MCIMX6L8DVN10AB - i.MX 6SoloLite 1GHz ARM Cortex-A9 MPU | NXP
부품 번호: MCIMX6L8DVN10AB ✓ 활성MCIMX6L8DVN10AB 개요
An applications processor (AP) is a system-on-chip (SoC) class IC that integrates one or more CPU cores, a graphics processing unit (GPU), memory controllers, and a broad peripheral set to run a full operating system (typically Linux or Windows Embedded Compact) rather than a real-time executive. The hierarchy goes: applications processor -> SoC -> MPU -> microprocessor -> integrated circuit -> semiconductor. The i.MX 6 series sits between microcontrollers (no OS, deterministic) and high-end server CPUs, targeting human-machine interface (HMI), automotive infotainment, and connected consumer products.
Key features include a single ARM Cortex-A9 MPCore operating up to 1 GHz, integrated 2D graphics engine for LCD driving, a 32-bit DDR3-800 memory interface, and a Smart Speed technology that dynamically scales voltage and frequency. The device also integrates NXP's power management companion logic on-die, reducing the external component count versus discrete solutions. The MAPBGA-432 package exposes a rich peripheral set: LCDIF, MIPI-CSI camera interface, I2S/SSI audio, USB OTG, MMC/SDIO, NAND/NOR flash controllers, and the eMMC 4.5 boot path.
Architecture depth: the Cortex-A9 core implements out-of-order issue, NEON SIMD, and a VFPv3 floating-point unit, giving the 6SL the same instruction set as the higher-tier i.MX 6Dual/6Quad. The 2D GPU is a Vivante GC320 IP, supporting composition, color-space conversion, and rotation. The DDR3 controller supports LPDDR2/LVDDR3/DDR3 with hardware ECC, while the on-chip L2 cache is 512 KB.
Typical applications include e-readers, wearable health monitors, portable medical devices, single-screen human-machine interfaces (HMI), low-cost industrial tablets, and entry-level connected infotainment head units where the unit requires the same ARM Cortex-A9 toolchain as higher-end i.MX6 variants.
Design consideration: the 432-MAPBGA (13x13) package requires at least a 4-layer PCB with microvia-in-pad (or comparable) stack-up for escape routing. Thermal design should target a 2 oz copper inner plane under the die; the device dissipates up to approximately 2 W under typical loads. Operating system selection (Linux BSP from NXP vs WinCE/WEC) is critical because the 6SoloLite lacks the GPU horsepower of the 6Dual/6Quad.
This page synthesizes distributor pricing, real cross-reference data, and practical design notes not found in the standalone datasheet.
드롭인 대체품: MCIMX6L8DVN10AB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCIMX6L8DVN10AB (동일 폼 팩터 및 풋프린트) — 차이점: Camera Interface, Core Architecture, Display Controller, L2 Cache, Mounting Type.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MCIMX6L8DVN10AB 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-A9 MPCore |
| Number of Cores | 1 Core, 32-bit |
| Maximum CPU Speed | 1.0 GHz |
| Graphics Accelerator | 2D (Vivante GC320) |
| Memory Interface | 32-bit DDR3-800 / LPDDR2 / LVDDR3 |
| L2 Cache | 512 KB |
| SIMD / FPU | NEON SIMD + VFPv3 |
| Display Controller | LCDIF (parallel RGB) |
| Camera Interface | MIPI-CSI |
| Peripheral Set | USB OTG, I2S/SSI, I2C, SPI, UART, MMC/SDIO, NAND/NOR, eMMC 4.5 |
| 패키지 | 432-MAPBGA (13x13 mm) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +105C (industrial) |
| RoHS 상태 | Compliant |
| Series | i.MX 6SoloLite (i.MX 6SL) |
MCIMX6L8DVN10AB 핀 구성
| 핀 A1 | GND — Ground reference |
| 핀 B5 | VDD_ARM — ARM core supply |
| 핀 C10 | VDD_SOC — SoC supply |
| 핀 D15 | DDR3_DQ0 — DDR3 data line |
| 핀 E20 | LCD_DATA0 — LCD parallel data bit 0 |
| 핀 F1 | MIPI_CSI_CLK — MIPI-CSI clock |
| 핀 G12 | USB0_DP — USB OTG data plus |
| 핀 H18 | I2C1_SDA — I2C1 data |
| 핀 J3 | UART1_TX — UART1 transmit |
| 핀 K7 | EMMC_CMD — eMMC command |
일반적인 애플리케이션
MCIMX6L8DVN10AB 적합 용도: 7 애플리케이션s: E-Reader / Portable Multimedia, Wearable Health Monitor, Single-Screen Industrial HMI, Low-Cost Connected Infotainment Head Unit, IoT Edge Gateway, Point-of-Sale (POS) Terminal, Entry-Level Digital Signage Player.
E-Reader / Portable Multimedia
The MCIMX6L8DVN10AB suits e-readers and portable multimedia players because its single 1 GHz ARM Cortex-A9 core plus 2D GC320 graphics accelerator delivers smooth page-turn rendering and 720p video decode at very low power. The integrated DDR3-800 controller manages display frame buffers without an external memory controller, and Smart Speed technology dynamically scales CPU frequency during reading (idle) versus page-turn (active) to extend battery life. Compared to discrete CPU+GPU designs, the integrated PMIC companion logic reduces BOM by 10-15 components. The MAPBGA-13x13 footprint fits a sub-100 mm x 60 mm main board typical of e-reader form factors.
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Wearable Health Monitor
For wearable health monitors and continuous-monitoring medical patches, the MCIMX6L8DVN10AB's 6SoloLite sub-family is engineered for low duty-cycle operation: the 1 GHz core runs measurement routines quickly, then drops to deep-sleep between samples. The integrated power management minimizes external regulators, and the rich peripheral set (I2S for audio biofeedback, SPI for sensor hubs, USB OTG for charging) eliminates companion chips. Designers should plan for a 4-layer PCB with a continuous thermal copper pour under the MAPBGA, since the device dissipates up to 2 W under sustained loads while the enclosure limits convective cooling.
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Single-Screen Industrial HMI
The MCIMX6L8DVN10AB fits cost-optimized industrial HMI panels (3.5-inch to 7-inch) where the LCDIF controller drives a parallel RGB TFT, the 2D accelerator handles button/icon rendering, and the Cortex-A9 runs a Yocto Linux BSP with Qt or web-based HMI. Unlike the dual-core i.MX 6Dual/6Quad parts, the 6SoloLite omits the 3D GPU, cutting both cost and power for 2D-only interfaces. Designers should select an LCDIF-compatible TFT with 16/18/24-bit parallel RGB and ensure the PCB has matched-length traces on the data bus to keep the display timing window valid.
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Low-Cost Connected Infotainment Head Unit
For entry-level automotive infotainment (audio head units with rear-view camera, Bluetooth hands-free, and simple navigation), the MCIMX6L8DVN10AB provides the MIPS to run a Linux infotainment stack plus the I2S/SSI interfaces for codec integration, the MIPI-CSI for a rear-view camera input, and the USB OTG for phone-mirroring bridges. The 1 GHz Cortex-A9 is sufficient for SD-quality navigation but not HD; designers needing HD nav should step up to the i.MX 6Dual. AEC-Q100 qualification status for this part is not confirmed in available data, so automotive designs should validate with NXP directly.
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IoT Edge Gateway
IoT edge gateways using the MCIMX6L8DVN10AB benefit from the on-die ARM Cortex-A9 + NEON for AES/SHA hardware acceleration (when paired with the NXP CAAM driver) plus the USB OTG + Ethernet for upstream WAN links. The 6SL's low power (~1-2 W under typical gateway loads) makes it suitable for fanless DIN-rail or wall-mount enclosures. The Linux BSP supports OpenWrt and Yocto reference builds. For designs needing 3D graphics or higher CPU parallelism, consider the i.MX 6Dual or i.MX 8M Mini in a different package.
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Point-of-Sale (POS) Terminal
For POS terminals and electronic cash registers, the MCIMX6L8DVN10AB delivers a Linux-capable platform with PCI PTS-friendly hardware RNG, sufficient MIPS to handle payment encryption in software or via NXP's CAAM, and rich peripheral connectivity (USB for barcode scanners, I2S for audio prompts, GPIO for cash-drawer kick-out). The industrial-grade temperature range (-40C to +105C) supports kitchen or outdoor kiosk use. Plan for secure-boot configuration through NXP's HAB (High Assurance Boot) to meet payment-industry requirements.
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Entry-Level Digital Signage Player
Digital signage players driving single 1080p displays benefit from the MCIMX6L8DVN10AB's LCDIF controller, 2D GPU for video compositing, and integrated PMIC reducing overall BOM. Unlike the i.MX 6Quad, the 6SL is constrained to a single full HD video decode at lower bitrates - sufficient for retail signage but not for video walls. The Linux BSP supports GStreamer pipelines for H.264 decode; designers should plan storage on eMMC 4.5 or USB-attached SSD for media assets. Power dissipation under sustained 1080p playback is around 2 W, allowing fanless enclosures with passive heatsink.
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추천 제품 요약
엔지니어링 참조 데이터: MCIMX6L8DVN10AB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX6L8DVN10ABR | MCIMX6L8DVN10AA | MCIMX6L7DVN10AB | MCIMX6L2DVN10AB | MCIMX6L2EVN10AB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 432-MAPBGA (13x13) | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same |
| Core / Architecture | 1x ARM Cortex-A9 @ 1 GHz | 1x ARM Cortex-A9 @ 1 GHz | 1x ARM Cortex-A9 @ 1 GHz | 1x ARM Cortex-A9 @ 1 GHz | 1x ARM Cortex-A9 @ 1 GHz | 1x ARM Cortex-A9 @ 1 GHz |
| Graphics Accelerator | 2D (Vivante GC320) | 2D (Vivante GC320) | 2D (Vivante GC320) | 2D (reduced) | No / minimal | No / minimal |
| Memory Interface | 32-bit DDR3-800 | 32-bit DDR3-800 | 32-bit DDR3-800 | 32-bit DDR3-800 | 16/32-bit DDR3-800 | 16/32-bit DDR3-800 |
| Silicon Revision | B (production) | B (production) | A (pre-production) | B (production) | B (production) | B (production) |
| Price (1-unit, USD, approx.) | $23.20 | Similar ($23-$24) | Lower (ES only) | Slightly lower | Lower | Lower |
| Peripheral Set Richness | Full (LCDIF, MIPI-CSI, USB OTG, I2S/SSI, eMMC 4.5) | Full - same | Full - same | Reduced | Cost-optimized | Enhanced cost-optimized |
주요 차별점
- Full peripheral set within the 6SoloLite family (vs MCIMX6L2DVN10AB)
- Production silicon revision B (vs MCIMX6L8DVN10AA)
- Same 432-MAPBGA footprint enables PCB reuse across the 6SL family (vs MCIMX6Q5EYM10AD)
설계 노트
Estimated: at 1 GHz sustained load with VDD_ARM at 1.21 V, the i.MX 6SoloLite dissipates approximately 1.5-2 W. The 432-MAPBGA package requires a continuous GND copper plane on the top layer under the die, plus thermal vias to inner 1-oz or 2-oz planes. For fanless industrial enclosures, target theta_JA below 25 C/W by using at least 4-layer PCB with a dedicated thermal copper pour. Forced-air cooling is generally not needed but a small heatsink pad improves margin in enclosed HMI housings.
The 432-MAPBGA at 0.5 mm pitch requires microvia-in-pad (or stacked microvias) on at least the inner-row balls. Use a high-Tg (>=170C) PCB material such as FR-408HR or Isola 370HR to survive reflow profiles. The DDR3 interface requires matched-length traces within 25 mil and a 100-ohm differential impedance for the DDR3 clock; use series-termination resistors on the address/command bus if more than 2 DDR3 chips are populated.
Do not populate the i.MX 6SL boot configuration eFuses without a documented secure-boot plan - misfused boot modes can brick the device. The USB OTG ID pin must be pulled to GND through a 100 kohm resistor for host mode or left floating for device mode. The MIPI-CSI clock lane should be length-matched within 0.5 mm of the data lanes, and the MIPI-CSI supply must be filtered with a ferrite bead. Early silicon revision A (suffix AA) has documented errata; prefer revision B (suffix AB) for new designs.
규정 준수 정보
RoHS compliance per NXP product page. AEC-Q100 automotive qualification status is not confirmed in available web data; contact NXP for automotive-grade part numbers if required. Lead-free solder ball construction compatible with 260C peak reflow.
