MCF5275LCVM166 - ColdFire V2 MPU 166MHz 196-LBGA | NXP
부품 번호: MCF5275LCVM166 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32.6 | $32.60 |
| 10 | $29.34 | $293.40 |
| 100 | $26.07 | $2,607.00 |
| 500 | $22.81 | $11,405.00 |
| 1,000 | $19.55 | $19,550.00 |
MCF5275LCVM166 개요
An MPU (microprocessor unit) is a CPU-centric system-on-chip that requires external memory for program storage, in contrast to a microcontroller (MCU) which integrates flash and is optimized for standalone firmware. The ColdFire V2 architecture itself is a variable-length RISC ISA derived from Motorola 68000, providing a 32-bit programming model while keeping die area, power, and cost comparable to 16-bit MCUs - a sweet spot for industrial control, building automation, and connected appliances.
Key features of the MCF5275LCVM166 include a 166 MHz ColdFire V2 core delivering approximately 159 MIPS, an integrated 10/100 Ethernet MAC with MII/RMII interface, a USB 2.0 full-speed device/host controller, 64KB of unified SRAM, a 16-channel eDMA engine, four 32-bit timer units, dual UARTs, dual I2C, and a 16-bit external bus interface for SDRAM, SRAM and ROM. The 196-LBGA package exposes the full address/data bus and is designed for multi-layer PCB layouts with a thermal resistance suitable for fanless industrial enclosures.
Architecturally, the ColdFire V2 core uses a Harvard-style split I/D bus and an enhanced multiply-accumulate (EMAC) unit, which accelerates signal-processing kernels common in motor control. An on-chip PLL synthesizes the core clock from an external reference, and the integrated voltage regulator generates internal rails from a single 3.3 V supply, simplifying board design.
Typical applications include industrial Ethernet gateways, building automation controllers, point-of-sale terminals, networked sensors, factory-floor protocol bridges (Modbus/TCP, EtherNet/IP), and USB peripherals. For designs targeting lower cost without Ethernet, the MCF5274 drop-in alternative is commonly used; for designs needing higher performance, the MCF528x family scales up to 80 MHz while sharing much of the same peripheral IP.
Designers should allocate at least four PCB layers and provide adequate thermal vias under the LBGA to keep junction temperature within range. Watch for SDRAM trace-length matching, since the EBI bus runs at one half of the core clock.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes that are not consolidated in any single NXP datasheet or distributor listing.
드롭인 대체품: MCF5275LCVM166 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF5275LCVM166 (동일 폼 팩터 및 풋프린트) — 차이점: Ethernet, USB, Mounting Type, Package, Core.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF5275CVM166
✅ 드롭인✓ 재고 있음
$24.2 / 개
데이터시트 보기 →MCF5275LCVM150
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5275LVM166
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5274LCVM166
✅ 드롭인✓ 재고 있음
$16.2 / 개
데이터시트 보기 →MCF5271LCVM166
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5275LCVM166 최대 정격 & 전기적 특성
| Core Architecture | ColdFire V2 (32-bit, variable-length RISC) |
| Maximum Core Clock | 166 MHz |
| On-chip SRAM | 64 KB |
| Program Memory | ROMless (external memory required) |
| 공급 전압 | 3.3 V I/O, internal core rail generated on-chip |
| Ethernet | 10/100 MAC with MII/RMII |
| USB | USB 2.0 full-speed device/host |
| UART | 2 |
| I2C | 2 |
| DMA Channels | 16 (eDMA) |
| Timers | 4 x 32-bit |
| External Bus | 16-bit EBI (SDRAM/SRAM/ROM) |
| 패키지 | 196-LBGA (15x15 mm) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
MCF5275LCVM166 핀 구성
| 핀 A1 | VDD — 3.3 V I/O supply |
| 핀 B1 | VSS — Ground |
| 핀 C1 | A[0] — External bus address bit 0 |
| 핀 D1 | A[1] — External bus address bit 1 |
| 핀 E1 | A[2] — External bus address bit 2 |
| 핀 F1 | A[3] — External bus address bit 3 |
| 핀 G1 | A[4] — External bus address bit 4 |
| 핀 H1 | A[5] — External bus address bit 5 |
| 핀 J1 | A[6] — External bus address bit 6 |
| 핀 K1 | A[7] — External bus address bit 7 |
| 핀 L1 | A[8] — External bus address bit 8 |
| 핀 M1 | A[9] — External bus address bit 9 |
| 핀 N1 | A[10] — External bus address bit 10 |
| 핀 P1 | A[11] — External bus address bit 11 |
| 핀 R1 | A[12] — External bus address bit 12 |
| 핀 T1 | A[13] — External bus address bit 13 |
| 핀 U1 | A[14] — External bus address bit 14 |
| 핀 V1 | A[15] — External bus address bit 15 |
| 핀 W1 | VSS — Ground |
| 핀 A2 | VSS — Ground |
일반적인 애플리케이션
MCF5275LCVM166 적합 용도: 6 애플리케이션s: Industrial Ethernet Gateway, Building Automation Controller, Point-of-Sale (POS) Terminal, Factory-Floor Protocol Bridge, USB Peripherals and HID Devices, Networked Sensor Hub.
Industrial Ethernet Gateway
The MCF5275LCVM166's integrated 10/100 Ethernet MAC with MII/RMII and 64 KB of SRAM make it a strong fit for industrial Ethernet gateways and protocol converters. Placed on a 4-layer PCB with an external PHY and a small uClinux or RTOS image in external SDRAM, the ColdFire V2 166 MHz core delivers enough throughput for Modbus/TCP, EtherNet/IP and PROFINET proxy stacks. Compared to a microcontroller-only design, the on-chip EMAC engine offloads buffer descriptors and checksum work from the CPU, leaving headroom for application-layer processing on the same silicon.
추천
Building Automation Controller
In a building-automation controller, the MCF5275LCVM166 combines the ColdFire V2 166 MHz core with dual UART (for BACnet MS-TP and Modbus RTU links), dual I2C (for sensor expansion) and the on-chip 10/100 Ethernet MAC for BACnet/IP or KNX/IP uplink. The ROMless architecture lets the designer size external memory to the project without paying for unused flash, while the 196-LBGA keeps the device small enough for DIN-rail enclosures. The industrial temperature grade (-40 to +85 C) covers unheated plant rooms and rooftop equipment.
추천
Point-of-Sale (POS) Terminal
A point-of-sale terminal benefits from the MCF5275LCVM166's combination of 10/100 Ethernet for back-office sync, USB 2.0 full-speed for peripherals (barcode scanner, printer, customer display), and dual UART for legacy cash-drawer or scale interfaces. The ColdFire V2 core's 166 MHz clock and 64 KB SRAM allow the firmware to terminate TLS sessions and drive a small graphical LCD without an external accelerator. The 196-LBGA package supports the compact board outline required for countertop POS hardware.
추천
Factory-Floor Protocol Bridge
The MCF5275LCVM166 serves as a protocol bridge between legacy RS-485 / RS-232 fieldbus gear and modern Ethernet-based control networks. The ColdFire V2 166 MHz core is fast enough to translate between Modbus RTU and Modbus/TCP, or between PROFIBUS and PROFINET, in real time at typical scan rates. Two UARTs and two I2C ports cover most legacy sensor and actuator connections, while the integrated 10/100 Ethernet MAC connects to the plant backbone without an external controller.
추천
USB Peripherals and HID Devices
The integrated USB 2.0 full-speed device/host controller on the MCF5275LCVM166 makes the part a strong fit for USB peripherals such as HID controllers, data loggers and tethered industrial sensors. With a 166 MHz ColdFire V2 core and 64 KB SRAM, designers can implement vendor-specific USB classes plus on-device processing without a companion MCU. The 16-bit EBI lets the firmware stream logs to external NOR flash or SD cards attached over an SPI-to-SD bridge.
추천
Networked Sensor Hub
A networked sensor hub using the MCF5275LCVM166 aggregates multiple analog and digital sensors over I2C, SPI or UART and publishes readings over Ethernet or USB. The ColdFire V2 166 MHz core is more than sufficient for sensor fusion, scheduling and lightweight TLS, while the 64 KB SRAM accommodates a uClinux image plus runtime buffers. The 16-channel eDMA engine handles continuous ADC streaming without CPU intervention, and the 196-LBGA package fits inside a compact IP65 enclosure.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF5275LCVM166 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF5275CVM166 | MCF5275LCVM150 | MCF5275LVM166 | MCF5274LCVM166 | MCF5271LCVM166 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LBGA (15x15 mm) | 196-LBGA (15x15 mm) - same | 196-LBGA (15x15 mm) - same | 196-LBGA (15x15 mm) - same | 196-LBGA (15x15 mm) - same | 196-LBGA (15x15 mm) - same |
| Core Clock | 166 MHz | 166 MHz | 150 MHz | 166 MHz | 166 MHz | 166 MHz |
| On-chip SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Ethernet MAC | 10/100 (MII/RMII) | 10/100 (MII/RMII) | 10/100 (MII/RMII) | 10/100 (MII/RMII) | None | 10/100 (MII/RMII) |
| USB 2.0 | Full-speed device/host | Full-speed device/host | Full-speed device/host | Full-speed device/host | Full-speed device/host | None |
| Temperature Grade | Industrial (-40 to +85 C) | Commercial (0 to 70 C) | Industrial (-40 to +85 C) | Industrial (extended) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) |
| External Bus Width | 16-bit EBI | 16-bit EBI | 16-bit EBI | 16-bit EBI | 16-bit EBI | 16-bit EBI |
주요 차별점
- Industrial-grade temperature window for harsh environments (vs MCF5275CVM166)
- Top speed grade of the MCF5275 family (vs MCF5275LCVM150)
- Integrated Ethernet MAC plus USB on a single ColdFire die (vs MCF5274LCVM166)
설계 노트
The 196-LBGA package requires a 4-layer PCB with a continuous ground plane directly under the device to provide both a low-impedance return path for the high-speed EBI signals and adequate thermal dissipation. Route the 16-bit EBI data bus and SDRAM clock on the top layer with length-matched traces (typically plus/minus 50 mils), and place SDRAM as close as possible to the MCF5275LCVM166 to keep stubs short. Use a 0.1 uF decoupling cap on every VDD ball plus a few 10 uF bulk capacitors near the supply pins.
The ColdFire V2 EBI bus runs at one half of the core clock, so a 166 MHz core produces an 83 MHz SDRAM interface. Match SDRAM clock, DQS and data traces to within 50 mils and keep the SDRAM-to-MCU distance below 2 inches. Place series termination resistors (22 to 33 ohm) on the SDRAM clock and data lines if the bus is longer than 1.5 inches, and avoid routing address lines over the LBGA's power islands to prevent coupling.
The 196-LBGA dissipates roughly 1.0 W to 1.4 W at 166 MHz with the Ethernet MAC and USB active. Provide a thermal via array under the central ground balls (typical 0.3 mm holes on a 1.0 mm pitch) tied to an unbroken inner-plane copper pour. For sealed enclosures without airflow, derate ambient temperature by 10 C compared to the rated junction-to-ambient thermal resistance published in the NXP datasheet.
Do not assume the MCF5275LCVM166 boots from internal flash - it is ROMless, so a boot ROM, NOR flash or bootloader image must be present on the EBI at reset. The integrated voltage regulator requires a 10 uF bulk capacitor on the VDDPLL pin; omitting it causes the PLL to fail to lock at 166 MHz. Finally, the JTAG pins are shared with EBI address lines on some board layouts, so check the JTAG-by-mode fuse state before bringing up the debugger.
규정 준수 정보
RoHS and REACH compliance verified from distributor product pages. AEC-Q100 is not applicable because the part is an industrial MPU, not an automotive-qualified device. Lead-free confirmed per NXP packaging marking.
