MC8640DVU1000HE - Dual-Core 1GHz PowerPC SoC, 1023-FCBGA | NXP
부품 번호: MC8640DVU1000HE ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $178 | $178,000.00 |
MC8640DVU1000HE 개요
A microprocessor SoC (System-on-Chip) integrates the CPU cores, memory controller, and high-speed serial I/O into a single die. The MC8640 line, based on the PowerPC e600 architecture, extends the PowerQUICC III family with dual e600 cores, on-chip DDR1/DDR2 memory controller, Gigabit Ethernet MACs, PCI Express, Serial RapidIO (SRIO), and AltiVec SIMD vector processing. It belongs to the PowerQUICC > MPC86xx > MPC8640D > embedded microprocessor > SoC hierarchy used widely in carrier-grade and defense systems where deterministic compute and high-throughput I/O are mandatory.
Key features include 2x e600 cores at 1.0 GHz with AltiVec vector unit, a 64-bit DDR1/DDR2 memory controller with ECC, dual Gigabit Ethernet, PCI Express (x4/x8 lanes), Serial RapidIO, and a 1.05 V core supply. Industrial-grade 0 to 105 °C operating temperature, hardware virtualization support, and integrated security/cryptographic accelerators (SEC 3.0) make this part suited to secure, multi-tenant embedded platforms. The 1023-FCCBGA package exposes the full high-bandwidth I/O while supporting industrial thermal envelopes.
Architecturally, the MC8640DVU1000HE pairs two out-of-order e600 cores with a 1 MBx3 (BackSide) L2 cache per core, an MPX coherency fabric, and a multi-protocol serial I/O engine. The integrated memory controller supports up to DDR2-667 with ECC, sufficient for line-rate packet processing on the dual GbE MACs and the Serial RapidIO fabric. This is a Rev 3 silicon revision, distinguishing it from earlier stepping parts in the family.
Typical applications include embedded networking line cards (router/switcher applications), aerospace and defense avionics, telecom base-station control-plane processing, secure storage controllers, and military-grade signal-processing nodes. The combination of dual-core throughput, hardware encryption, and deterministic boot makes it suited to mission-critical deployments.
When designing with this device, ensure the PCB can deliver the high-current 1.05 V core rail (multiple decoupling phases required) and provide matched-length routing for DDR2 and Serial RapidIO links. The 33x33 mm FCCBGA requires high-layer-count (12+ layer) PCBs with microvia stacks for breakout.
This page synthesizes distributor pricing, drop-in alternatives within the MPC8640D family, and practical thermal/PCB design notes beyond the manufacturer datasheet to support engineering decision-making.
드롭인 대체품: MC8640DVU1000HE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC8640DVU1000HE (동일 폼 팩터 및 풋프린트) — 차이점: Memory Controller, Operating Temperature, Core Architecture, Core Frequency, Ethernet.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC8640DVU1067NE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC8640DTVJ1250HE
✅ 드롭인✓ 재고 있음
$439.13 / 개
데이터시트 보기 →MC8640DTVJ1067NE
✅ 드롭인✓ 재고 있음
$295 / 개
데이터시트 보기 →MC8640DVJ1000HE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC8640THX1067NE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC8640DVU1000HE 최대 정격 & 전기적 특성
| Processor Type | PowerPC e600, MPC86xx series |
| Number of Cores | 2 |
| Core Clock Speed | 1.0 GHz |
| 데이터 버스 폭 | 32-bit |
| Core Supply Voltage | 1.05 V |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V |
| Memory Controller | DDR1 / DDR2 with ECC |
| SIMD Engine | AltiVec |
| Ethernet | Gigabit Ethernet (dual) |
| High-Speed Serial I/O | PCI Express, Serial RapidIO (SRIO) |
| 패키지 / 케이스 | 1023-FCBGA (33x33 mm) |
| 동작 온도 | 0 °C to +105 °C (industrial) |
| Silicon Revision | Rev 3 |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | ROHS3 Compliant |
MC8640DVU1000HE 1023-fcbga (33x33 mm) 핀 구성 가이드
MC8640DVU1000HE(1023-fcbga (33x33 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC8640DVU1000HE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC8640DVU1000HE 적합 용도: 6 애플리케이션s: Embedded Networking Line Cards, Aerospace and Defense Avionics, Telecom Base Station Control-Plane, Secure Storage Controllers, Industrial Control and SBC, Military Signal Processing Nodes.
Embedded Networking Line Cards
The MC8640DVU1000HE's dual e600 cores at 1.0 GHz with AltiVec SIMD deliver 2.4 GHz of effective scalar compute plus vector throughput for IPv4/v6 forwarding on the integrated dual GbE MACs. Its DDR2 controller with ECC sustains line-rate lookups while Serial RapidIO connects to lookaside co-processors and fabric ASICs. Placed on a router/switcher line card, the dual-core architecture allows separation of control-plane and data-plane threads. Power draw at 1.05 V is moderate but multi-rail, requiring careful PCB power plane design.
추천
Aerospace and Defense Avionics
The MC8640DVU1000HE's industrial 0-105 °C operating range, hardware encryption (SEC 3.0), and dual-core determinism suit mission-computer platforms. The AltiVec unit accelerates signal-processing kernels used in radar, EW, and datalink subsystems. The 1023-FCBGA package supports ruggedized PCB stack-ups with under-fill and corner bonding for high-vibration environments. Drop-in compatibility with the MC8640THX1067NE allows performance scaling on the same PCB artwork across program variants.
추천
Telecom Base Station Control-Plane
In 3G/5G base-station controllers, the MC8640DVU1000HE handles OAM signaling, encryption, and L2/L3 termination on the integrated GbE MACs. The DDR2 controller supports multi-gigabit packet buffers for buffering control-plane bursts. PCI Express links connect to baseband modem ASICs while Serial RapidIO connects to DSP clusters. Dual-core architecture allows deterministic partition between real-time MAC scheduling and management-plane stacks.
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Secure Storage Controllers
The MC8640DVU1000HE's hardware SEC 3.0 engine accelerates AES, 3DES, SHA, and RSA operations for iSCSI and NAS controllers, offloading main cores for file-system processing. Dual GbE MACs sustain line-rate encrypted throughput while PCI Express connects to SAS/SATA controllers. The DDR2 ECC controller is critical for RAID write-hole avoidance in enterprise storage arrays. Drop-in variants allow tier scaling from mid-range to high-end storage appliances.
추천
Industrial Control and SBC
The MC8640DVU1000HE's 1.0 GHz dual-core compute, industrial temperature grade, and integrated I/O suite make it a high-performance embedded SBC controller. PCI Express and GbE enable machine-vision and motion-control peripherals; DDR2 ECC ensures reliable operation in factory environments. AltiVec accelerates FFT and image-processing kernels for vision-guided robotics. The dual-core partition isolates real-time control from HMI/logging threads.
추천
Military Signal Processing Nodes
For tactical signal-processing and SDR platforms, the MC8640DVU1000HE's AltiVec unit accelerates FFT, FIR, and modulation kernels while Serial RapidIO connects to FPGA co-processors for high-bandwidth IF sampling. Hardware SEC 3.0 enables red/black isolation for cryptographic systems. The 1023-FCBGA supports ruggedized enclosures meeting MIL-STD-810 shock/vibration. Drop-in variants like MC8640THX1067NE support aerospace-grade program requirements on the same PCB.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC8640DVU1000HE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC8640DVU1067NE | MC8640DTVJ1250HE | MC8640DTVJ1067NE | MC8640DVJ1000HE | MC8640THX1067NE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same |
| Core Clock Speed | 1.0 GHz | 1.067 GHz | 1.25 GHz | 1.067 GHz | 1.0 GHz | 1.067 GHz |
| Number of Cores | 2 (e600) | 2 (e600) | 2 (e600) | 2 (e600) | 2 (e600) | 2 (e600) |
| Core Supply Voltage | 1.05 V | 1.05 V | 1.1 V | 1.05 V | 1.05 V | 1.05 V |
| Silicon Revision | Rev 3 (DVU) | Rev 3 (DVU) | Rev 3 (DTVJ) | Rev 3 (DTVJ) | Rev (DVJ) | Rev 3 (THX) |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | -40 °C to +105 °C |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Price (qty-1, USD) | ~$285 | [DATA_NEEDS] | [DATA_NEEDS] | [DATA_NEEDS] | [DATA_NEEDS] | [DATA_NEEDS] |
주요 차별점
- Rev 3 silicon revision with improved DDR2 timing margins (vs MC8640DVJ1000HE)
- Industrial temperature grade for harsh-environment deployment (vs MC8640THX1067NE)
- Cost-optimized 1.0 GHz clock target (vs MC8640DTVJ1250HE)
설계 노트
The MC8640DVU1000HE requires multiple supply rails (1.05 V core, 1.8 V / 2.5 V / 3.3 V I/O) with strict sequencing. Estimated: core rail current draw at 1.0 GHz is approximately 8-10 A. Use a multi-phase buck controller with input capacitors rated for the inrush of BGA bulk-decoupling. Place high-frequency MLCC bypass within 5 mm of each power ball cluster to suppress simultaneous-switching noise.
The 1023-FCBGA (33x33 mm) requires a high-layer-count PCB (12+ layers) with microvia-in-pad or stacked-via breakout. Estimated: each BGA row break-out uses 4 layers of signal routing plus dedicated power/ground planes. Maintain matched-length routing for DDR2 (max ±50 ps skew), PCI Express (max ±150 uin), and Serial RapidIO. Use controlled-impedance stack-up per NXP design guide.
At 1.05 V core and 1.0 GHz, the die dissipates an estimated 15-20 W depending on workload. The FCCBGA top-side thermal pad requires a heatsink or heat-spreader with thermal interface material. Estimated: junction-to-ambient thermal resistance is approximately 8-12 °C/W with proper heatsink attachment. Monitor junction temperature via the on-chip thermal sensor and throttle clock or workload to maintain Tj below 110 °C.
Common pitfalls when designing with the MC8640DVU1000HE: (1) incorrect DDR2 termination causing write-eye failures; (2) violating power-supply sequencing causing latch-up at POR; (3) insufficient BGA solder paste volume leading to head-in-pillow opens during reflow; (4) ignoring silicon revision compatibility when porting firmware between Rev 3 (DVU) and earlier Rev (DVJ) devices. Always reference the latest NXP errata document for the specific silicon revision.
Serial RapidIO and PCI Express interfaces require AC-coupling capacitors and 85-100 ohm differential routing with matched intra-pair skew. DDR2 requires fly-by topology with VTT termination at the end of the address/command bus. Use IBIS-AMI simulation per the MPC8640D design guide before committing to stack-up. Estimated: signal-integrity margins shrink substantially above 800 MHz SerDes rates.
규정 준수 정보
ROHS3 compliant per distributor listing. REACH and halogen-free status should be confirmed with NXP substance declaration. AEC-Q100 not applicable - this is industrial-grade, not automotive-grade.