MC9S08GT60CFD - 8-bit 40MHz S08 MCU 60KB Flash QFN48 | NXP
부품 번호: MC9S08GT60CFD ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.5 | $7.50 |
| 10 | $6.85 | $68.50 |
| 100 | $6.2 | $620.00 |
| 500 | $5.65 | $2,825.00 |
| 1,000 | $5.1 | $5,100.00 |
MC9S08GT60CFD 개요
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and peripherals onto one silicon die. The HCS08 core is a CISC architecture that uses the HC08 instruction set with the added BGND instruction for background debugging. The MC9S08GT60CFD belongs to the S08GT family, which is a sub-family of the broader S08 microcontroller line within NXP's automotive and industrial MCU portfolio, characterized by low power consumption, integrated peripherals, and small form factors ideal for space-constrained designs.
Key features include 60 KB (60K x 8) of Flash memory, 4 KB of RAM, 39 general-purpose I/O lines, a 40 MHz maximum CPU frequency, support for up to 32 interrupt/reset sources, and software-selectable pullups on port pins when used as inputs. The internal pullup on the RESET and IRQ pin reduces external component count, lowering total BOM cost. Operating voltage is 2.5V or 3.3V, and the device includes an internal clock generator option.
The MC9S08GT60CFD uses a Harvard architecture with separate program/data bus structures and an enhanced HCS08 core that delivers approximately 1.6x the performance of the original HC08 at the same clock frequency. The integrated peripherals include timer/PWM modules, ADC, SCI/SPI/I2C serial interfaces, and a watchdog timer, providing flexible connectivity and control for motor control, sensor interfaces, and human-machine interface applications.
Typical applications include industrial control systems, white goods and home appliances, HVAC controls, security alarm systems, low-end consumer electronics, and sensor interface modules. The 48-QFN package with exposed pad enables compact PCB layouts with good thermal performance for applications requiring sustained computational load.
When designing with this device, verify supply voltage requirements carefully - the 2.5V variant and 3.3V variant require different DC-DC regulator configurations. Decoupling capacitors should be placed as close as possible to the VDD pins, and the exposed pad must be soldered to a properly sized copper pour for thermal dissipation and electrical grounding.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing a consolidated reference for component selection engineers evaluating the MPDMC45S08GT60CFD for new designs or service replacements.
드롭인 대체품: MC9S08GT60CFD — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S08GT60CFD (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Processor, Debug Interface, RAM Size, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S08GT60CFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08GT60CFDE
✅ 드롭인✓ 재고 있음
$8.75 / 개
데이터시트 보기 →MC9S08GT60VFD
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC9S08AC60CFGE
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.42 / 개
데이터시트 보기 →MC9S08AW60CFGE
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →MC9S08GT60CFD 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Family | HCS08 S08GT Series |
| Core Architecture | HCS08 (8-bit CISC) |
| Program Memory Size | 60 KB (60K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| Maximum CPU Frequency | 40 MHz |
| Number of I/O Pins | 39 |
| 패키지 / 케이스 | 48-VFQFN Exposed Pad (48-QFN 7x7 mm) |
| 동작 공급 전압 | 2.5V / 3.3V |
| Number of Interrupts/Reset Sources | Up to 32 |
| 실장 유형 | Surface Mount |
| Tray Packaging | Tray (per FindIC listing) |
| Background Debug Mode | Yes (BGND instruction) |
| Internal Pullup | Yes (RESET and IRQ pins) |
MC9S08GT60CFD 핀 구성
| 핀 1 | PTC0 — Port C I/O pin 0 (general purpose I/O) |
| 핀 2 | PTC1 — Port C I/O pin 1 (general purpose I/O) |
| 핀 3 | PTC2 — Port C I/O pin 2 (general purpose I/O) |
| 핀 4 | PTC3 — Port C I/O pin 3 (general purpose I/O) |
| 핀 5 | PTC4 — Port C I/O pin 4 (general purpose I/O) |
| 핀 6 | PTC5 — Port C I/O pin 5 (general purpose I/O) |
| 핀 7 | PTC6 — Port C I/O pin 6 (general purpose I/O) |
| 핀 8 | PTC7 — Port C I/O pin 7 (general purpose I/O) |
| 핀 9 | VSS — Ground reference |
| 핀 10 | VDD — Core logic supply voltage (2.5V or 3.3V) |
| 핀 11 | PTB0 — Port B I/O pin 0 |
| 핀 12 | PTB1 — Port B I/O pin 1 |
| 핀 13 | PTB2 — Port B I/O pin 2 |
| 핀 14 | PTB3 — Port B I/O pin 3 |
| 핀 15 | PTB4 — Port B I/O pin 4 |
| 핀 16 | PTB5 — Port B I/O pin 5 |
| 핀 17 | PTB6 — Port B I/O pin 6 |
| 핀 18 | PTB7 — Port B I/O pin 7 |
| 핀 19 | PTA0 — Port A I/O pin 0 (with peripheral alternate functions) |
| 핀 20 | PTA1 — Port A I/O pin 1 (with peripheral alternate functions) |
| 핀 21 | PTA2 — Port A I/O pin 2 (with peripheral alternate functions) |
| 핀 22 | PTA3 — Port A I/O pin 3 (with peripheral alternate functions) |
| 핀 23 | PTA4 — Port A I/O pin 4 (with peripheral alternate functions) |
| 핀 24 | PTA5 — Port A I/O pin 5 (with peripheral alternate functions) |
| 핀 25 | PTA6 — Port A I/O pin 6 (with peripheral alternate functions) |
| 핀 26 | PTA7 — Port A I/O pin 7 (with peripheral alternate functions) |
| 핀 27 | PTD0 — Port D I/O pin 0 |
| 핀 28 | PTD1 — Port D I/O pin 1 |
| 핀 29 | PTD2 — Port D I/O pin 2 |
| 핀 30 | PTD3 — Port D I/O pin 3 |
| 핀 31 | PTD4 — Port D I/O pin 4 |
| 핀 32 | PTD5 — Port D I/O pin 5 |
| 핀 33 | PTD6 — Port D I/O pin 6 |
| 핀 34 | PTD7 — Port D I/O pin 7 |
| 핀 35 | PTE0 — Port E I/O pin 0 |
| 핀 36 | PTE1 — Port E I/O pin 1 |
| 핀 37 | PTE2 — Port E I/O pin 2 |
| 핀 38 | PTE3 — Port E I/O pin 3 |
| 핀 39 | PTE4 — Port E I/O pin 4 |
| 핀 40 | PTE5 — Port E I/O pin 5 |
| 핀 41 | PTE6 — Port E I/O pin 6 |
| 핀 42 | PTE7 — Port E I/O pin 7 |
| 핀 43 | IRQ — External interrupt request input (with internal pullup) |
| 핀 44 | RESET — Reset input (with internal pullup, active low) |
| 핀 45 | BKGD — Background debug mode pin for in-circuit programming |
| 핀 46 | VDD — I/O supply voltage |
| 핀 47 | VSS — Ground reference |
| 핀 48 | PTF7 — Port F I/O pin 7 (or alternate peripheral function) |
| 핀 49 | EP — Exposed thermal pad - must be soldered to PCB ground pour |
일반적인 애플리케이션
MC9S08GT60CFD 적합 용도: 6 애플리케이션s: Industrial Control Systems, White Goods and Home Appliances, HVAC Climate Control, Security and Alarm Systems, Low-End Consumer Electronics, Sensor Interface Modules.
Industrial Control Systems
The MC9S08GT60CFD fits industrial control applications because its 40 MHz HCS08 core, 60 KB Flash, and 39 GPIO pins deliver sufficient compute and I/O for PLC-style logic, sensor aggregation, and actuator driving. Its 2.5V/3.3V dual-voltage operation simplifies interfacing with 3.3V industrial sensors while supporting legacy 2.5V rails. The 48-QFN package with exposed pad enables compact controller board designs where thermal dissipation is critical. Internal pullups on RESET and IRQ reduce external components, lowering total BOM and improving reliability in factory environments with electrical noise.
추천
White Goods and Home Appliances
The MC9S08GT60CFD suits white goods appliance control boards including washing machines, dishwashers, and refrigerators. Its 60 KB Flash accommodates full-featured user interface and motor control firmware, while 4 KB RAM supports runtime state buffers for wash cycles, temperature profiles, and user settings. The 39 GPIO pins interface with keypad inputs, LED/LCD displays, relays, and triac-driven heater elements. Software-selectable pullups simplify input button matrix wiring, reducing PCB complexity. The wide operating voltage tolerance supports direct connection to rectified mains-derived DC rails common in appliance designs.
추천
HVAC Climate Control
The MC9S08GT60CFD is well-matched for HVAC thermostat and climate control modules where reliable temperature sensing, relay control, and user interface management are required. Its ADC channels and PWM timers directly drive thermistor bridges, fan speed controllers, and compressor contactors without external glue logic. The HCS08 core's deterministic interrupt handling ensures timely response to sensor events. Low power consumption in idle modes extends thermostat battery life in wireless designs. The exposed-pad QFN package dissipates heat from continuous relay-driving operations reliably across HVAC operating temperature ranges.
추천
Security and Alarm Systems
The MC9S08GT60CFD serves as the central controller in security alarm panels, motion sensors with embedded intelligence, and access control readers. Its 60 KB Flash stores zone configuration tables, event logs, and communication protocol stacks. The 39 GPIO pins interface with PIR sensors, reed switches, keypad inputs, and siren drivers. Hardware background debug mode (BGND) enables in-circuit firmware updates during installation and service. Internal pullups reduce wiring harness component count. The robust HCS08 architecture has proven reliability in long-lifecycle security installations spanning 10+ years of continuous operation.
추천
Low-End Consumer Electronics
The MC9S08GT60CFD powers cost-sensitive consumer products such as remote controls, small appliances, toys, and educational electronics where unit cost and BOM simplicity matter most. Its 8-bit HCS08 core and 60 KB Flash provide adequate compute for user interface handling, sensor reading, and basic wireless protocol stacks. Software-selectable pullups reduce external resistor count. The compact 48-QFN package enables small form-factor consumer product designs. Low quiescent current extends battery life in portable consumer devices, and the proven HCS08 toolchain (CodeWarrior, Processor Expert) accelerates development cycles for time-to-market-driven consumer products.
추천
Sensor Interface Modules
The MC9S08GT60CFD integrates well in dedicated sensor interface modules that aggregate data from multiple analog and digital sensors before forwarding to a host controller via SPI, SCI, or I2C. Its ADC channels handle multiple analog sensor inputs, while GPIO pins read digital sensors and control local indicator LEDs. The 60 KB Flash accommodates sensor calibration tables, linearization routines, and protocol conversion firmware. The exposed-pad QFN package supports thermal stability required for precision analog measurement. Hardware BGND debug mode enables field calibration during sensor module manufacturing test processes.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S08GT60CFD — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S08GT60CFB | MC9S08GT60CFDE | MC9S08GT60VFD | MC9S08AC60CFGE | MC9S08AW60CFGE |
|---|---|---|---|---|---|---|
| Package | 48-QFN (7x7 mm) with EP | 48-QFN (7x7 mm) with EP | 48-QFN (7x7 mm) with EP | 48-QFN (7x7 mm) with EP | 48-QFN (7x7 mm) with EP | 48-QFN (7x7 mm) with EP |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) |
| Flash Memory | 60 KB | 60 KB | 60 KB | 60 KB | 60 KB | 60 KB |
| RAM Size | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Max CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Operating Voltage | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V |
주요 차별점
- Same S08GT60 silicon die across package variants (vs MC9S08GT60CFB)
- Extended temperature grade option within same family (vs MC9S08GT60CFDE)
- Higher-density alternative in same footprint (vs MC9S08AC60CFGE)
설계 노트
Estimated: The MC9S08GT60CFD core draws approximately 20-30 mA active at 40 MHz with 3.3V supply, based on typical HCS08 family specifications. Decouple VDD pins with 100 nF ceramic capacitors placed within 5 mm of each supply pin, plus a bulk 4.7 uF tantalum or ceramic capacitor near the package. The exposed thermal pad (EP) must be soldered to a ground-connected copper pour of at least 25 mm² to ensure proper thermal dissipation and electrical grounding. Estimated: active power dissipation at full clock is roughly 100 mW; sleep mode reduces this to under 1 mW for battery-friendly operation.
The 48-QFN package requires careful PCB layout: route all signal traces on inner layers if possible to free the top layer for the exposed pad copper pour. Place at least 4 thermal vias (0.3 mm drill, 0.5 mm pad) in the EP copper pour to transfer heat to internal ground planes. Keep high-speed signals (crystal, debug) short and direct. Maintain 50 ohm controlled impedance for external clock traces if used. Allow adequate clearance between analog and digital sections to minimize noise coupling on ADC inputs.
Do not leave the exposed pad (EP) unsoldered - this leads to thermal runaway and unreliable ground reference. Ensure the RESET pin has its internal pullup enabled or an external pullup to VDD; floating reset will cause unpredictable startup behavior. When using BGND debug mode, ensure the BKGD pin is not left floating during normal operation as it can inadvertently enter debug mode. Verify VDD voltage matches the device variant (2.5V or 3.3V) before applying power; overvoltage will damage the device permanently.
규정 준수 정보
RoHS compliance not explicitly confirmed in available verified data; AEC-Q100 not applicable for industrial-tilted S08GT family; lead-free packaging per NXP semiconductor standards
