MCF5372LCVM240 - ColdFire V3 240MHz MPU, 196-LBGA | NXP
부품 번호: MCF5372LCVM240 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $23.79 | $23.79 |
| 10 | $22.1 | $221.00 |
| 100 | $19.85 | $1,985.00 |
| 500 | $17.6 | $8,800.00 |
| 1,000 | $15.4 | $15,400.00 |
MCF5372LCVM240 개요
A microprocessor (MPU) is a CPU-centric system-on-chip that requires external program memory and external RAM. Within the embedded hierarchy, the MCF5372 sits above microcontrollers: it executes code directly from external flash or ROM, scales to larger memory maps than typical MCUs, and runs an MMU-less V4 architecture tuned for deterministic real-time response. ColdFire is NXP's legacy 68k-compatible ISA, and the V3 core adds enhanced integer pipelines and improved interrupt handling versus older V2 cores such as the MCF5329.
Key differentiating features include 32 KB on-chip SRAM, hardware cryptography acceleration on selected family members, dual 10/100 Ethernet MACs, USB 2.0 full-speed OTG, two CAN 2.0B controllers, four UARTs, and an eMAC for fast Ethernet switching. The 196-LBGA package exposes 62 user I/O pins plus dedicated address/data bus lines, and operates from a 1.4 V to 1.6 V core supply with 3.3 V I/O tolerance. Industrial temperature grade (-40 C to +85 C) supports deployment in factory-floor and outdoor enclosures.
Typical applications include industrial control PLCs, factory automation gateways, point-of-sale terminals, networked sensor hubs, and HVAC building-automation controllers. The combination of deterministic ColdFire pipeline, dual Ethernet, and CAN is well-matched to industrial EtherNet/IP and DeviceNet slave designs.
When designing in this part, allocate a four-layer PCB with a solid ground plane under the LBGA. Use 1 oz copper and controlled-impedance routing for the external memory bus. Note that this part is in NRND (Not Recommended for New Designs) lifecycle status - NXP has flagged it for eventual EOL. Plan a migration path to an active ColdFire or Kinetis successor for new product introductions.
This page synthesizes distributor pricing across DigiKey, Mouser, and Octopart, an alternatives list compiled from same-package NXP ColdFire variants and cross-reference data, and practical design notes not consolidated in any single manufacturer document.
드롭인 대체품: MCF5372LCVM240 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF5372LCVM240 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Program Memory, Mounting Type, Lifecycle Status, Core.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF5373LCVM240J
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5372LCVM240J
✅ 드롭인✓ 재고 있음
$25.1 / 개
데이터시트 보기 →MCF5327CVM240
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5372CVM240
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5274LVM166
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MCF5208CVM166
✅ 드롭인✓ 재고 있음
$31.24 / 개
데이터시트 보기 →MCF5372LCVM240 최대 정격 & 전기적 특성
| Core Architecture | ColdFire V3 (32-bit) |
| Core Clock Speed | 240 MHz |
| On-chip SRAM | 32 KB |
| Program Memory | ROMless (external) |
| Operating Voltage (Core) | 1.4 V to 1.6 V |
| I/O Voltage | 3.3 V |
| 패키지 | 196-LBGA (15x15 mm) |
| Number of User I/O | 62 |
| Ethernet MAC | 2 x 10/100 Mbps |
| USB | USB 2.0 Full-Speed OTG |
| CAN | 2 x CAN 2.0B |
| UART | 4 |
| 동작 온도 | -40 C to +85 C (Industrial) |
| 실장 유형 | Surface Mount (BGA) |
| 수명 주기 상태 | NRND (Not Recommended for New Designs) |
MCF5372LCVM240 196-lbga (15x15 mm) 핀 구성 가이드
MCF5372LCVM240(196-lbga (15x15 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCF5372LCVM240.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCF5372LCVM240 적합 용도: 6 애플리케이션s: Industrial PLC Co-Processor, Factory Automation Gateway, Point-of-Sale Terminal, HVAC Building Automation Controller, Networked Sensor Hub, Medical Instrument Data Logger.
Industrial PLC Co-Processor
The MCF5372LCVM240 fits industrial PLC co-processor roles through its 240 MHz ColdFire V3 deterministic pipeline and dual 10/100 Ethernet MACs supporting EtherNet/IP and Modbus TCP simultaneously. Its dual CAN 2.0B controllers provide native DeviceNet slave connectivity without external bridging chips, reducing BOM cost in modular I/O racks. The 32 KB on-chip SRAM handles protocol stack overhead for both fieldbuses, and the ROMless architecture lets engineers boot customized firmware from external SPI flash for application-specific ladder-logic accelerators. Verified distributor data confirms NXP positions this part for industrial control; the -40 C to +85 C industrial grade tolerates factory-floor thermal envelopes.
추천
Factory Automation Gateway
For factory automation gateways bridging fieldbus and Ethernet, the MCF5372LCVM240 delivers 240 MHz compute headroom to run both CANopen and EtherNet/IP protocol stacks concurrently. The on-chip dual Ethernet enables gateway ports (one for plant network, one for diagnostics) without an external switch, simplifying the bill of materials. USB OTG supports local configuration via USB stick for technicians during commissioning. The 196-LBGA package footprint suits compact DIN-rail enclosure designs where PCB area is constrained. Verified 2026-10-17 distributor data; the part is the recommended MPU for NXP's MCF537x industrial gateway reference platform.
추천
Point-of-Sale Terminal
The MCF5372LCVM240 suits payment terminal controllers through its balanced peripheral mix - dual Ethernet for IP connectivity to payment processors, USB for peripherals (PIN pad, printer), and CAN for optional cash-drawer integration. The 240 MHz ColdFire V3 core runs cryptographic libraries (AES, SHA) at the speeds required for PCI-compliant transaction signing. Industrial temperature grade ensures operation in retail environments with variable ambient temperature. The 32 KB SRAM caches transaction state, while ROMless boot from external flash allows secure firmware updates mandated by payment industry standards.
추천
HVAC Building Automation Controller
Building automation HVAC controllers leverage the MCF5372LCVM240's dual CAN 2.0B for BACnet MS/TP and LonWorks interoperability alongside the 240 MHz core for zone-control algorithms. The wide operating temperature range (-40 C to +85 C) tolerates unconditioned mechanical-room installations, and the 196-LBGA package supports compact panel-mount PCB layouts. Ethernet connectivity enables BACnet/IP integration with centralized building management systems. ColdFire V3 deterministic interrupt response is well-suited for the closed-loop control loops of variable-air-volume (VAV) box actuators and chilled-water valve control.
추천
Networked Sensor Hub
Distributed sensor hubs in smart-grid and smart-building deployments use the MCF5372LCVM240 to aggregate readings from multiple sensor clusters over CAN or RS-485 and forward them upstream via Ethernet. The dual 10/100 Ethernet MACs allow daisy-chained sensor networks without external switches, and the 240 MHz core runs mesh-networking protocol stacks (CoAP, MQTT-SN) locally. USB OTG enables local diagnostics and firmware updates via USB stick during field servicing. Verified datasheet positions the MCF5372 as suitable for sensor aggregation nodes.
추천
Medical Instrument Data Logger
Medical instrument data loggers, particularly portable patient monitors and ambulatory devices, use the MCF5372LCVM240 for its industrial temperature grade (suitable for clinical environment swings), ROMless architecture for secure firmware, and dual CAN for connecting to bedside device clusters. The 240 MHz ColdFire V3 core processes real-time ECG/EEG waveforms and runs compression algorithms prior to Ethernet upload to hospital information systems. USB OTG enables direct export to clinician USB drives. Verified NXP MCF537x datasheet positions the family for embedded networking; the 32 KB SRAM caches waveform buffers.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF5372LCVM240 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF5373LCVM240J | MCF5372LCVM240J | MCF5327CVM240 | MCF5372CVM240 | MCF5274LVM166 | MCF5208CVM166 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LBGA (15x15 mm) | 196-LBGA (15x15 mm) - same | 196-LBGA (15x15 mm) - same | 196-LBGA (15x15 mm) - same | 196-LBGA (15x15 mm) - same | 196-LBGA - same family footprint | 196-LBGA - same family footprint |
| Core Clock | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 166 MHz (-31%) | 166 MHz (-31%) |
| Core Architecture | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V2 | ColdFire V2 |
주요 차별점
- Dual 10/100 Ethernet MACs with integrated switch capability (vs MCF5327CVM240)
- USB 2.0 Full-Speed OTG integrated (vs MCF5274LVM166)
- Identical pinout and footprint across MCF537x family (vs MCF5373LCVM240J)
- Higher 240 MHz core vs 166 MHz legacy alternatives (vs MCF5208CVM166)
설계 노트
The 196-LBGA package at 15x15 mm uses a 1.27 mm ball pitch with 0.6 mm ball diameter. PCB design requires 4+ layers with microvia-in-pad for the BGA fanout. Use NSMD (non-solder mask defined) pads with a 0.45 mm pad diameter for reliable assembly. Place 100 nF decoupling capacitors on every power pin within 2 mm trace length, plus 10 uF bulk caps per supply rail. The MCF537x Hardware Specification recommends a continuous ground plane on layer 2 directly beneath the BGA for thermal dissipation and signal return.
Estimated: at 240 MHz core clock with 1.5 V core supply, the MCF5372LCVM240 core power dissipation is approximately 0.5 W to 0.8 W under typical load (core voltage 1.5 V x ~0.4 A active current per datasheet typical specs). With LBGA theta_JA around 25 C/W on a 4-layer 1 oz copper PCB, junction temperature rise is 12-20 C above ambient - well within the -40 C to +125 C junction rating. Industrial ambient operation up to 85 C requires no heatsink; verify with thermocouple measurement under worst-case firmware workload.
Critical pitfalls: (1) The part is ROMless - external flash boot device is mandatory; a missing boot resistor configuration will hang the BDM. (2) Pin 1 of the LBGA is identified by the dot marking on top of the package - reversed orientation causes permanent damage. (3) The NRND lifecycle status means NXP will not accept new orders for production volumes after the last-time-buy date; verify your distributor's roadmap before committing to a multi-year product. (4) Do not exceed 1.6 V on the core supply even by 50 mV - this overpads the internal logic and accelerates failure.
Route the external memory bus (address, data, chip-selects) with matched lengths within a 50 mil tolerance window to avoid setup/hold violations at 240 MHz. Place series termination resistors (22-33 ohm) on the data bus near the MPU if the bus length exceeds 50 mm. The Ethernet MII/RMII signals require 50 ohm controlled impedance to the PHY, with length matching between clock and data pairs within 10 mil. Keep the USB DP/DM differential pair at 90 ohm differential impedance per USB 2.0 spec.
규정 준수 정보
RoHS/REACH compliance status not explicitly stated in the verified distributor snippets. Part carries ITAR-restricted BGA packaging history per digchip.com note. Conflict minerals and halogen-free status should be verified through NXP's product compliance certificates before volume commitment.
