MC9S12GC64MFAE - 16-bit HCS12 MCU, 64KB Flash, 25MHz | NXP
부품 번호: MC9S12GC64MFAE ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $15.78 | $15.78 |
| 10 | $14.2 | $142.00 |
| 100 | $12.65 | $1,265.00 |
| 500 | $11.3 | $5,650.00 |
| 1,000 | $10.1 | $10,100.00 |
MC9S12GC64MFAE 개요
A microcontroller (MCU) is a single-chip computer containing a CPU core, memory (Flash/ROM for program storage, RAM for data), and a rich set of on-chip peripherals such as timers, ADCs, communication controllers, and GPIO. MCUs sit at the top of the embedded computing hierarchy: MCU -> embedded processor -> semiconductor IC. The HCS12 family specifically belongs to the broader 16-bit automotive MCU category, optimized for real-time control tasks where deterministic interrupt response and automotive-grade reliability are mandatory.
Key features of the MC9S12GC64MFAE include an integrated bandgap-based voltage regulator that generates the internal digital VDD supply from the external 2.97V to 5.5V rail, a phase-lock loop (PLL) circuit that allows power consumption and performance to be tuned via the bus clock, and a full 16-bit data path throughout the architecture. The device supports background debug mode (BDM) for in-circuit programming and debugging, and includes standard HCS12 peripherals such as timers, PWM, SCI/SPI, and an A/D converter.
The MC9S12GC64MFAE is part of NXP's S12GC family, which targets automotive body electronics (door modules, seat controllers, HVAC), industrial CAN nodes, and LIN slave applications. The wide operating voltage range allows direct connection to 5V automotive bus rails without additional level shifting. The on-chip PLL enables the CPU to run at 25MHz while the external oscillator runs at a lower frequency, reducing system-level EMI and BOM cost.
Typical applications include automotive body control modules, instrument clusters, HVAC controllers, and industrial CAN/LIN slave nodes. The device is also widely used in HVAC blower control, lighting modules, and other automotive mechatronic systems where cost-sensitive 16-bit processing is needed.
When designing with the MC9S12GC64MFAE, ensure that unused input pins are terminated per NXP's recommendations to avoid excessive current draw. BDM interface connections should be reserved on the PCB even if not initially used, to allow field firmware updates and reduce recall risk. Note that this part is marked NRND - plan a migration path to an active S12G or S12KS member if your program is shipping into production beyond 2027.
This page synthesizes distributor pricing, drop-in alternatives from the S12 family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: MC9S12GC64MFAE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12GC64MFAE (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Processor, PLL, Program Memory (Flash), Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S12GC128MFAE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12GC32MFAE
✅ 드롭인✓ 재고 있음
$8.44 / 개
데이터시트 보기 →MC9S12GC16MFAE
✅ 드롭인✓ 재고 있음
$4.1 / 개
데이터시트 보기 →MC9S12C64MFAE
✅ 드롭인✓ 재고 있음
$5.7 / 개
데이터시트 보기 →MC9S12C64CFAE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12A64CPVE
✅ 드롭인✓ 재고 있음
$32.6 / 개
데이터시트 보기 →MC9S12GC64MFAE 최대 정격 & 전기적 특성
| Core Architecture | HCS12 (16-bit) |
| Maximum CPU Frequency | 25 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Supply Voltage Range | 2.97 V to 5.5 V |
| 패키지 | 48-LQFP (7x7 mm) |
| 핀 수 | 48 |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +125C (automotive) |
| Family | S12GC |
| On-chip Voltage Regulator | Yes (bandgap-based, internal VDD generation) |
| PLL | Yes (internal phase-lock loop) |
| Data Path Width | 16-bit |
| Debug Interface | BDM (Background Debug Mode) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
MC9S12GC64MFAE 핀 구성
| 핀 1 | XCLK — External clock input (oscillator pin) |
| 핀 2 | RESET — External reset input, active low |
| 핀 3 | TEST — Test mode input, tie to VSS |
| 핀 4 | VDDR — External voltage regulator supply |
| 핀 5 | VSSR — Voltage regulator ground |
| 핀 6 | VDDX — External I/O supply (5V) |
| 핀 7 | VSSX — External I/O ground |
| 핀 8 | BKGD — Background Debug Mode interface |
| 핀 9 | MODC — Mode select input |
| 핀 10 | PA0 — Port A bit 0 / general-purpose I/O |
| 핀 11 | PA1 — Port A bit 1 / general-purpose I/O |
| 핀 12 | PA2 — Port A bit 2 / general-purpose I/O |
| 핀 13 | PA3 — Port A bit 3 / general-purpose I/O |
| 핀 14 | PA4 — Port A bit 4 / general-purpose I/O |
| 핀 15 | PA5 — Port A bit 5 / general-purpose I/O |
| 핀 16 | PA6 — Port A bit 6 / general-purpose I/O |
| 핀 17 | PA7 — Port A bit 7 / general-purpose I/O |
| 핀 18 | VDD — Internal digital supply (regulated) |
| 핀 19 | VSS — Internal digital ground |
| 핀 20 | PB0 — Port B bit 0 / general-purpose I/O |
| 핀 21 | PB1 — Port B bit 1 / general-purpose I/O |
| 핀 22 | PB2 — Port B bit 2 / general-purpose I/O |
| 핀 23 | PB3 — Port B bit 3 / general-purpose I/O |
| 핀 24 | PB4 — Port B bit 4 / general-purpose I/O |
| 핀 25 | PB5 — Port B bit 5 / general-purpose I/O |
| 핀 26 | PB6 — Port B bit 6 / general-purpose I/O |
| 핀 27 | PB7 — Port B bit 7 / general-purpose I/O |
| 핀 28 | PC0 — Port C bit 0 / general-purpose I/O |
| 핀 29 | PC1 — Port C bit 1 / general-purpose I/O |
| 핀 30 | PC2 — Port C bit 2 / general-purpose I/O |
| 핀 31 | PC3 — Port C bit 3 / general-purpose I/O |
| 핀 32 | PC4 — Port C bit 4 / general-purpose I/O |
| 핀 33 | PC5 — Port C bit 5 / general-purpose I/O |
| 핀 34 | PC6 — Port C bit 6 / general-purpose I/O |
| 핀 35 | PC7 — Port C bit 7 / general-purpose I/O |
| 핀 36 | VDDX — External I/O supply (5V) |
| 핀 37 | VSSX — External I/O ground |
| 핀 38 | PD0 — Port D bit 0 / CAN TX / general-purpose I/O |
| 핀 39 | PD1 — Port D bit 1 / CAN RX / general-purpose I/O |
| 핀 40 | PD2 — Port D bit 2 / SCI TX / general-purpose I/O |
| 핀 41 | PD3 — Port D bit 3 / SCI RX / general-purpose I/O |
| 핀 42 | PD4 — Port D bit 4 / SPI / general-purpose I/O |
| 핀 43 | PD5 — Port D bit 5 / SPI / general-purpose I/O |
| 핀 44 | PP0 — Port P bit 0 / PWM / general-purpose I/O |
| 핀 45 | PP1 — Port P bit 1 / PWM / general-purpose I/O |
| 핀 46 | PP2 — Port P bit 2 / PWM / general-purpose I/O |
| 핀 47 | PP3 — Port P bit 3 / PWM / general-purpose I/O |
| 핀 48 | PP4 — Port P bit 4 / PWM / general-purpose I/O |
일반적인 애플리케이션
MC9S12GC64MFAE 적합 용도: 6 애플리케이션s: Automotive Body Control Module, HVAC Blower & Climate Control ECU, Instrument Cluster Sub-MCU, Industrial CAN Node / PLC Slice, LIN Slave Node - Seat / Window / Mirror Module, Automotive Lighting Module.
Automotive Body Control Module
The MC9S12GC64MFAE's 25 MHz HCS12 core, 64KB Flash, and 5V-tolerant I/O make it a natural fit for central body control modules that orchestrate door locks, window lifts, mirror adjust, and exterior lighting. Its on-chip MSCAN and LIN-capable SCI peripherals handle the mixed CAN/LIN body-network traffic without external transceivers beyond the standard bus drivers. The 48-LQFP (7x7) footprint keeps the PCB compact, and the 2.97V-5.5V supply range allows direct connection to the 12V battery rail after a 5V regulator, simplifying the power tree.
추천
HVAC Blower & Climate Control ECU
HVAC blower and climate-control ECUs need deterministic PWM for fan/motor speed control plus robust ADC for temperature sensing - exactly the use case the MC9S12GC64MFAE targets. The HCS12's enhanced timer/PWM block delivers the multi-channel PWM required for blower speed control, and the on-chip 10-bit ADC reads NTC thermistor inputs from cabin and duct sensors. Its wide 2.97V-5.5V supply tolerance handles automotive cold-crank and load-dump transients without separate protection.
추천
Instrument Cluster Sub-MCU
In instrument cluster architectures, the MC9S12GC64MFAE commonly serves as a sub-MCU that handles gauge drivers, telltale LEDs, and turn-signal inputs while a higher-end main MCU runs the HMI. Its 64KB Flash is sufficient for cluster communication stacks and gauge control logic, and the SCI/SPI peripherals connect to the main cluster MCU. The 48-LQFP package fits behind the cluster PCB without forcing mechanical redesign.
추천
Industrial CAN Node / PLC Slice
Outside automotive, the MC9S12GC64MFAE is widely used as a cost-optimized CAN node in industrial PLC slice cards and remote I/O drops. Its HCS12 core runs deterministic CANopen or DeviceNet stacks, and the 48-LQFP (7x7) package makes it easy to place on small slice cards. The 25 MHz bus clock and 64KB Flash are sized for typical industrial protocol stacks plus application logic.
추천
LIN Slave Node - Seat / Window / Mirror Module
LIN slave nodes for seat-position memory, window lift, and mirror adjust are classic S12GC applications where 16-bit performance is plenty and BOM cost is critical. The MC9S12GC64MFAE's SCI peripheral implements LIN 2.x with NXP's LIN stack, and the 48-LQFP footprint suits the compact module PCBs typical of seat/window electronics. Its NRND status is acceptable for established programs with proven firmware; for new LIN nodes, consider the active S12ZVL or MagniV family.
추천
Automotive Lighting Module
Headlamp levelling, adaptive lighting controllers, and indicator-flasher modules use the MC9S12GC64MFAE to combine CAN/LIN communication with multi-channel PWM for LED strings. The HCS12 PWM block drives LED current-control FETs without external logic, while the ADC reads photodiode feedback for ambient-light adaptation. Its 48-LQFP package fits the compact headlamp-module PCBs typical of modern adaptive-driving-beam systems.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S12GC64MFAE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S12GC128MFAE | MC9S12GC32MFAE | MC9S12GC16MFAE | MC9S12C64MFAE | MC9S12C64CFAE | MC9S12A64CPVE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7) | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same |
| Flash Memory | 64 KB | 128 KB | 32 KB | 16 KB | 64 KB | 64 KB | 64 KB |
| Core Architecture | HCS12 (16-bit) | HCS12 (16-bit) - same | HCS12 (16-bit) - same | HCS12 (16-bit) - same | HCS12 (16-bit) - same | HCS12 (16-bit) - same | HCS12 (16-bit) - same |
| Maximum CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Supply Voltage Range | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V |
| Family | S12GC | S12GC | S12GC | S12GC | S12C | S12C | S12A |
| Lifecycle Status | NRND | Active | Active | Active | Active | Active | Active |
주요 차별점
- Pin-compatible 128KB upgrade available (vs MC9S12GC128MFAE)
- Lower-cost Flash variants for cost-sensitive programs (vs MC9S12GC32MFAE / MC9S12GC16MFAE)
- Alternative S12C and S12A pin-compatible variants (vs MC9S12C64MFAE / MC9S12A64CPVE)
설계 노트
The MC9S12GC64MFAE requires a single external 2.97V-5.5V supply on VDDX/VDDR; the internal bandgap regulator generates the digital VDD rail. Decouple VDDX/VSSX pairs with 100nF plus 4.7uF ceramic capacitors placed within 5mm of the pins, and add a bulk 10uF near the VDDR pin. Cold-crank and load-dump protection should be upstream of the 5V regulator feeding the MCU. Per NXP, the internal voltage regulator cannot source external loads.
Place a ground plane on the layer directly beneath the LQFP to keep return paths short for the HCS12 bus. Route the BDK (BKGD) and RESET lines away from PWM and CAN traces to avoid debug glitches. Keep the external oscillator crystal within 5mm of the XCLK pin with short, symmetric traces to the load capacitors, and surround the crystal with a guard ground ring. The MODC pin must be tied to VSS or VDDX per the desired mode - do not leave it floating.
Unused pins should be configured as outputs (driving low) or tied to VSS to minimize Icc; floating inputs can increase current draw and may inject noise. The TEST pin must be tied to VSS in normal operation. The PLL filter components (Rp, Cp on the XFC pin) must follow NXP's reference values exactly - incorrect PLL loop filter values cause unstable clock and EMC failures. When migrating from GC64 to GC128 in-circuit, verify that the new Flash size is selected in the flash security block.
At 25 MHz core and 5V supply, the MC9S12GC64MFAE typically dissipates 100-200 mW under full peripheral load - well within the 48-LQFP thermal envelope. The 48-LQFP (7x7) has theta_JA of approximately 60 C/W on a standard 4-layer JEDEC test board, so junction temperature stays well below the 125C automotive limit. For non-automotive applications with elevated ambient (e.g. under-hood), add a copper thermal pad or stitch vias to the exposed die attach pad region.
규정 준수 정보
AEC-Q100 qualified per NXP S12GC family qualification. RoHS and REACH compliant per NXP product page. Lead-free and halogen-free per JEDEC J-STD-020 MSL-3 classification.