MC8641VJ1500KE - PowerPC e600 SoC 1.5GHz 994-FCCBGA | NXP
부품 번호: MC8641VJ1500KE ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 100 | $239 | $23,900.00 |
| 500 | $218 | $109,000.00 |
| 1,000 | $198 | $198,000.00 |
MC8641VJ1500KE 개요
A PowerPC SoC of this class is a highly integrated embedded processor that combines a CPU core, memory controller, and multiple high-speed I/O peripherals in a single BGA package. The e600 core itself is a 32-bit Power Architecture implementation derived from the classic PowerPC family; it is not the same as ARM-based SoCs, and is positioned for high-performance embedded applications such as networking, storage, and industrial imaging. Within the broader taxonomy, it belongs to the hierarchy: PowerPC e600 -> Power Architecture microprocessor -> embedded MPU -> microprocessor IC -> integrated circuit -> semiconductor.
Key specifications of the MC8641VJ1500KE include a three-issue superscalar out-of-order pipeline, 1.5 GHz core clock, on-die AltiVec vector unit, integrated 64-bit DDR1/DDR2 memory controller, dual Gigabit Ethernet MACs, x4/x8 PCI Express interface, dual 4x Serial RapidIO ports, and operating temperature range of 0°C to 105°C. The "KE" suffix denotes the commercial temperature grade while "1500" denotes the 1.5 GHz speed bin.
This part has been declared End of Life by NXP, with the last product page indicating discontinuance and replacement guidance. Engineers designing new platforms should treat it as a legacy/NRND component and evaluate the recommended replacement listed by NXP. Rochester Electronics and other authorized distributors continue to support the part for existing designs and long-life programs.
Typical applications for the MC8641VJ1500KE include control-plane processors in routers and switches, RAID/HBA storage controllers, industrial imaging and machine vision, military/aerospace embedded computing, and single-board computers in telecom and defense platforms. Its combination of AltiVec, GbE, PCIe, and SRIO makes it well suited to data-movement-heavy workloads where deterministic latency and high throughput are required.
When designing with this device, plan thermal dissipation around the FCCBGA 33x33 mm land pattern - the part is normally cooled with a heatsink or chassis-level airflow, not by PCB copper alone. Board layout must route the four DDR data byte lanes with matched impedance and length-matched clocks; violation of the DDR1/DDR2 topology guidelines is the most common source of bring-up failures. Use NXP's BSDL and BDM tooling for boundary-scan and debug rather than JTAG-only infrastructure.
This page synthesizes authorized-distributor availability, drop-in alternative variants within the same FCCBGA package, and practical design notes not always summarized in the original NXP product brief.
드롭인 대체품: MC8641VJ1500KE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC8641VJ1500KE (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, Maximum Core Frequency, PCI Express, Package, Serial RapidIO.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC8641VU1500KE
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →MC8641VJ1333JE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC8641VJ1000NE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8641DTVJ1250HE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8640DTVJ1067NE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC8641VJ1500KE 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series / Family | MPC8641 (single-core PowerPC e600) |
| Core | PowerPC e600 (32-bit Power Architecture, 3-issue superscalar) |
| Number of Cores | 1 |
| Maximum Core Frequency | 1.5 GHz (1500 MHz) |
| 동작 온도 범위 | 0 °C to +105 °C (commercial, "KE" suffix) |
| Silicon Revision | Rev 3 |
| SIMD / Vector Engine | AltiVec on-die |
| Memory Controller | 64-bit DDR1/DDR2 with ECC |
| Ethernet | Dual Gigabit Ethernet MACs |
| PCI Express | x4 / x8 PCIe interface |
| Serial RapidIO | Dual 4x Serial RapidIO (SRIO) ports |
| 패키지 | 994-ball FCCBGA, 33 x 33 mm |
| 실장 유형 | Surface Mount (BGA) |
| Bit Width | 32-bit |
MC8641VJ1500KE 994-ball fccbga, 33 x 33 mm 핀 구성 가이드
MC8641VJ1500KE(994-ball fccbga, 33 x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC8641VJ1500KE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC8641VJ1500KE 적합 용도: 6 애플리케이션s: Network Router Control-Plane Processor, RAID / HBA Storage Controller, Industrial Imaging and Video Processing, Single-Board Computers for Aerospace and Defense, Telecom Baseband and Channel Cards, Print and Imaging Controller Boards.
Network Router Control-Plane Processor
The MC8641VJ1500KE's 1.5 GHz e600 core with AltiVec and integrated GbE plus Serial RapidIO makes it a strong fit for control-plane processing in enterprise and carrier-grade routers. The on-die dual Gigabit Ethernet MACs allow direct connection to management-plane PHYs, while the dual 4x SRIO ports carry traffic to line-card processors. At 1.5 GHz the e600 sustains deterministic interrupt latency for routing-protocol daemons, and AltiVec accelerates packet-classification lookups. In a typical reference design the part is paired with an external L3 switch ASIC over PCIe x4/x8.
추천
RAID / HBA Storage Controller
Storage controllers benefit from the MC8641VJ1500KE's DDR1/DDR2 memory controller with ECC, PCIe host interface, and AltiVec-accelerated XOR/RAID parity compute. The 64-bit DDR2 controller with ECC sustains the working-set bandwidth of large write-back caches, while the integrated x4/x8 PCIe link connects to the host server's chipset. AltiVec SIMD dramatically accelerates Galois-field XOR used in RAID-6, often 2-3x over scalar code. The 994-FCCBGA package accommodates the dense signal escape required for both PCIe lanes and SAS/SATA expander links.
추천
Industrial Imaging and Video Processing
Machine-vision and broadcast-imaging systems leverage AltiVec's SIMD performance for image processing kernels such as convolution, color-space conversion, and motion estimation. The MC8641VJ1500KE at 1.5 GHz can sustain real-time HD-SDI processing pipelines including deinterlacing and scaling. Its dual GbE and PCIe interfaces support high-bandwidth sensor input, while the 0-105 °C commercial temperature range covers most factory-floor environments. The 994-FCCBGA package pairs with a heatsink and chassis airflow for thermal dissipation at full load.
추천
Single-Board Computers for Aerospace and Defense
The MC8641VJ1500KE is widely deployed on VME/VPX single-board computers in aerospace and defense programs, where the PowerPC toolchain and BSP maturity are decisive selection criteria. The 994-FCCBGA ceramic-BGA package supports the temperature and vibration profiles typical of MIL-STD-810 environments when paired with appropriate underfill and a rigidized heatsink. On-die GbE plus SRIO provide dual-redundant fabrics to mission computers, and the DDR2 controller with ECC meets the integrity requirements of safety-critical avionics. Long-term support through Rochester Electronics sustains the program lifecycle.
추천
Telecom Baseband and Channel Cards
Channel cards in telecom infrastructure (DSLAMs, BTS baseband units, and media gateways) historically use the MC8641VJ1500KE for its combination of AltiVec DSP-like acceleration, GbE, and Serial RapidIO. The dual 4x SRIO links provide low-latency interconnect to adjacent DSP or framer ASICs, while GbE uplinks connect to the network. The DDR2 controller with ECC handles the packet buffer memory for traffic shaping. At 1.5 GHz the e600 sustains MAC scheduling and encryption offload without breaking real-time budgets.
추천
Print and Imaging Controller Boards
High-end production-print controllers have used the MC8641VJ1500KE to drive the rendering pipeline, with AltiVec accelerating Adobe PostScript and PDF rasterization. The PCIe link connects to engine controllers, the dual GbE provides network connectivity, and the DDR2 controller with ECC supports large page buffers. The 0-105 °C commercial temperature grade covers the printer's interior environment with chassis airflow. Existing programs continue to use the part because the rendering stack is already qualified on the e600 PowerPC platform.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC8641VJ1500KE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC8641VU1500KE | MC8641VJ1333JE | MC8641VJ1000NE | MPC8641DTVJ1250HE | MPC8640DTVJ1067NE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 994-FCCBGA (33x33) | 994-FCCBGA (33x33) - same | 994-FCCBGA (33x33) - same | 994-FCCBGA (33x33) - same | 994-FCCBGA (33x33) - same | 994-FCCBGA (33x33) - same |
| Core Count | 1 (single e600) | 1 (single e600) | 1 (single e600) | 1 (single e600) | 2 (dual e600) | 2 (dual e600) |
| Core Frequency | 1.5 GHz | 1.5 GHz | 1.333 GHz (-11%) | 1.0 GHz (-33%) | 1.25 GHz per core | 1.067 GHz per core |
| SIMD / Vector Engine | AltiVec | AltiVec | AltiVec | AltiVec | AltiVec | AltiVec |
| Memory Controller | DDR1/DDR2 64-bit + ECC | DDR1/DDR2 64-bit + ECC | DDR1/DDR2 64-bit + ECC | DDR1/DDR2 64-bit + ECC | DDR1/DDR2 64-bit + ECC | DDR1/DDR2 64-bit + ECC |
| Gigabit Ethernet | Dual GbE MACs | Dual GbE MACs | Dual GbE MACs | Dual GbE MACs | Dual GbE MACs | Dual GbE MACs |
| PCI Express | x4 / x8 PCIe | x4 / x8 PCIe | x4 / x8 PCIe | x4 / x8 PCIe | x4 / x8 PCIe | x4 / x8 PCIe |
| Serial RapidIO | Dual 4x SRIO | Dual 4x SRIO | Dual 4x SRIO | Dual 4x SRIO | Dual 4x SRIO | Dual 4x SRIO |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
| Approx. Unit Price (qty 1) | USD 285 | USD ~285 (same die) | USD ~250 | USD ~210 | USD ~320 | USD ~290 |
주요 차별점
- Highest single-core clock in the MC8641 family (vs MC8641VJ1333JE)
- Single-core die optimized for deterministic single-thread latency (vs MPC8641DTVJ1250HE)
- Commercial 0-105 °C temperature grade (vs MC8641VJ1000NE)
- On-die AltiVec SIMD engine (vs Non-AltiVec PowerPC e500 parts)
설계 노트
Estimated: at full 1.5 GHz load with both cores of the family active and DDR traffic, the FCCBGA 33x33 mm part requires a heatsink plus 200-400 LFM of chassis airflow; relying on PCB copper alone is insufficient. Use the thermal model from NXP's MPC8641 hardware specifications document and validate with a thermocouple on the package top center under worst-case workload. Many designs use a clip-on heatsink with thermal interface material rated for the 0-105 °C range.
Route the four DDR2 byte lanes with matched impedance (typically 50 ohm single-ended) and length-match within the byte group plus a tighter tolerance for the DDR clock and DQS pairs. Use the NXP DDR2 design checklist for the MPC8641 family; violations of the address/control fly-by length are the most common bring-up failure. The PCIe x4/x8 lanes require 85 ohm differential impedance and length matching of 5 mils within a lane.
The 4x Serial RapidIO ports run at 3.125 Gbaud per lane and require AC-coupling capacitors at the transmit side, plus length-matched differential pairs (typically 100 ohm differential). Keep SRIO traces away from the GbE and PCIe lanes to avoid crosstalk, and provide a solid reference plane on layer 2. Use NXP's SRIO layout checklist for the MPC8641 family.
Power sequencing on the MC8641VJ1500KE requires Avdd before Vddcore, with monotonic ramp times per the datasheet. A common pitfall is using a common-mode choke with insufficient saturation current on the GbE lines, which corrupts packets at high temperature. Validate BSDL files against Rev 3 silicon because earlier revisions had boundary-scan fixes for the SRIO and PCIe blocks.
규정 준수 정보
RoHS, REACH, lead-free, and halogen-free status not stated in the verified web data; recommend confirming against the NXP PCN or material declaration. AEC-Q100 not applicable (this is a high-end commercial/industrial MPU, not an automotive grade part).
