MC8641VU1000NE - 1GHz PowerPC e600 SoC, GbE/SRIO | NXP
부품 번호: MC8641VU1000NE ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $215 | $21,500.00 |
| 500 | $188 | $94,000.00 |
| 1,000 | $165 | $165,000.00 |
MC8641VU1000NE 개요
A microprocessor SoC (System-on-Chip) is a single integrated circuit that combines a CPU core, memory controller, and peripheral interfaces on one die. The MC8641 belongs to the PowerPC MPC86xx family of high-performance embedded processors, descending from the Power Architecture instruction set and historically targeted at networking line cards, base stations, and storage controllers. Within the broader semiconductor taxonomy it is classified as an embedded microprocessor (MPU), a sibling category to microcontrollers (MCU) but distinguished by external DRAM, MMU-based virtual memory, and Linux/VxWorks operating-system support rather than firmware-only execution.
Key features of the MC8641VU1000NE include one e600 superscalar core with AltiVec SIMD engine, dual DDR1/DDR2 32-bit memory controllers with ECC support, four 10/100/1000 Mbps Ethernet MACs, two PCI Express interfaces, two Serial RapidIO ports, and integrated I2C, UART, SPI, and GPIO peripherals. The 90 nm CMOS process and seven-stage pipeline deliver high IPC efficiency for branchy networking code, while the FCCBGA package supports high-speed SerDes escape without external termination.
The e600 core uses a three-issue superscalar out-of-order pipeline with 32 KB I-cache and 32 KB D-cache per core, plus a unified 1 MB L2 cache shared with the platform. Integrated DMA engines and a hardware table-walk unit accelerate packet processing, while the memory controller supports up to 8 GB of DDR2 with ECC. This combination makes it a natural fit for control-plane and data-plane workloads on a single die.
Typical applications include networking line cards and routers, where the integrated GbE/SRIO/PCIe interfaces connect directly to fabric and co-processors; telecom base-station controllers; industrial control and factory automation; military/aerospace embedded systems; and storage RAID controllers. The four Gigabit Ethernet MACs in particular make this part well suited to multi-port aggregation and switching line cards.
When designing with the MC8641VU1000NE, plan PCB stack-up for the FCCBGA's high-speed SerDes lanes and provide clean 1.05 V core regulation with bulk decoupling near the package. The 33 x 33 mm BGA requires a multi-layer PCB with microvia-in-pad or HDI construction to escape the inner-row balls; design thermal copper under the lid to dissipate the 15-20 W typical power envelope.
This page synthesizes distributor pricing, RoHS/compliance status, drop-in pin-compatible alternatives from the MPC86xx family, and practical PCB layout guidance not found in the manufacturer datasheet, giving engineers a single source for sourcing, comparison, and design decisions on the MC8641VU1000NE.
드롭인 대체품: MC8641VU1000NE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC8641VU1000NE (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, PCI Express, Ethernet, Silicon Revision.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC8641VJ1000NE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC8641DVU1000GE
✅ 드롭인✓ 재고 있음
$295.5 / 개
데이터시트 보기 →MC8641VU1066NE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC8641VU1500NE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC8641VU1000NE 최대 정격 & 전기적 특성
| Core Processor | PowerPC e600 |
| Number of Cores | 1 |
| Bus Width | 32-bit |
| Core Clock Speed | 1.0 GHz |
| Co-Processor / DSP | AltiVec SIMD engine |
| RAM Controllers | DDR1, DDR2 (with ECC) |
| Ethernet | 10/100/1000 Mbps x4 (GbE) |
| Serial RapidIO (SRIO) | Yes |
| PCI Express | Yes |
| Graphics Acceleration | No |
| Core Voltage | 1.05 V |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| 동작 온도 | 0 °C to +105 °C |
| Silicon Revision | Rev 3.0 |
| Process Technology | 90 nm CMOS |
| 패키지 | 994-ball FCCBGA (33 x 33 mm) |
| 실장 유형 | Surface Mount (BGA) |
| 공급 전압 | 1.05 V / 1.8 V / 2.5 V / 3.3 V |
| Series | MPC86xx |
MC8641VU1000NE 994-ball fccbga (33 x 33 mm) 핀 구성 가이드
MC8641VU1000NE(994-ball fccbga (33 x 33 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC8641VU1000NE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC8641VU1000NE 적합 용도: 6 애플리케이션s: Networking Line Cards and Routers, Telecom Base Station Controllers, Industrial Control and Factory Automation, Military and Aerospace Embedded Systems, Storage RAID and NAS Controllers, Medical Imaging Equipment.
Networking Line Cards and Routers
The MC8641VU1000NE is purpose-built for networking line cards where four integrated Gigabit Ethernet MACs, dual PCI Express lanes, and Serial RapidIO ports connect directly to fabric ASICs without external glue logic. With the e600 core running at 1.0 GHz and AltiVec SIMD accelerating packet classification, a single SoC handles routing-table lookups, ACLs, and forwarding on a typical line card. The dual DDR2 controllers with ECC support up to 8 GB of packet buffer memory, while the 0 to +105 °C thermal range supports industrial-temperature chassis. Reference designs pair the MC8641 with NXP QorIQ fabric companions or external PHY transceivers for multi-port SFP line cards in core and edge routers.
추천
Telecom Base Station Controllers
The MC8641VU1000NE's e600 core, deterministic DDR2 memory, and quad GbE make it well suited for base-station controller boards in 3G/4G baseband units. AltiVec accelerates turbo-decoder and channel-codec DSP workloads at the application layer, while SRIO links to baseband DSPs such as the MSC8156. The 1.05 V core with industrial 105 °C rating supports outdoor cabinet installations without active cooling. Linux BSPs and VxWorks support from NXP shorten time-to-market for telecom OEMs transitioning from PowerQUICC III designs.
추천
Industrial Control and Factory Automation
Industrial controllers benefit from the MC8641VU1000NE's quad GbE for deterministic EtherCAT or PROFINET gateway designs, dual PCI Express for vision-system frame grabbers, and the industrial -40 to +105 °C thermal range (industrial screen). The 1.0 GHz e600 runs complex motion-control algorithms with sub-cycle latency while DDR2 with ECC protects against single-bit errors in factory-floor environments. The FCCBGA package supports conformal coating and vibration-tolerant PCB assemblies, making the part a fit for DIN-rail industrial PCs and PLC backplanes.
추천
Military and Aerospace Embedded Systems
The MC8641VU1000NE is widely deployed in defense and aerospace embedded systems due to its rugged ceramic FCCBGA package, radiation-tolerant process, and long lifecycle support. The e600 core with AltiVec supports signal-processing workloads in radar front-ends, electronic-warfare subsystems, and avionics mission computers. The integrated GbE and SRIO interfaces connect to FPGAs and DSP arrays in high-channel-count sensor systems. Defense OEMs rely on NXP's controlled-billing program for long-term availability of MPC86xx silicon.
추천
Storage RAID and NAS Controllers
Storage RAID controllers leverage the MC8641VU1000NE's quad GbE for 4-port NAS aggregation, dual PCI Express for SAS/SATA host-bus adapters, and ECC DDR2 for cache-coherent write-back operations. The e600's AltiVec accelerates XOR parity calculations and Reed-Solomon erasure coding at line rate. The integrated DMA engines move data between GbE MACs and PCIe-attached storage controllers with minimal CPU intervention, while the 8 GB DDR2 ceiling supports large write-back caches in mid-range RAID arrays.
추천
Medical Imaging Equipment
Medical imaging systems such as CT scanners, ultrasound consoles, and MRI reconstruction engines use the MC8641VU1000NE as the main control processor. The e600 core runs image-acquisition pipelines, while the quad GbE interfaces connect to high-resolution camera modules and networked PACS archives. AltiVec accelerates pixel-level DSP kernels for backprojection and beamforming in real time. The FCCBGA package with industrial thermal rating fits compact imaging-cart enclosures, and long-term NXP support matches medical-device lifecycle requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC8641VU1000NE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC8641VJ1000NE | MC8641DVU1000GE | MC8641VU1066NE | MC8641VU1500NE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 994-FCCBGA (33x33 mm) | 994-FCCBGA (33x33 mm) - same | 994-FCCBGA (33x33 mm) - same | 994-FCCBGA (33x33 mm) - same | 994-FCCBGA (33x33 mm) - same |
| Core Processor | PowerPC e600 (single core) | PowerPC e600 (single core) | PowerPC e600 (dual core) | PowerPC e600 (single core) | PowerPC e600 (single core) |
| Clock Speed | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.066 GHz | 1.5 GHz |
| Number of Cores | 1 | 1 | 2 | 1 | 1 |
| Gigabit Ethernet | 4 ports | 4 ports | 4 ports | 4 ports | 4 ports |
| DDR Memory Support | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 |
| Operating Temperature | 0 to +105 °C | 0 to +105 °C | 0 to +105 °C | 0 to +105 °C | 0 to +105 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Single-core 1.0 GHz sweet spot for cost-sensitive designs (vs MC8641DVU1000GE (dual-core))
- Silicon revision 3.0 errata coverage (vs MC8641VJ1000NE)
- Quad GbE MACs in a single SoC (vs External Ethernet switch ICs)
- AltiVec SIMD co-processor for packet processing (vs PowerQUICC III MPC8536 (no AltiVec))
설계 노트
Estimated: at typical SoC workloads the MC8641VU1000NE dissipates 15-20 W. The 994-ball FCCBGA has a thermal resistance on the order of 0.5-1.0 C/W with a properly designed thermal lid and chassis airflow. For natural-convection enclosures, derate the ambient by 10-15 °C and consider a heat spreader bonded to the package lid. Reference NXP AN3947 for thermal modeling guidelines.
The 33 x 33 mm FCCBGA package requires HDI PCB construction with microvia-in-pad for inner-row ball escape. Plan at least 8 PCB layers: dedicated ground and 1.05 V core planes sandwiched between high-speed signal layers. Maintain 100 Ω differential impedance for SRIO/PCIe/SerDes lanes and 50 Ω single-ended for DDR2 traces. Reference NXP MPC8641 Design Checklist for layer stack-up and via pattern guidance.
Decouple the 1.05 V core rail with 22 µF bulk ceramic plus 0.1 µF/1 nF high-frequency caps adjacent to each power-ball cluster. The 1.8 V/2.3 V DDR2 termination voltage (GVTT) requires a separate low-noise LDO sourced from the 3.3 V rail; do not share inductors with switching converters. Ramp the core voltage with at least 1 ms rise time to avoid inrush latch-up.
Do not assume cross-compatibility between MC8641 (single-core) and MC8641D (dual-core) firmware binaries - the boot ROM and RCW differ. Verify the 32-bit DDR2 ECC path uses the correct DIMM organization; mismatched ECC width will surface as machine checks under load. The FCCBGA lid is non-conductive but should not be soldered to thermal vias without insulation.
규정 준수 정보
RoHS/REACH compliance not documented in Verified Web Data; AEC-Q100 not applicable (this is an MPU not an automotive analog IC). Request compliance certificates from NXP or authorized distributor before designing into RoHS-restricted markets.
