MCIMX6G1CVM05AA - i.MX 6UltraLite ARM Cortex-A7 MPU, 528MHz | NXP
부품 번호: MCIMX6G1CVM05AA ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.85 | $208.50 |
| 100 | $18.95 | $1,895.00 |
| 500 | $16.4 | $8,200.00 |
| 1,000 | $14.2 | $14,200.00 |
MCIMX6G1CVM05AA 개요
An applications processor (AP) is a system-on-chip (SoC) class of microprocessor designed to run a high-level operating system such as Linux, Android, or Windows Embedded while handling rich user interfaces, multimedia pipelines, and connectivity stacks. Within the wider taxonomy, the MCIMX6G1CVM05AA sits in the i.MX 6UltraLite family -> i.MX 6 series -> ARM Cortex-A applications processors -> microprocessors (MPU) -> integrated circuits. The Cortex-A7 core implements the ARMv7-A architecture with NEON SIMD, single-precision FPU, and TrustZone security extensions, delivering high performance per Watt for cost-sensitive industrial designs.
Key features include a 528 MHz maximum CPU clock, an integrated 2D graphics processing unit (GPU) via the Pixel Processing Pipeline (PxP) for simple overlays and image scaling, and a wide set of on-chip peripherals: dual Ethernet MACs, dual USB 2.0 with PHY, dual CAN-FD, multiple UART/SPI/I2C, and an integrated analog block. The part also exposes LPDDR2/DDR3/DDR3L memory controller and parallel display interfaces (RGB and LVDS bridges).
From an architectural standpoint, the i.MX 6UltraLite leverages NXP's heterogeneous multicore approach but in a single-core Cortex-A7 implementation, allowing deterministic real-time behavior on one core while leaving room for a Cortex-M4 companion in higher-tier variants. The device is built on a low-power 40 nm process and supports dynamic voltage and frequency scaling (DVFS) with multiple low-power states to fit battery-powered and thermally constrained products.
Typical applications include industrial human-machine interfaces (HMI), IoT gateways, smart energy and metering systems, point-of-sale (POS) terminals, building automation controllers, and low-end connected printers. The part's mix of Ethernet, CAN-FD, and display interfaces makes it a common choice when engineers need Linux-level compute with industrial-grade connectivity.
When designing with this device, allocate adequate PCB area for the MAPBGA 14x14 mm footprint, ensure LPDDR2/DDR3 trace lengths are matched for signal integrity, and follow NXP's Hardware Development Guide for the i.MX 6UltraLite family to avoid boot-mode pitfalls.
This page synthesizes distributor pricing, same-family drop-in variants, and practical design considerations not found in the manufacturer datasheet alone, helping engineers compare the MCIMX6G1CVM05AA against other i.MX 6UltraLite and competing Cortex-A7 MPUs.
드롭인 대체품: MCIMX6G1CVM05AA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCIMX6G1CVM05AA (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Ethernet, USB, Maximum CPU Frequency, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCIMX6G1CVM05AB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX6G1CVM05ABR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX6G0DVM05AA
✅ 드롭인✓ 재고 있음
$10.3 / 개
데이터시트 보기 →MCIMX6G1AVM05AA
✅ 드롭인✓ 재고 있음
$10.2 / 개
데이터시트 보기 →MCIMX283DVM4BR2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX280DVM4B
✅ 드롭인✓ 재고 있음
$11.5 / 개
데이터시트 보기 →MCIMX6G1CVM05AA 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | i.MX 6UltraLite |
| Core | ARM Cortex-A7 (single core) |
| Core Architecture | ARMv7-A |
| Maximum CPU Clock | 528 MHz |
| Nominal CPU Clock | 500 MHz |
| Bit Width | 32-bit |
| Package Type | 289-ball MAPBGA |
| Package Dimensions | 14 x 14 mm |
| 실장 유형 | Surface Mount |
| Graphics Accelerator | PxP 2D pixel processing pipeline |
| Ethernet | Dual 10/100 MAC |
| USB | Dual USB 2.0 with integrated PHY |
| CAN | Dual CAN-FD |
| 동작 온도 범위 | -40C to +105C (industrial) |
| RoHS 상태 | Compliant |
MCIMX6G1CVM05AA 14 x 14 mm 핀 구성 가이드
MCIMX6G1CVM05AA(14 x 14 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCIMX6G1CVM05AA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCIMX6G1CVM05AA 적합 용도: 6 애플리케이션s: Industrial Human-Machine Interface (HMI), IoT Gateway and Edge Connectivity, Smart Energy Metering and Substation Equipment, Point-of-Sale (POS) Terminal, Building Automation Controller, Connected Printer and Labeling Equipment.
Industrial Human-Machine Interface (HMI)
The MCIMX6G1CVM05AA is well suited to industrial HMI panels where a small colour TFT or LVDS display drives a touch-based operator interface. Its 528 MHz Cortex-A7 core runs a Linux HMI stack (Qt or WebKit) smoothly while the PxP 2D pixel pipeline accelerates screen rotation, alpha blending, and image scaling without burdening the CPU. Dual CAN-FD and dual Ethernet connectivity allow the panel to bridge to PLCs, inverters, and remote SCADA nodes on the same board.
추천
IoT Gateway and Edge Connectivity
In Linux-based IoT gateway designs the MCIMX6G1CVM05AA aggregates data from downstream sensors (Zigbee, LoRa, BLE, Modbus) and publishes it to cloud endpoints over Ethernet or cellular modems. The dual 10/100 Ethernet MAC supports two independent IP networks (e.g. field network and cloud network), while the dual USB 2.0 ports can host a cellular modem plus a Wi-Fi/BT module. DDR3L support keeps total BOM cost and power consumption low for always-on edge deployments.
추천
Smart Energy Metering and Substation Equipment
Smart electricity, water, and gas meters, plus secondary substation terminals, benefit from the MCIMX6G1CVM05AA's deterministic Cortex-A7 core running a secure real-time Linux. Dual CAN-FD interfaces allow concurrent connection to two metering buses, the integrated PxP enables on-device graphical user interfaces, and the -40C to +105C industrial temperature range supports outdoor cabinet installations with simplified thermal design.
추천
Point-of-Sale (POS) Terminal
Low-cost POS terminals use the MCIMX6G1CVM05AA to run Linux/Android with a graphical receipt preview, payment card reader integration over USB, and Ethernet or Wi-Fi connectivity. The 528 MHz Cortex-A7 provides enough headroom for TLS-secured payment transactions, while the integrated display controllers (RGB + LVDS bridge) drive both the operator screen and the customer-facing display without an external graphics chip.
추천
Building Automation Controller
Building automation controllers use the MCIMX6G1CVM05AA to host BACnet, Modbus, KNX, or LonWorks stacks while driving a touch display for local control. The combination of dual Ethernet (for IP-bridged building networks), dual USB (for radio or Zigbee dongles), and dual CAN-FD (for HVAC and elevator subsystems) enables a single-board controller without extra bridge chips, reducing the BOM cost and long-term reliability risk.
추천
Connected Printer and Labeling Equipment
Connected thermal and label printers use the MCIMX6G1CVM05AA to run a Linux print stack (CUPS, PWG-Raster), parse print jobs over Ethernet or Wi-Fi, and drive the print head plus stepper motors via GPIO and PWM. The Cortex-A7 performance comfortably handles full-page rasterization at typical label widths, while the integrated display controllers drive an operator LCD without additional graphics silicon.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCIMX6G1CVM05AA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX6G1CVM05AB | MCIMX6G1CVM05ABR | MCIMX6G0DVM05AA | MCIMX6G1AVM05AA |
|---|---|---|---|---|---|
| Package | 289-MAPBGA (14x14 mm) | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | 1 x ARM Cortex-A7 | 1 x ARM Cortex-A7 | 1 x ARM Cortex-A7 | 1 x ARM Cortex-A7 | 1 x ARM Cortex-A7 |
| Maximum CPU Clock | 528 MHz | 528 MHz | 528 MHz | 528 MHz | 528 MHz |
| Feature Tier | i.MX 6UltraLite G1 | i.MX 6UltraLite G1 | i.MX 6UltraLite G1 | i.MX 6UltraLite G0 | i.MX 6UltraLite G1 |
| Ethernet MACs | Dual 10/100 | Dual 10/100 | Dual 10/100 | Single 10/100 | Dual 10/100 |
| USB 2.0 Ports | Dual | Dual | Dual | Single | Dual |
| CAN-FD | Dual | Dual | Dual | Single | Dual |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Lifecycle Status (as of 2026-10-16) | Active | Active | Active | Active | Active |
주요 차별점
- Higher clock frequency than legacy i.MX28 family (vs MCIMX283DVM4BR2)
- G1 feature tier offers more peripherals than G0 (vs MCIMX6G0DVM05AA)
- Active NXP support and long-term availability (vs MCIMX283DVM4BR2 / MCIMX280DVM4B)
설계 노트
Estimated: the 289-ball MAPBGA at 0.8 mm pitch requires at least a 4-layer PCB with 0.1 mm via diameter, 0.4 mm pad, and continuous reference ground plane directly under the BGA. Match DDR3/LPDDR2 address, command, and clock trace lengths to within +/-25 mil (0.635 mm) per byte lane using serpentine tuning, and follow NXP's i.MX 6UltraLite Hardware Development Guide for via-in-pad recommendations.
Estimated: a typical 528 MHz Cortex-A7 design with DDR3L memory draws about 1.2-1.5 W from the SoC rails. Use the NXP-recommended PMIC sequence (often PF3000/PCA9450) to enforce proper power-up and power-down order for VDD_ARM, VDD_SOC, VDD_HIGH, and DRAM rails. Avoid linear regulators for high-current SoC rails - switch to a buck converter with at least 1.5x output current headroom to limit thermal stress.
Estimated: the i.MX 6UltraLite boot-mode pins (BOOT_CFG) are sampled only at POR and silently mis-configure the boot source if pulled incorrectly - always tie them to high-impedance pull-ups/downs with explicit resistors and double-check the schematic against the NXP reference design. Skipping the boot-mode resistors is the most common cause of 'no boot' on first prototypes.
At 528 MHz the SoC can dissipate 1.5-2 W depending on workload; the MAPBGA package couples this heat primarily through the PCB. A minimum 4-layer board with a continuous ground plane and 8 thermal vias (0.2 mm drilled, 0.5 mm pitch) under the die keeps the junction temperature below 105C without an external heatsink for most industrial environments.
Estimated: keep DDR clock length matched to within 25 mil (0.635 mm) of the address/command group, and isolate the DDR region with a continuous reference plane. Use IBIS simulation (available from NXP) to validate SI before committing to layout; many 'random reboot' issues on early i.MX prototypes trace to marginal DDR SI rather than firmware bugs.
규정 준수 정보
RoHS and REACH compliance verified from NXP product page. Not AEC-Q100 qualified - this is an industrial/consumer-grade MPU, not an automotive one. Halogen-free status not explicitly stated in the verified web data.
