MC9S08AC60CFDE - 8-bit S08 MCU 60KB Flash 40MHz QFN-48 | NXP
부품 번호: MC9S08AC60CFDE ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $10.74 | $10.74 |
| 10 | $10.2 | $102.00 |
| 100 | $9.67 | $967.00 |
| 500 | $9.14 | $4,570.00 |
| 1,000 | $8.6 | $8,600.00 |
MC9S08AC60CFDE 개요
An 8-bit MCU (microcontroller unit) integrates a processor core, memory, and peripherals on a single chip, sitting at the entry level of the embedded controller hierarchy: MCU -> embedded processor -> system-on-chip. The S08 (HCS08) core is NXP's enhanced 8-bit CISC architecture descended from the HC08 family, executing up to a 20 MHz internal bus frequency while the CPU clock reaches 40 MHz.
Key features of the MC9S08AC60 include an up to 16-channel, 10-bit ADC with automatic compare function, two SCI (serial communications interface) modules supporting LIN 2.0 protocol and SAE J2602, one SPI (serial peripheral interface) module, and an IIC (inter-integrated circuit) bus module. Flash-based program memory supports in-system reprogramming, which simplifies field updates during development and production.
A defining characteristic of the AC family is Flexis series compatibility: the 8-bit S08AC128/96/60/48/32 devices are pin-, peripheral-, and tool-compatible with the 32-bit MCF51AC256/128 V1 ColdFire devices. This allows engineers to migrate between 8-bit and 32-bit performance tiers on the same PCB footprint without redesigning hardware or switching development tools.
Typical applications include automotive body electronics, HVAC and appliance control, motor control辅助 circuits, industrial sensing nodes, and LIN-bus based actuator modules, where the ADC plus SCI/LIN peripheral set covers sensing and networked control requirements.
A key design consideration is lifecycle status: NXP lists this part as NRND (Not Recommended for New Designs), so new designs should evaluate the pin-compatible S08AC alternatives or the 32-bit MCF51AC256 siblings. Note this page is an independent technical summary.
This page synthesizes distributor pricing, drop-in alternatives within the AC and AW families, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: MC9S08AC60CFDE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S08AC60CFDE (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Processor, RoHS Status, Communication Interfaces, Flash Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S08AC48CFDE
✅ 드롭인✓ 재고 있음
$4.76 / 개
데이터시트 보기 →MC9S08AC32CFDE
✅ 드롭인✓ 재고 있음
$3.02 / 개
데이터시트 보기 →MC9S08AC96CFDE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC9S08AC128CFDE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCF51AC256BCLKE
✅ 드롭인✓ 재고 있음
$3.05 / 개
데이터시트 보기 →S9S08AW60E5MFDE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08AC60CFDE 최대 정격 & 전기적 특성
| Core Processor | S08 (HCS08), 8-bit CISC |
| Core Size | 8-bit |
| CPU Clock Speed | 40 MHz |
| Internal Bus Frequency | 20 MHz |
| Flash Memory | 60 KB (60K x 8) |
| Supply Voltage Range | 2.7 V to 5.5 V |
| 동작 공급 전압 | 3.3 V / 5 V |
| Number of I/O | 38 |
| ADC Resolution | 10-bit |
| ADC Channels | Up to 16-channel with automatic compare function |
| Communication Interfaces | 2x SCI (LIN 2.0, SAE J2602), SPI, IIC |
| Peripherals | ADC, SCI, SPI, IIC |
| 패키지 | 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad |
| 실장 유형 | Surface Mount |
| Family Compatibility | Pin-, peripheral- and tool-compatible with MCF51AC256/128 (Flexis) |
| 수명 주기 상태 | NRND (per NXP product page) |
| RoHS 상태 | ROHS COMPLIANT (per distributor datasheet listing) |
| Packaging | Tray |
MC9S08AC60CFDE 48-qfn-ep (7x7 mm), 48-vfqfn exposed pad 핀 구성 가이드
MC9S08AC60CFDE(48-qfn-ep (7x7 mm), 48-vfqfn exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC9S08AC60CFDE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC9S08AC60CFDE 적합 용도: 6 애플리케이션s: Automotive LIN Bus Body Control Nodes, HVAC and Appliance Control, Industrial Sensor and Actuator Nodes, Battery Chargers and Power Management Boards, Consumer Appliances and Small Home Automation, Flexis Migration Development Platforms.
Automotive LIN Bus Body Control Nodes
The MC9S08AC60CFDE fits automotive body-electronics nodes because its two SCI modules natively support LIN 2.0 and SAE J2602, including master extended break generation and slave extended break detection. A window-lift or seat-adjust module typically uses one SCI for the LIN network at up to 19.2 kbps while the second SCI serves diagnostics. The 10-bit ADC samples position potentiometers or hall sensors across up to 16 channels, and 60 KB Flash holds both application firmware and calibration tables. Operating from 2.7 V to 5.5 V allows direct connection to regulated 5 V rails derived from the vehicle battery. The 48-QFN-EP 7x7 mm exposed-pad package provides a low-inductance ground return for switching load drivers.
추천
HVAC and Appliance Control
In HVAC blowers, refrigerator controls, and dishwasher main boards, the MC9S08AC60CFDE serves as the main control MCU, reading NTC temperature sensors through its 10-bit ADC with automatic compare function - the compare function can generate thresholds without CPU intervention, offloading polling loops. The 38 I/O lines drive relays, triac gates, stepper dampers, and seven-segment displays directly. 60 KB Flash accommodates multi-language UI tables and PID control code, and IIC connects an external EEPROM for user settings. Its 40 MHz CPU (20 MHz bus) executes closed-loop motor control fast enough for single-phase blower feedback. The 2.7 V to 5.5 V supply range simplifies power design from transformer-derived 5 V rails common in white goods.
추천
Industrial Sensor and Actuator Nodes
For 4-20 mA loop-powered transmitters and remote I/O blocks, the MC9S08AC60CFDE combines a 10-bit ADC with two SCI ports, enabling Modbus RTU over RS-485 on one SCI while reserving the second for configuration. The 20 MHz internal bus gives adequate integer performance for scaling, filtering, and linearization of sensor data in fixed-point arithmetic. 60 KB Flash stores multiple sensor personality tables selectable via DIP switches on I/O pins, and IIC interfaces precision front-ends such as the AD7124 or similar delta-sigma converters when higher resolution than 10 bits is needed. The QFN exposed pad provides solid thermal and ground connection for industrial ambient ranges. The 5 V supply operation eases interfacing to legacy industrial logic levels.
추천
Battery Chargers and Power Management Boards
Smart chargers for lead-acid and Li-ion packs use the MC9S08AC60CFDE to run charge-state state machines, read voltage and current via the 10-bit ADC (automatic compare can flag over-voltage without software latency), and report status over an SCI UART to a host or display. Two SCI modules allow simultaneous host communication and pack-level diagnostics. 60 KB Flash holds charging profiles for multiple battery chemistries, and IIC controls charge-controller ICs or fuel gauges on the SMBus-compatible bus. The 2.7 V to 5.5 V operation tolerates brownout conditions during bulk-charge transients when paired with adequate bulk capacitance and the MCU's low-voltage detection. The 38 I/O lines drive LED bars, relays, and fan control directly.
추천
Consumer Appliances and Small Home Automation
Rice cookers, coffee machines, and smart plugs use the MC9S08AC60CFDE where a single chip must manage user interfaces, mains switching, and sensor feedback. The 38 I/O ports directly scan keypads and drive multiplexed LCD/LED segments, while the 10-bit ADC reads thermistors and AC zero-cross signals for triac phase control of heaters and motors. Two SCI ports give one channel for a UART Wi-Fi/Bluetooth module bridge and one for factory test. The 40 MHz core handles debounce, phase-angle timing, and communication concurrently. Because the part is NRND, new consumer designs should prefer the same-footprint MC9S08AC96 or migrate to MCF51AC256; existing production lines can continue sourcing through XAIPART BOM services while stock lasts.
추천
Flexis Migration Development Platforms
The MC9S08AC60CFDE is a strategic fit for development programs that must hedge between 8-bit and 32-bit performance. NXP designed the S08AC128/96/60/48/32 devices to be pin-, peripheral-, and tool-compatible with the MCF51AC256/128 V1 ColdFire devices, so a single 48-QFN PCB can host either the 8-bit MC9S08AC60CFDE or the 32-bit MCF51AC256BCLKE. Firmware structure, peripheral drivers, and debugging workflows (CodeWarrior toolchain) carry across the boundary. This lets teams start on the 8-bit part for cost, then swap to the 32-bit part if algorithm complexity grows - a genuine drop-in migration rather than a redesign. The 60 KB Flash version is the most common starting point because it leaves the largest migration margin.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S08AC60CFDE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S08AC48CFDE | MC9S08AC96CFDE | MCF51AC256BCLKE | S9S08AW60E5MFDE |
|---|---|---|---|---|---|
| Package | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same | QFN-48 - Flexis pin-compatible | QFN-48 - verify pin map |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | S08 8-bit CISC, 40 MHz | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz | ColdFire V1 32-bit | S08AW 8-bit, 40 MHz |
| Flash Memory | 60 KB | 48 KB | 96 KB | 256 KB | 60 KB |
주요 차별점
- Flexis dual-architecture migration path (vs S9S08AW60E5MFDE)
- Largest Flash in the family at 60 KB among volume variants (vs MC9S08AC48CFDE)
- Hardware-assisted LIN 2.0 and SAE J2602 on dual SCI (vs MC9S08AC32CFDE)
설계 노트
The MC9S08AC60CFDE is NRND per the NXP product page. Do not start new production designs on this exact MPN. If the 60 KB density is required, design the PCB against the shared AC-family 48-QFN footprint so the same board accepts MC9S08AC48/96/128 or the 32-bit MCF51AC256. Also verify the QFN case outline revision: the datasheet addendum documents a gold-to-copper wire bond migration that changed 98A case outline numbers, which matters for mechanical qualification drawings.
Operate from a well-decoupled 5 V rail (or 3.3 V if ADC full-scale allows). Place 100 nF ceramic capacitors at each VDD/VSS pin pair plus one 4.7-10 uF bulk capacitor near the exposed pad, which should be soldered to a grounded thermal via array for both grounding and heat. Because the ADC reference is supply-derived, heavy load switching on shared I/O (relays, triacs) can corrupt conversions - convert ADC channels during quiet windows or add RC filtering (e.g., 1 kOhm + 100 nF) on analog inputs.
For LIN applications, route the SCI TX/RX to the LIN transceiver with a series resistor at the transceiver side and keep the loop area small against the exposed-pad ground. Keep the oscillator/external clock traces short and away from PWM or relay-drive traces. Assign the ADC automatic-compare thresholds in firmware to catch out-of-range sensor faults without continuous polling - this is a documented feature of the 16-channel 10-bit converter and reduces interrupt load in safety-relevant monitoring loops.
규정 준수 정보
Distributor datasheet listing states ROHS COMPLIANT for the QFN-48 package. Detailed REACH, AEC-Q100 qualification, lead-free and halogen-free status should be confirmed via the NXP product page environmental quality section.
