MCF52100CVM66 - 32-Bit 66MHz Coldfire V2 MCU | NXP
부품 번호: MCF52100CVM66 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MCF52100CVM66 개요
A microcontroller is a semiconductor device that integrates a processor core, memory, peripherals, and input/output control into one embedded-computing component. The Coldfire V2 architecture belongs to the broader 32-bit embedded processor hierarchy and is commonly used for industrial control, networking equipment, and connected embedded systems. The MCF52100CVM66 is positioned as a compact controller rather than a general-purpose desktop processor.
The verified product information identifies a 32-bit instruction width, single-core configuration, 66 MHz operating frequency, and 64 KB flash organized as 64K x 8. The device is identified as MCF521xx and Coldfire V2. Distributor information also identifies the package as an 81-terminal, square BGA with industrial temperature-grade positioning. Additional electrical, memory-map, peripheral, and environmental specifications are not provided in the verified dataset and require confirmation from the manufacturer datasheet.
The 10 x 10 mm MAPBGA package supports high-density PCB integration but requires careful escape-routing, ground-plane, and assembly-process planning. Because the supplied data does not include pin assignments, I/O functions, supply rails, clock tolerances, or peripheral inventories, engineers should consult the official MCF52100CVM66 documentation before finalizing a schematic or layout. The 66 MHz clock and 32-bit architecture are the principal verified selection criteria.
Typical application directions include industrial embedded control, networked equipment, data acquisition, and compact control platforms. Selection should be based on exact peripheral compatibility, memory requirements, package ball mapping, software support, and verified operating limits rather than frequency alone. The Mouser listing identifies the part as a KIRIN0 microcontroller without USB, while distributor records also describe it as MCF521xx Coldfire V2.
For a new design, verify the complete datasheet, reference manual, errata, memory map, and package drawing before layout. A drop-in substitute must match the 81-ball footprint, pin functions, electrical limits, and software assumptions; the provided cross-reference data does not establish a verified drop-in replacement.
드롭인 대체품: MCF52100CVM66 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF52100CVM66 (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MCF52100CVM66 최대 정격 & 전기적 특성
| Architecture | Coldfire V2 MCF521xx |
| Processor | 32-bit single-core |
| Operating Frequency | 66 MHz |
| Flash Memory | 64 KB |
| Flash Organization | 64K x 8 |
| 패키지 | 81-MAPBGA (10 x 10 mm) |
| Terminal Count | 81 terminals |
| Package Type | BGA |
| Package Shape | Square |
| 실장 유형 | Surface mount |
| Temperature Grade | Industrial |
| Manufacturer | NXP Semiconductors |
| Legacy Manufacturer | Freescale Semiconductor |
| Core Count | 1 core |
| USB Feature | Without USB, according to Mouser listing |
MCF52100CVM66 square 핀 구성 가이드
MCF52100CVM66(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCF52100CVM66.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCF52100CVM66 적합 용도: 6 애플리케이션s: Industrial Embedded Control, Networking Equipment, Data-Acquisition Systems, Compact Embedded Platform Controllers, HMI and Control-Terminal Electronics, Embedded Communication Equipment.
Industrial Embedded Control
The MCF52100CVM66 fits compact industrial control platforms that need a 32-bit Coldfire V2 processor running at 66 MHz. Its 64 KB flash provides a defined firmware-memory starting point for control logic, while the 81-MAPBGA package supports dense board integration. The supplied data identifies the device as industrial-temperature-grade, but exact supply limits, I/O functions, watchdog behavior, and environmental ratings must be verified before production use. In a control design, firmware can manage sensors, actuators, sequencing, and communications while the BGA package keeps the footprint compact. Because the verified dataset does not enumerate peripherals, software drivers, or timing constraints, engineers should select it only after checking those requirements against the official datasheet and reference manual.
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Networking Equipment
MCF52100CVM66 is suitable for compact networking and communications equipment where a deterministic 32-bit embedded processor is preferred over a larger application processor. Its verified 66 MHz operating frequency provides a clear performance baseline, and the 64 KB flash can support firmware for protocol handling, configuration, and device management. The 10 x 10 mm MAPBGA package is useful for space-constrained boards, although high-density escape routing and assembly capability must be planned carefully. The supplied information does not identify Ethernet, serial, USB, or other communications peripherals, so those requirements must be checked directly. Firmware architecture, boot behavior, security requirements, and long-term software support are also outside the verified dataset.
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Data-Acquisition Systems
The MCF52100CVM66 can serve as the embedded controller in a data-acquisition system that requires local sampling logic, sequencing, and control. Its 32-bit architecture and 66 MHz frequency provide a defined processing platform, while 64 KB flash is available for firmware storage. The compact BGA package can reduce board area compared with a larger leaded controller, but the absence of verified ADC, timer, serial, and digital I/O specifications means the product is a platform candidate rather than a confirmed application match. Designers should verify analog interfaces externally if needed, confirm sampling timing, and ensure the package power distribution and ground-return requirements match the PCB stack-up. Software drivers and calibration strategy should be planned before schematic release.
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Compact Embedded Platform Controllers
MCF52100CVM66 is appropriate for compact embedded platform controllers when the design needs a 32-bit single-core processor in an 81-terminal BGA package. The verified 64 KB flash can hold a compact control application, and the 66 MHz clock provides a clear baseline for event-driven firmware and peripheral coordination. Its 10 x 10 mm package encourages miniaturization, but the engineer must account for BGA assembly, thermal paths, power integrity, and pin escape routing. The supplied data does not define SRAM, GPIO count, communication interfaces, clock tree, or maximum I/O voltage. Those omissions are important because they determine whether the MCU can connect directly to sensors, memory, transceivers, or external logic. Validate the complete electrical and pin specification first.
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HMI and Control-Terminal Electronics
The MCF52100CVM66 can be evaluated for control-terminal electronics that combine local control, status handling, and user-interface coordination. Its 32-bit Coldfire V2 core and 66 MHz operating speed provide a defined embedded processing capability, while the compact MAPBGA package can help reduce board area. The supplied data does not confirm display interfaces, external memory, USB, Ethernet, or digital I/O, so the MCU should be treated as a controller candidate and not assumed to include an HMI-specific peripheral set. A practical design would use the MCU for supervisory logic while external devices handle display, storage, or communications when required. Check package ball availability, power sequencing, firmware toolchain support, and lifecycle status against the complete manufacturer documentation.
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Embedded Communication Equipment
MCF52100CVM66 may fit embedded communication equipment that needs a compact, deterministic 32-bit controller. The verified processor frequency of 66 MHz and 64 KB flash establish the basic compute and firmware targets, while the BGA package supports dense integration in communications appliances. Because the available records do not enumerate UART, SPI, CAN, Ethernet, USB, timers, or other peripherals, the design engineer must confirm interface availability and electrical timing before selecting the device. External transceivers may be necessary if the MCU lacks the required physical-layer support. Software compatibility with the KIRIN0/Coldfire toolchain, reset behavior, and long-term supply should also be reviewed. Treat the part as a verified processor package, not a turnkey communications solution.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF52100CVM66 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Brand | NXP Semiconductors |
| Package | 81-MAPBGA (10 x 10 mm) |
| Architecture | Coldfire V2 MCF521xx |
| Processor Width | 32-bit |
| Core Count | Single-core |
| Operating Frequency | 66 MHz |
| Flash Memory | 64 KB |
| Flash Organization | 64K x 8 |
| Terminal Count | 81 terminals |
| Mounting Type | Surface mount |
| Temperature Grade | Industrial |
| USB | Without USB, according to Mouser listing |
주요 차별점
- Verified processor configuration (vs MCF52100CVM80)
- Package integration (vs MCF52258CVN66)
- Product documentation positioning (vs MCF5272VM66J)
설계 노트
Treat the 81-MAPBGA as a high-density escape-routing problem. Before layout, obtain the official ball map and verify which balls are power, ground, no-connect, reset, clock, and I/O. The verified data confirms the 10 x 10 mm outline but does not provide the ball assignments, so no footprint or net-level routing decision should be based on this page alone.
Plan BGA thermal and power delivery from the official package information rather than estimating from the 10 x 10 mm outline alone. Check exposed thermal-ball or thermal-pad requirements, copper-keepout rules, via placement, and the maximum power-dissipation limits in the datasheet. The verified dataset does not include supply voltage, current consumption, junction-temperature limits, or thermal resistance.
Do not substitute a related Coldfire MPN solely because it has a similar frequency or family name. MCF52258CVN66, MCF5272VM66J, and MCF52100CVM80 appear in comparison results, but no verified drop-in relationship is established. A valid replacement requires matching ball assignments, memory and peripheral resources, electrical limits, reset behavior, clock requirements, and firmware support.
Confirm the power architecture and decoupling requirements from the manufacturer reference design or datasheet. The supplied data does not identify supply rails, ground balls, or permitted voltage ranges. Keep power distribution symmetric, provide the specified local decoupling, and route sensitive clock or reset nets with controlled return paths once the official pinout and layout guidance are available.
규정 준수 정보
The verified web data does not provide formal RoHS, REACH, halogen-free, conflict-minerals, or automotive qualification statements for MCF52100CVM66. Industrial temperature-grade positioning is not equivalent to AEC-Q100 qualification.
