MCIMX280DVM4B - i.MX28 ARM926EJ-S 454MHz MPU, 289-MAPBGA | NXP
부품 번호: MCIMX280DVM4B ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.95 | $1,495.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $11.5 | $11,500.00 |
MCIMX280DVM4B 개요
An applications processor (AP) is a system-on-chip (SoC) class integrated circuit that integrates a CPU core, memory controller, graphics/LCD pipeline, and multiple I/O peripherals onto a single die, enabling compact, low-BOM designs for embedded products. The MCIMX280DVM4B sits within the i.MX28 hierarchy as: i.MX280 (variant) -> i.MX28 family -> ARM9 applications processor -> microprocessor (MPU) -> semiconductor. The ARM926EJ-S core provides the MMU and DSP extensions required to run Linux, WinCE, and RTOS environments.
Key features of the MCIMX280DVM4B include a 454 MHz ARM926EJ-S core with 16 KB I-cache and 32 KB D-cache, an integrated LFBGA 289-ball package with 0.8 mm pitch, support for DDR2 memory up to 1 Gbit, dual 10/100 Ethernet MACs, USB 2.0 High-Speed OTG and Host, CAN, I2S/AC97 audio, an LCD controller up to WVGA, and a wide operating temperature range suitable for industrial embedded applications.
The architecture combines the ARM926EJ-S pipeline with a multi-layer AHB bus matrix and dedicated DMA channels, enabling parallel data movement between peripherals and memory without CPU intervention. Hardware accelerators for AES, SHA, and data coercion relieve the CPU from cryptographic overhead, while the integrated power-management unit supports dynamic voltage-frequency scaling for energy-aware designs.
Typical applications include industrial HMI panels, home automation gateways, point-of-sale terminals, smart metering, printers, and consumer multimedia devices. It is commonly used where a mature ARM9 software ecosystem and proven Linux BSP support outweigh the need for newer Cortex-A class performance. Lifecycle status is NRND (Not Recommended for New Designs) per NXP product page.
When designing with this device, evaluate the NRND status against your product lifecycle. For new designs, prefer active i.MX28 variants such as MCIMX280DVM4B's active replacement family members, or migrate to newer i.MX RT or i.MX 6/8 series if long-term availability is critical. Ensure PCB layout supports the 0.8 mm pitch BGA with microvia stack-up.
드롭인 대체품: MCIMX280DVM4B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCIMX280DVM4B (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, USB, Core Count, Ethernet, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCIMX280CVM4B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX283DVM4B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX281AVM4B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX287CVM4B
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MCIMX280DVM4BR2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX280CVM4BR2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCIMX280DVM4B 최대 정격 & 전기적 특성
| Core Architecture | ARM926EJ-S (ARM9 family) |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Frequency | 454 MHz |
| Cache (I-cache / D-cache) | 16 KB / 32 KB |
| MMU | Yes |
| 패키지 | 289-MAPBGA (14x14 mm, 0.8 mm pitch) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +85C (industrial) |
| Memory Support | DDR2 up to 1 Gbit, NAND/NOR flash |
| Display Controller | LCD controller up to WVGA resolution |
| Ethernet | Dual 10/100 MAC |
| USB | USB 2.0 High-Speed OTG + Host |
| Other Interfaces | CAN, I2C, SPI, UART, I2S/AC97, SD/MMC |
| Hardware Crypto | AES, SHA accelerators |
| RoHS 상태 | Compliant |
| 수명 주기 상태 | NRND (per NXP product page) |
MCIMX280DVM4B 289-mapbga (14x14 mm, 0.8 mm pitch) 핀 구성 가이드
MCIMX280DVM4B(289-mapbga (14x14 mm, 0.8 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCIMX280DVM4B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCIMX280DVM4B 적합 용도: 7 애플리케이션s: Industrial HMI Control Panels, Home Automation Gateways, Point-of-Sale (POS) Terminals, Smart Energy Meters, Networked Printers and MFPs, Connected Consumer Multimedia Devices, Automotive Infotainment (Non-Display) - Reference for MCIMX281.
Industrial HMI Control Panels
The MCIMX280DVM4B suits industrial HMI panels thanks to its integrated LCD controller supporting up to WVGA resolution, the ARM926EJ-S core at 454 MHz that runs Qt/Embedded and Linux GUIs smoothly, and the industrial -40C to +85C operating temperature range. Designers use the dual 10/100 Ethernet MACs for networked factory connectivity and the hardware AES/SHA accelerators for secure remote management. The 289-MAPBGA package keeps PCB area compact while exposing enough GPIO and peripheral channels (CAN, SPI, I2C, UART) for sensor aggregation typical on the factory floor.
추천
Home Automation Gateways
For Z-Wave, Zigbee, or Wi-Fi home automation gateways, the MCIMX280DVM4B's low-power ARM9 architecture, dual Ethernet MACs, and USB 2.0 High-Speed OTG provide the connectivity backbone for bridging sensors and cloud services. The 454 MHz CPU is sufficient to run embedded Linux with MQTT brokers and TLS-secured communications. The integrated DDR2 controller and LCD pipeline let the same SoC drive a local status display without an external graphics controller. The 14x14 mm MAPBGA footprint supports compact gateway enclosures.
추천
Point-of-Sale (POS) Terminals
POS terminals benefit from the MCIMX280DVM4B's combination of ARM926EJ-S processing power, integrated LCD controller for the cashier display, dual Ethernet for payment-network segregation, and USB 2.0 for peripherals (barcode scanners, receipt printers, customer displays). The hardware AES/SHA accelerators accelerate EMV chip-card cryptographic handshakes. The mature Linux BSP and POS middleware ecosystem on the i.MX28 family reduce time-to-market for payment-terminal OEMs.
추천
Smart Energy Meters
Smart metering designs leverage the MCIMX280DVM4B's low-power ARM9 core, integrated LCD controller for the in-home display, and dual Ethernet or PLC connectivity options for AMI (Advanced Metering Infrastructure) backhaul. The hardware crypto accelerators accelerate DLMS/COSEM authentication. The industrial temperature range supports outdoor cabinet deployments. The DDR2 controller and NAND flash support enable local data logging for outage analysis.
추천
Networked Printers and MFPs
Networked printers and multifunction peripherals use the MCIMX280DVM4B for its dual Ethernet MACs (one for WAN, one for LAN), USB 2.0 High-Speed for direct-print jobs, LCD controller for the operator panel, and the ARM926EJ-S core for image rendering pipelines. The DDR2 controller handles scan buffers and font caches efficiently. The mature Linux print stack and PostScript/PDF interpreters have proven support on the i.MX28 architecture.
추천
Connected Consumer Multimedia Devices
Connected set-top boxes, digital photo frames, and IP-enabled media adapters use the MCIMX280DVM4B's I2S/AC97 audio interfaces, LCD pipeline for album art display, USB 2.0 for external storage, and Ethernet for streaming. The 454 MHz ARM9 core handles compressed audio (MP3, Ogg Vorbis, AAC) and low-bitrate video decode. The compact 14x14 mm MAPBGA package enables slim consumer enclosures while the Linux BSP supports popular media frameworks (GStreamer, Upnp).
추천
Automotive Infotainment (Non-Display) - Reference for MCIMX281
While the MCIMX280DVM4B itself targets industrial/consumer, the related MCIMX281AVM4B drop-in variant is AEC-Q100 qualified for non-display automotive infotainment: head-unit control modules, telematics, and audio head nodes. Both parts share the same 289-MAPBGA footprint, allowing PCB re-use between consumer SKUs and automotive SKUs - a strategic advantage for Tier-1 suppliers running dual-market production lines. Engineers can design one board and populate either silicon variant.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCIMX280DVM4B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX280CVM4B | MCIMX283DVM4B | MCIMX281AVM4B | MCIMX287CVM4B | MCIMX280DVM4BR2 | MCIMX280CVM4BR2 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 289-MAPBGA (14x14 mm) | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same |
| Core Architecture | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Maximum CPU Frequency | 454 MHz | 454 MHz | 454 MHz | 454 MHz | 454 MHz | 454 MHz | 454 MHz |
| Silicon Revision | B | C (lower power) | B (same revision) | B (same revision) | C | B (reel packaging) | C (reel packaging) |
| Display Controller | Yes (WVGA LCD) | Yes (WVGA LCD) | Yes (richer LCD pipelines) | No (automotive, non-display) | Yes | Yes (same die) | Yes |
| Automotive Grade (AEC-Q100) | No | No | No | Yes | No | No | No |
| Packaging Form | Tray (standard) | Tray | Tray | Tray | Tray | 13" Reel (1000 units) | 13" Reel (1000 units) |
주요 차별점
- Mature ARM9 software ecosystem with extensive Linux BSP support (vs MCIMX6S5EVM10AD)
- Dual 10/100 Ethernet MACs integrated on-die (vs MCIMX280CVM4B)
- Same-package automotive variant available (MCIMX281AVM4B) (vs MCIMX281AVM4B)
- Hardware AES/SHA accelerators on-die (vs MCIMX535DVV1C2R2)
설계 노트
The 289-MAPBGA 14x14 mm package with 0.8 mm ball pitch requires a high-density interconnect (HDI) PCB stack-up with microvias for fan-out. Recommended stack-up: 8-layer with 1-2-1 microvia construction. Use ENIG surface finish for best BGA solder joint reliability. Place decoupling capacitors (0.1 uF and 10 uF) within 2 mm of each power pin pair. The exposed center balls (if any per BGA pattern) should be connected to a thermal via array for heat dissipation.
The i.MX28 family requires multiple voltage domains (core, I/O, DDR2, PLL). Use a dedicated PMIC such as NXP's MMPF0100 or compatible to generate the sequenced power rails. The core voltage must ramp before I/O voltage per NXP power-up sequencing requirements. Add bulk capacitance of at least 47 uF low-ESR ceramic on the 1.2V core rail. Estimate total power dissipation around 0.5-1.0W at 454 MHz with typical peripheral utilization.
While the industrial -40C to +85C operating range is wide, the BGA package dissipates heat primarily through PCB copper. For sustained 454 MHz operation with full peripheral utilization, ensure at least 4 thermal vias (0.3 mm drill, 1 oz copper plating) under the central ball grid pattern. In enclosed industrial enclosures without forced airflow, derate CPU frequency or use revision C silicon (MCIMX280CVM4B) which has lower power consumption.
Given the NRND status, source the MCIMX280DVM4B only through authorized NXP distributors to avoid counterfeit risk. Request a Certificate of Conformance (CoC) and verify the date code. For new designs, prefer MCIMX280CVM4B (active) or evaluate migration to i.MX RT/i.MX 6UltraLite families - but note these require PCB redesign due to different packages and pinouts. Do not assume the LCD controller supports all resolutions - verify pixel-clock timing against your specific panel datasheet.
규정 준수 정보
RoHS compliance indicated by 'V' suffix in part number DVM4B. AEC-Q100 not applicable for the MCIMX280DVM4B - choose MCIMX281AVM4B for automotive applications. Halogen-free status not explicitly stated in datasheet; verify with NXP if required.