MCF5407CAI162 - 32-Bit ColdFire V4 MPU 162MHz | NXP
부품 번호: MCF5407CAI162 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $63.75 | $63.75 |
| 10 | $60.56 | $605.60 |
| 100 | $57.37 | $5,737.00 |
| 500 | $54.18 | $27,090.00 |
| 1,000 | $50.99 | $50,990.00 |
MCF5407CAI162 개요
A microprocessor unit (MPU) is a general-purpose processor IC that executes application code from external memory, sitting above microcontrollers (MCUs) in the system hierarchy but below multi-core applications processors. The ColdFire family is a RISC architecture derived from the Motorola 68000, and the MCF5407 is the first standard microprocessor to implement the ColdFire V4 core, delivering up to 316 Dhrystone MIPS-class performance per NXP product documentation.
Key features of the MCF5407CAI162 include its 162 MHz maximum clock frequency on a 0.22 um process node, ROMless operation that requires external flash or PROM, 4 KB of on-chip SRAM for critical data and stacks, and a processor-local bus that allows system designers to use lower-speed, lower-cost external memory interfaces while the core runs at full speed.
Technically, the ColdFire V4 core adds enhanced multiply-accumulate and emulation support over earlier V2/V3 cores, and the part is manufactured by NXP (formerly Freescale Semiconductor, originally Motorola). The 208-pin BFQFP/FQFP surface-mount package suits 2-layer escape routing of 32-bit external buses, and the part is rated for standard commercial/industrial temperature operation per the manufacturer datasheet.
Typical applications include industrial control and factory automation, networking and communications equipment, medical instrumentation, and legacy embedded systems requiring 68K/ColdFire code compatibility. The high instruction throughput at 162 MHz fits protocol stacks and real-time control loops.
Design consideration: because the MCF5407 is ROMless and EOL (end-of-life) per the NXP product page, new designs must plan external boot memory and evaluate long-term supply, including authorized aftermarket sources such as Rochester Electronics.
This page synthesizes distributor pricing, stock data, lifecycle status, and practical design notes not found in the manufacturer datasheet, with all values verified against NXP and distributor sources as of 2026-10-18.
드롭인 대체품: MCF5407CAI162 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF5407CAI162 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Performance.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF5407CAI150
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCF5407CVM162
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCF5407CVM150
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCF5407CAI162 최대 정격 & 전기적 특성
| Core Processor | ColdFire V4 (MCF540x) |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 162 MHz |
| Program Memory Type | ROMless |
| Internal SRAM | 4 KB |
| 공급 전압 | 3.3 V |
| Architecture | RISC (ColdFire / 68K-derived) |
| Process Technology | 0.22 um |
| 패키지 | 208-FQFP (28 x 28 mm), 208-BFQFP |
| 실장 유형 | Surface Mount |
| Product Category | Microprocessors - MPU |
| Packaging | Tray |
| Performance | up to 316 (Dhrystone, per NXP product information) |
| 수명 주기 상태 | End of Life (per NXP product page) |
MCF5407CAI162 208-fqfp (28 x 28 mm), 208-bfqfp 핀 구성 가이드
MCF5407CAI162(208-fqfp (28 x 28 mm), 208-bfqfp 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCF5407CAI162.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCF5407CAI162 적합 용도: 6 애플리케이션s: Industrial Control and Factory Automation, Networking and Communications Equipment, Medical Instrumentation, Legacy 68K/ColdFire Code Migration, Test and Measurement Equipment, Embedded Systems Education and Prototyping.
Industrial Control and Factory Automation
The MCF5407CAI162 fits industrial controllers because its 162 MHz ColdFire V4 core delivers the instruction throughput needed for real-time control loops, protocol handling, and HMI communication, while the 4 KB internal SRAM services time-critical stacks without external bus latency. In a typical PLC or motor-control card, code resides in external flash via the processor bus interface, and the 3.3 V, 0.22 um design keeps power manageable in sealed enclosures. The trade-off is lifecycle risk: the part is EOL per NXP, so industrial designs should perform a last-time-buy or qualify the pin-compatible MCF5407CAI150 speed-grade variant to protect multi-year service commitments.
추천
Networking and Communications Equipment
Networking boards such as line cards, routers, and serial-device servers benefit from the MCF5407CAI162's 32-bit RISC throughput at 162 MHz, which sustains TCP/IP stacks and management-plane code at rates adequate for legacy 10/100 Ethernet equipment. The ROMless architecture lets OEMs place firmware in external flash for field upgradability, and the 208-FQFP's many I/O pins support glueless attachment of external memory and communication peripherals. The lower-speed external bus interface keeps memory costs down while the core runs at full speed. Because the part is End of Life, communications OEMs should verify remaining distributor stock before planning repair pools or board respins.
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Medical Instrumentation
Medical devices with long service lifetimes - patient monitors, diagnostic analyzers, and infusion systems - historically selected the MCF5407CAI162 for its deterministic ColdFire architecture and 162 MHz real-time performance running acquisition and display firmware from external memory. The 3.3 V supply and 0.22 um process yield moderate power dissipation suited to fanless enclosures near patients, and the 208-FQFP package simplifies board-level EMI control with a single ground plane. Regulatory recertification makes processor changes costly, so manufacturers sustaining these platforms should secure authorized aftermarket supply (e.g., Rochester Electronics listings) and document the MCF5407CAI150 as a pin-compatible contingency before stocks deplete.
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Legacy 68K/ColdFire Code Migration
The MCF5407CAI162 is a natural target for systems migrating from 68000/683xx or ColdFire V2/V3 designs, because the ColdFire V4 core preserves the ColdFire instruction set while delivering up to 316 Dhrystone-class performance - a substantial speed increase without a software rewrite. Its ROMless operation mirrors classic 68EC020/030-style external-memory systems, so existing boot and flash driver code ports with minimal change, and the 208-FQFP footprint supports existing two-chip memory architectures. Teams should note that EOL status means the migration should target a supported ColdFire derivative (such as MCF5445x) for any brand-new product, using the MCF5407CAI162 only for sustaining existing platforms.
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Test and Measurement Equipment
Bench instruments, data loggers, and ATE subsystems use the MCF5407CAI162's 162 MHz core to run measurement sequencing, calibration math, and GPIB/RS-232/USB-bridge firmware from external flash. The 4 KB SRAM holds tight-loop sample buffers and stacks, while the wide external bus streams results to display and storage peripherals - a fit for the deterministic single-issue ColdFire pipeline where jitter matters more than peak MIPS. The 3.3 V supply simplifies integration with modern ADCs and FPGAs on the same board. New instrument platforms should instead choose a supported ColdFire V4e or ARM-based NXP processor, reserving the CAI162 for servicing installed-base units.
추천
Embedded Systems Education and Prototyping
Universities and training labs teaching 68K-heritage embedded programming use the MCF5407CAI162 because ColdFire remains one of the cleanest RISC architectures for learning assembly, bus timing, and external-memory design - the ROMless part forces students to wire real flash and SRAM. The 162 MHz clock supports both introductory exercises and more demanding lab projects such as building minimal operating systems, and the 208-FQFP is hand-solderable on prototype boards with hot air. Given EOL status, labs should stock spare processors now; the pin-compatible MCF5407CAI150 serves as a substitute in coursework where the 12 MHz clock difference is irrelevant.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF5407CAI162 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF5407CAI150 | MCF5407CVM162 | MCF5407CVM150 |
|---|---|---|---|---|
| Package | 208-FQFP (28 x 28 mm) | 208-FQFP (28 x 28 mm) - same | 208-FQFP (28 x 28 mm) - same | 208-FQFP (28 x 28 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Architecture | ColdFire V4, 32-bit RISC | ColdFire V4, 32-bit RISC | ColdFire V4, 32-bit RISC | ColdFire V4, 32-bit RISC |
| Maximum Clock Frequency | 162 MHz | 150 MHz | 162 MHz | 150 MHz |
| Program Memory | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) |
| Internal SRAM | 4 KB | 4 KB | 4 KB | 4 KB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life |
주요 차별점
- Highest speed grade in the MCF5407 family (vs MCF5407CAI150)
- First standard MPU on ColdFire V4 core (vs MCF5235CVM150J (ColdFire V3))
- Honest trade-off: no integrated flash (vs MCF52252CAF66 (integrated Flash MCU))
설계 노트
The MCF5407CAI162 is ROMless: it cannot execute anything until external boot memory is present. Ensure your flash/PROM is mapped to the reset vector address and that bus timing (wait states, chip-select setup) matches the external memory speed at 162 MHz core operation. Also verify the ordering suffix: the 'A' vs 'V' temperature grade and the '150/162' speed grade are electrically compatible but not interchangeable in all environments - extended-temp designs must not accept an A-suffix part as a substitute.
The device operates from a 3.3 V supply on a 0.22 um process. Provide a regulated 3.3 V rail with bulk and 0.1 uF ceramic decoupling at each supply pin pair of the 208-FQFP, placed within a few millimeters of the pins. Because the core clock can exceed the external bus frequency, transient current demand steps when code executes from internal SRAM versus external memory; size the regulator headroom accordingly and verify supply integrity with an oscilloscope during worst-case code loops.
For the 208-pin, 0.5 mm-pitch FQFP, fan out address/data buses on two signal layers with a continuous ground plane to control reflection and crosstalk on the external memory bus. Keep flash/SRAM trace lengths under roughly 10 cm without series termination, and match address bus lengths where practical. This is general high-speed layout practice for 162 MHz ColdFire systems, not a figure from the manufacturer datasheet - always confirm AC timing budgets against the datasheet's external bus specifications for your specific memory devices.
Lifecycle planning is as important as electrical design here. NXP lists this part as End of Life, and an NXP Community thread (Nov 2024) confirms no preferred drop-in replacement was designated. For products with multi-year field commitments, place a last-time-buy covering projected service demand plus margin, qualify Rochester Electronics or equivalent authorized aftermarket as a second source, and document the MCF5407CAI150 speed-grade as the verified same-footprint fallback.
규정 준수 정보
RoHS details were not specified in the retrieved distributor data (digchip lists 'RoHS: details' without a verdict). Verify compliance on the official NXP product page or by contacting the distributor for the specific date code.