MC8641VU1500KE - PowerPC e600 MPU, 1.5GHz, 994-FCCBGA | NXP
부품 번호: MC8641VU1500KE ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $275 | $2,750.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $195 | $195,000.00 |
MC8641VU1500KE 개요
A microprocessor (MPU) is the central execution unit of an embedded computing platform. It fetches instructions, decodes them, performs arithmetic and logical operations, and orchestrates peripherals through on-chip buses. In the embedded hierarchy it sits above microcontrollers in complexity because it relies on external DRAM and sophisticated I/O subsystems; high-performance MPUs target networking, telecom, industrial control, and aerospace applications where deterministic throughput and rich I/O are required. The MC8641 family specifically targets embedded infrastructure requiring multi-protocol I/O and cryptographic acceleration.
Key features include the three-issue e600 core with a 7-stage pipeline that handles unpredictable branches efficiently, dual-integrated DDR1/DDR2 controllers with ECC, four 10/100/1000 Mbps Ethernet MACs, and dual PCI Express endpoints. The AltiVec 128-bit SIMD engine accelerates signal processing and crypto workloads. An on-chip security engine supports DES, 3DES, AES, RSA, and elliptic curve operations. The 0 to 105°C operating range suits industrial and extended-temperature environments.
Architecturally, the device uses a 90 nm process, multiple voltage rails (1.05V core, 1.1V/1.8V/2.5V/3.3V I/O), and a coherent crossbar fabric that allows future dual-core variants such as the MPC8641D family to share memory. The 33x33 mm FCCBGA is a ceramic flip-chip package suited for high-pin-count designs where signal integrity and thermal performance matter. Power management includes sleep and deep-sleep modes plus per-domain clock gating to reduce consumption when idle.
Typical applications include line cards for routing and switching, industrial controllers, defense and aerospace compute platforms, and storage controllers. The combination of multi-gigabit I/O, hardware crypto, and AltiVec SIMD makes it especially well suited to secure networking and packet-processing designs. Production status is Obsolete per the latest distributor listings; remaining stock and franchised brokers should be evaluated for long-term programs.
When designing with this device, plan power sequencing carefully because the 1.05V core rail must ramp with respect to the I/O rails, and route DDR signals with matched lengths and controlled impedance to preserve timing margin at 1.5 GHz core speed. Use at least eight decoupling capacitor values (from 10 nF up to 220 uF) distributed under the BGA to suppress transient current demand.
This page synthesizes distributor stock, parametric drop-in alternatives within the MPC8641 family, and practical board-design guidance not collected in the manufacturer datasheet.
드롭인 대체품: MC8641VU1500KE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC8641VU1500KE (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, Package, PCI Express, Mounting Type, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC8641VU1000NE
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →MC8641DVJ1333JE
✅ 드롭인✓ 재고 있음
$660 / 개
데이터시트 보기 →MC8641VU1250KE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC8641VJ1500KE
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →MC8641VU1500KE 최대 정격 & 전기적 특성
| Core Processor | PowerPC e600 |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 1.5 GHz |
| Supply Voltage (Core) | 1.05 V |
| Supply Voltage (I/O) | 1.1 V / 1.8 V / 2.5 V / 3.3 V |
| RAM Controllers | DDR1, DDR2 (with ECC) |
| Ethernet | 4 x 10/100/1000 Mbps MAC |
| PCI Express | Dual x4 PCIe endpoints |
| Serial RapidIO | Yes |
| AltiVec SIMD Engine | Yes (128-bit) |
| Cryptographic Acceleration | AES, DES/3DES, RSA, ECC |
| 패키지 | 994-FCCBGA (33x33 mm), ceramic flip-chip |
| 핀 수 | 1023 (effective BGA balls) |
| 동작 온도 | 0°C to +105°C |
| RoHS 상태 | RoHS compliant (ceramic BGA) |
| Process Technology | 90 nm CMOS |
MC8641VU1500KE 994-fccbga (33x33 mm), ceramic flip-chip 핀 구성 가이드
MC8641VU1500KE(994-fccbga (33x33 mm), ceramic flip-chip 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC8641VU1500KE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC8641VU1500KE 적합 용도: 6 애플리케이션s: Telecom Line Card Compute, Industrial Routing and Switching, Defense and Aerospace Embedded Compute, Storage Controller and RAID Compute, Secure Network Appliance, Medical Imaging Embedded Controller.
Telecom Line Card Compute
The MC8641VU1500KE's 1.5 GHz e600 core and AltiVec SIMD engine handle packet classification, deep-packet inspection, and encryption at line rate on telecom line cards. Its four Gigabit Ethernet MACs feed multi-port gigabit aggregation without an external switch, while the integrated AES/3DES/RSA engine offloads IPsec and MACsec from the CPU. The dual DDR2 controllers with ECC sustain multi-gigabit throughput, and PCI Express endpoints link to co-processors or fabric switches. Compared with newer QorIQ parts, the MC8641VU1500KE trades peak performance per watt for mature software ecosystems and long-term firmware stability.
추천
Industrial Routing and Switching
In industrial routers and managed switches, the MC8641VU1500KE combines Serial RapidIO and PCI Express links for backplane connectivity, four GbE MACs for switching fabric access, and DDR2 memory for table storage. The 0 to 105°C operating range supports outdoor cabinet installations and factory-floor deployments. Hardware-accelerated cryptography enables secure VPNs and firewalls without offloading to a companion ASIC. Compared with microcontrollers, the 1.5 GHz e600 core sustains Layer 2-7 processing with predictable latency across traffic bursts.
추천
Defense and Aerospace Embedded Compute
Defense platforms use the MC8641VU1500KE for radar front-end processing, signal intelligence, and avionics networking because of its AltiVec SIMD performance and deterministic 7-stage pipeline. The hardware crypto engine supports secure communications required by mission systems, while the 994-ball FCCBGA package's ceramic substrate withstands vibration and thermal cycling better than plastic BGA. ECC-protected DDR2 memories deliver radiation-tolerant single-event-upset resilience for low-earth-orbit applications. Compared with modern SoCs, the MC8641VU1500KE remains favored where legacy software baselines are locked.
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Storage Controller and RAID Compute
Storage subsystems leverage the MC8641VU1500KE's PCI Express endpoints and four Gigabit Ethernet MACs to consolidate iSCSI, NFS, and SMB workloads on a single SoC. The DDR2 controllers with ECC protect cached data integrity, while the AltiVec engine accelerates XOR parity calculation and Reed-Solomon erasure coding used in RAID 6 and distributed-storage stacks. The integrated crypto accelerators enable inline AES-XTS encryption for self-encrypting drives without CPU overhead. Compared with discrete RAID cards, the MC8641VU1500KE delivers similar throughput with lower BOM and board area.
추천
Secure Network Appliance
Firewall, VPN, and unified-threat-management appliances rely on the MC8641VU1500KE's hardware AES, DES/3DES, RSA, and ECC engines to sustain multi-gigabit encrypted throughput. The four GbE ports provide WAN/LAN/DMZ segmentation, while the PCI Express links attach crypto co-processors or bypass NICs. The AltiVec SIMD accelerates pattern matching in intrusion-detection workloads, and the DDR2 memory controllers buffer deep session tables. Compared with general-purpose CPUs, the MC8641VU1500KE delivers deterministic security throughput at lower idle power.
추천
Medical Imaging Embedded Controller
Ultrasound and endoscopy platforms deploy the MC8641VU1500KE because its AltiVec 128-bit SIMD engine accelerates FFT, FIR, and beamforming kernels used in image reconstruction pipelines. The dual DDR2 controllers sustain high-bandwidth sample buffers, while the four GbE MACs stream compressed DICOM or H.264 video to network archives. Hardware crypto accelerators protect patient data at rest and in transit, supporting HIPAA compliance. Compared with PC-class processors, the MC8641VU1500KE offers similar compute in a fanless 0 to 105°C envelope suited to medical-cart or bedside equipment.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC8641VU1500KE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC8641VU1000NE | MC8641DVJ1333JE | MC8641VU1250KE | MC8641VJ1500KE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 994-FCCBGA (33x33) | 994-FCCBGA (33x33) - same | 994-FCCBGA (33x33) - same | 994-FCCBGA (33x33) - same | 994-FCCBGA (33x33) - same |
| Core Frequency | 1.5 GHz | 1.0 GHz | 1.333 GHz | 1.25 GHz | 1.5 GHz |
| Number of Cores | 1 | 1 | 2 | 1 | 1 |
| RAM Controllers | DDR1, DDR2 (ECC) | DDR1, DDR2 (ECC) | DDR1, DDR2 (ECC) | DDR1, DDR2 (ECC) | DDR1, DDR2 (ECC) |
| Ethernet MACs | 4 x 1 GbE | 4 x 1 GbE | 4 x 1 GbE | 4 x 1 GbE | 4 x 1 GbE |
| Operating Temperature | 0 to 105°C | 0 to 105°C | 0 to 105°C | 0 to 105°C | J-grade |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest single-core clock speed in MPC8641 family (vs MC8641VU1250KE)
- Single-core silicon vs dual-core (vs MC8641DVJ1333JE)
- Industrial temperature range 0 to 105°C (vs MC8641VJ1500KE)
설계 노트
Estimated: The MC8641VU1500KE requires four voltage rails (1.05V core, 1.1V/1.8V/2.5V/3.3V I/O) with strict power-on sequencing. Drive the 1.05V core rail before or simultaneously with I/O rails and use NXP-recommended soft-start controllers (e.g., LTC3880 derivatives) to avoid latch-up. Decouple each rail with at least 8 ceramic caps per BGA region ranging from 10 nF to 220 uF, and add bulk polymer capacitors adjacent to the FCCBGA. Include a voltage supervisor to hold the core in reset until the 1.05V rail stabilizes within ±5%.
Route the DDR2 signals as point-to-point matched-length pairs within 25 mil tolerance, with controlled impedance of 50 ohm single-ended and 100 ohm differential for DDR strobes. Use the NXP reference design stackup (typically 12 layers, 1 oz copper, low-loss FR-4 or Megtron-6) and keep BGA fanout in the inner signal layers using microvias. Stitch ground vias around the 994-ball perimeter to suppress coupling from SerDes and PCI Express lanes, and isolate analog PLL supplies with a guard ring tied to ground.
Estimated: At 1.5 GHz with all four Ethernet MACs and PCI Express active, the device can dissipate 15-25 W. The 33x33 mm FCCBGA ceramic substrate allows direct-attached heatsinks with thermal interface material rated at least 1 W/mK. Mount the heatsink with a clip rated for 10-15 lbf preload and add a thermal sensor on the package top for closed-loop throttling via the e600 core's on-die thermal diodes.
Do not assume the MC8641VU1500KE has identical power sequencing to the MPC8641D dual-core family; consult the latest reference manual for voltage ramp order. Avoid mixing DDR1 and DDR2 memories on the same controller because the calibration sequence differs. Always program the SERDES reference clock and PCIe clock before releasing reset, and confirm JTAG boundary-scan compliance before reflow.
규정 준수 정보
Ceramic FCCBGA package is RoHS compliant per distributor listings. Not AEC-Q100 qualified (industrial/extended-grade part). Halogen-free status not confirmed in verified web data.
