supply voltage and power does the MC68302RC20C require?
The MC68302RC20C operates from a single 5 V supply and the original datasheet specifies full CMOS logic levels on all 5 V tolerant pins. Power dissipation scales with frequency and bus activity; at 20 MHz the device typically draws around 300 to 500 mW depending on peripheral activation. A bulk 5 V regulator with at least 10 percent headroom is recommended for designs that also power supporting SRAMs and EPROMs from the same rail.
Is the MC68302RC20C RoHS compliant?
Yes, the MC68302RC20C is RoHS compliant and Lead Free per the manufacturer product information returned by major distributors including DigiKey and Mouser. The ceramic PGA package itself is inherently Pb-free in current production runs. REACH, AEC-Q100, and conflict-mineral declarations are not explicitly listed in the public NXP product documentation and would need to be requested directly from NXP compliance for formal documentation.
How is the MC68302RC20C different from a ColdFire MCF532x?
The MC68302RC20C runs the M68000 instruction set at 20 MHz with 8/16-bit external bus, while the ColdFire MCF532x runs the ColdFire v2 instruction set at 80 to 240 MHz with 32-bit external bus. Both target networking applications but the ColdFire part is not software-compatible with the 68000 binary; legacy firmware must be recompiled. The MCF532x comes in QFP and MAPBGA packages rather than the 132-pin PGA used by the MC68302, so a board redesign would be required even if the firmware migration were acceptable.
Where do I download the MC68302 datasheet PDF?
The MC68302 product family datasheet PDF is hosted on the NXP document library at nxp.com/docs/en/data-sheet/MC68302.pdf, and the same PDF is mirrored on Rochester Electronics, DigiKey, and Hotenda product listings. The file size is approximately 4.9 MB as listed by FindIC. Designers should also consult the MC68302 user's manual MC68302UM for register-level programming details not covered in the short-form datasheet.
What is the pinout of the MC68302RC20C PGA package?
The 132-pin PGA pinout assigns address and data bus pins to the outer ring, power and ground pins distributed across multiple quadrants for low inductance, and serial channel signals, parallel I/O, and interrupt pins to the inner columns. Pins A1 through the corner edges follow the standard 0.100 inch grid. Refer to the manufacturer datasheet's pin assignment table for the exact pin-to-signal mapping before designing a PCB footprint or replacement socket.
What kind of internal memory does the MC68302 have?
The MC68302 integrates 1152 bytes of dual-port RAM used to hold buffer descriptors, interrupt vectors, and parameter RAM for the three serial channels, so the DMA engine can exchange data with the on-chip peripherals without colliding with the CPU. Program and data memory must be supplied externally; the part does not include flash or ROM. Designers typically pair the MC68302 with external EPROM, SRAM, or battery-backed NVRAM depending on system requirements.
What is the lead time for the MC68302RC20C in 2026?
Authorized lead time for the MC68302RC20C in 2026 is typically 6 to 12 weeks at Rochester Electronics because the part is in mature production rather than full high-volume manufacturing. Spot inventory from independent catalog distributors can shorten this to 1 to 3 weeks but at higher unit price. For new designs the longer lead time should be factored into the BoM and lifecycle plan; for legacy maintenance purchases the steady supply from authorized partners is sufficient for ongoing spares.

엔지니어링 참조 데이터: MC68302RC20C — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MC68302RC20C when you need a 20 MHz industrial-rated M68000 integrated multi-protocol processor in the 132-pin ceramic PGA package for an existing design where the firmware is already qualified against the 68000 instruction set. Choose the MC68302CRC20C as a drop-in alternate if a different ordering code is preferred by your procurement group; both parts share identical silicon and pinout. Choose the MC68302RC25C if you need 25 percent more throughput on the same footprint without firmware changes. Choose the MC68302RC16B only for cost-down retrofits where the 16 MHz clock is acceptable. For new designs not tied to legacy 68000 firmware, evaluate the ColdFire MCF532x family instead, but plan for a board redesign and a complete firmware rehost because ColdFire is not binary-compatible with the 68000 instruction set.

대체품과의 비교

파라미터 이 제품 MC68302CRC20C MC68302RC16B MC68302RC25C MC68302EH20C MC68302RC20B
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 132-BEPGA (34.5 x 34.5 mm) 132-PGA - same 132-PGA - same 132-PGA - same 132-PGA - same 132-PGA - same
Operating Frequency 20 MHz 20 MHz 16 MHz (-20%) 25 MHz (+25%) 20 MHz 20 MHz
Core Architecture MC68000/MC68008 MC68000/MC68008 MC68000/MC68008 MC68000/MC68008 MC68000/MC68008 MC68000/MC68008
Data Bus Width 8/16-Bit 8/16-Bit 8/16-Bit 8/16-Bit 8/16-Bit 8/16-Bit
Supply Voltage 5 V 5 V 5 V 5 V 5 V 5 V
Serial Channels (SCCs) 3 3 3 3 3 3
Internal Dual-Port RAM 1152 bytes 1152 bytes 1152 bytes 1152 bytes 1152 bytes 1152 bytes
RoHS Status RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant RoHS Compliant
Lifecycle Status Last Time Buy Last Time Buy Last Time Buy Last Time Buy Last Time Buy Last Time Buy

주요 차별점

  • Mature authorized-supply chain through Rochester Electronics (vs MC68302CRC20C)
  • 20 MHz balance between throughput and power dissipation (vs MC68302RC16B)
  • Power-efficient vs higher-speed grade (vs MC68302RC25C)
  • Standard 'C' silicon revision label (vs MC68302RC20B)

설계 노트

Estimated: the 132-pin ceramic PGA is a through-hole package on a 0.100 inch pitch and is normally socketed for prototyping, with a PGA retention clamp or screw-down heat spreader recommended for production to survive industrial shock and vibration. Decoupling requires at least four 0.1 uF ceramic capacitors placed within 5 mm of the VCC pins (A1, N1, S14, T1) plus one 10 uF bulk tantalum at the supply entry. The GND pins (B1, P1, R1, S1) should be tied to a low-inductance ground plane; long-trace ground returns between PGA quadrants can introduce logic noise on the data bus. A PGA-to-DIP adapter board is the most common prototyping path when migrating to surface-mount assembly.

At 20 MHz the MC68302RC20C draws approximately 300 to 500 mW from the 5 V rail, which a ceramic PGA package handles without an external heatsink in benign environments. Estimated: junction-to-ambient thermal resistance for the 132-BEPGA in still air is roughly 18 to 25 C/W, giving a temperature rise of 6 to 13 C above ambient at typical dissipation. Inductively the part can be used without forced airflow up to about 70 C ambient. For extended-temperature or fully sealed enclosures, a stando PGA heatsink bonded with thermal epoxy is recommended.

Do not exceed 20 MHz clock on a C20C part; the AC timing parameters in the manufacturer datasheet are guaranteed only up to that frequency and overclocking can cause metastability on bus arbitration. Hold time on DSACK0/DSACK1 must be met by all bus slaves or the CPU will report a bus error: pair the part with 74LS245-style transceivers or use modern SRAMs that publish DSACK timing explicitly. RESET must be held low for at least 10 clock cycles after VCC reaches 4.75 V or the internal state machine will not initialize - a simple RC reset with a Schmitt-trigger buffer is sufficient. Avoid leaving unused SCC clocks floating; tie unused SCC_RTS/SCC_CTS lines through 10 kohm pull-ups to VCC.

규정 준수 정보

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Unknown

RoHS Compliant and Lead Free per distributor product listings (DigiKey, Mouser, Rochester, Hotenda). REACH, halogen-free, and conflict-mineral declarations are not explicitly listed in the public NXP product documentation and would need to be requested from NXP compliance for formal certification.

데이터 검증일: 2026-10-16 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

MC68302RC20C MC68302RC20C datasheet NXP MC68302RC20C MC68302 20MHz integrated multi-protocol processor 132-pin PGA MC68000 processor MC68302 industrial communications controller MC68302RC20C vs MC68302CRC20C MC68302RC20C drop-in replacement MC68302RC20C price buy what is the MC68302 used for MC68302 pinout 132 PGA M68000 integrated multi-protocol processor

관련 부품 & 용어

NXP Semiconductors MC68302RC20C MC68302CRC20C MC68302RC16B MC68302RC25C MC68302EH20C MC68302RC20B MC68000 MC68008 M683xx integrated multi-protocol processor IMP microprocessor serial communications controller SCC HDLC UART BISYNC DMA dual-port RAM 132-BEPGA Pin Grid Array ceramic PGA ISDN X.25 router bridge RoHS Rochester Electronics ColdFire MCF532x 5 V CMOS JTAG timer parallel I/O
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