MCIMX6U1AVM08AB - Microcontrollers | NXP Semiconductors
부품 번호: MCIMX6U1AVM08AB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $48.75 | $48.75 |
| 10 | $45.2 | $452.00 |
| 100 | $40.55 | $4,055.00 |
| 500 | $36.1 | $18,050.00 |
| 1,000 | $32.4 | $32,400.00 |
MCIMX6U1AVM08AB 개요
A microprocessor (MPU) is a system-on-chip that integrates one or more CPU cores, memory controllers, peripheral interfaces, and often a graphics processor on a single die. The MCIMX6U1AVM08AB sits in the i.MX6 family hierarchy between the single-core i.MX6 Solo and the higher-end i.MX6 Dual, which adds a 3D GPU and additional multimedia IP. Within the broader taxonomy, this places it at: ARM Cortex-A9 core -> i.MX6 applications processor -> i.MX family -> NXP applications processors -> 32-bit MPU -> semiconductor. Understanding this hierarchy helps designers benchmark it against competing Cortex-A9 parts such as TI Sitara AM437x and other mid-range multimedia MPUs.
Key features include dual ARM Cortex-A9 cores at 800 MHz, hardware video codecs supporting up to 1080p decoding, integrated LVDS/MIPI display controllers, dual Gigabit Ethernet MACs with hardware acceleration, USB 2.0 with PHY, PCI Express Gen 2.0, and multiple connectivity peripherals including CAN, I2C, SPI, UART, and SD/MMC. The processor is paired with an advanced power management block enabling per-domain clock gating and DVFS for energy-efficient operation.
From an architectural standpoint, the part uses NEON SIMD media processing extensions, a 32 KB / 32 KB L1 cache per core, and a unified 512 KB L2 cache. It supports LPDDR2, LVDDR3, and DDR3/LV-DDR3 memory interfaces, providing flexible system-memory configurations. Bus architectures include AHB for high-bandwidth peripherals and APB for low-bandwidth configuration registers.
Typical uses include industrial HMI panels, automotive infotainment head units, telematics and connected-vehicle gateways, point-of-sale terminals, medical imaging displays, and ruggedized multimedia IoT edge devices. The automotive grade specified in the MPN suffix (-A) makes it well suited to in-vehicle applications that must operate across the full automotive temperature window.
When designing with the MCIMX6U1AVM08AB, follow the NXP hardware design guide and use the evaluation board reference schematic to plan DDR routing. Pin 1 of the MAPBGA is typically identified by the corner marking; engineers should consult the package mechanical drawing before PCB layout. Thermal management at this die size benefits from a well-grounded inner copper plane layer.
This page synthesizes NXP-authorized distributor pricing, drop-in same-family variants, and practical design guidance that complements the official i.MX6 reference manual.
드롭인 대체품: MCIMX6U1AVM08AB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MCIMX6U1AVM08AB 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-A9 (dual-core) |
| Maximum Core Frequency | 800 MHz |
| 데이터 버스 폭 | 32-bit |
| Family | i.MX 6DualLite (i.MX6DL) |
| 패키지 / 케이스 | 624-MAPBGA (21x21 mm) |
| 핀 수 | 624 |
| 공급 전압 | 1.8 V / 2.5 V / 2.8 V / 3.15 V (multi-rail) |
| Temperature Grade | Automotive |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 512 KB unified |
| NEON SIMD | Yes |
| Memory Interface | LPDDR2, LPDDR3, DDR3, LV-DDR3 |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
MCIMX6U1AVM08AB 624-mapbga (21x21 mm) 핀 구성 가이드
MCIMX6U1AVM08AB(624-mapbga (21x21 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCIMX6U1AVM08AB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCIMX6U1AVM08AB 적합 용도: 6 애플리케이션s: Industrial Human-Machine Interface (HMI), Automotive Infotainment Head Unit, Telematics and Connected-Vehicle Gateway, Point-of-Sale Terminal, Medical Imaging Display Console, Ruggedized Multimedia IoT Edge Device.
Industrial Human-Machine Interface (HMI)
The MCIMX6U1AVM08AB fits industrial HMI panels thanks to its dual ARM Cortex-A9 cores and integrated 2D GPU, which can drive LVDS/MIPI displays up to 1080p without an external graphics chip. The 800 MHz core clock executes Qt/QML or Web-based HMI stacks with smooth frame rates, while the DDR3/LPDDR2 controller keeps memory bandwidth ample for animated UIs. Placed on a 4-layer carrier board with a 5V to 1.8V/2.5V/2.8V/3.15V PMIC, it dissipates roughly 2-3 W at full load versus the 5-8 W of an i.MX6 Quad part, easing thermal design.
추천
Automotive Infotainment Head Unit
The MCIMX6U1AVM08AB is qualified for in-vehicle use by its automotive temperature grade and integrates hardware video codecs for 1080p H.264 decode plus audio DSP offload, which is precisely what mid-tier infotainment head units need. Dual Cortex-A9 cores support Android Auto/CarPlay class stacks with their Linux/Android base port running on one core and media pipelines on the other. Compared with the i.MX6 Dual or Quad, the DualLite's omission of 3D GPU cuts BOM cost; designers wanting 3D maps must step up to MCIMX6U4AVM08AC, which changes pin assignments.
추천
Telematics and Connected-Vehicle Gateway
Dual Gigabit Ethernet MACs with hardware acceleration let the MCIMX6U1AVM08AB aggregate automotive Ethernet traffic from ECUs while running a Linux telematics stack on the Cortex-A9 cores. The integrated CAN controllers tie the SoC directly to vehicle CAN-FD busses without external bridges, lowering system cost and PCB area. At 800 MHz the part handles TLS encryption on roughly 100 Mbps of network traffic; design for a heatsink or thermal via array if the gateway is sealed against airflow.
추천
Point-of-Sale Terminal
POS terminals running Android or Linux benefit from the MCIMX6U1AVM08AB's hardware crypto accelerators and dual display controllers for customer/operator screens. The integrated LVDS/MIPI and PCIe controllers let the carrier board drive a touch display, a printer, and a magnetic-card reader off a single SoC. Compared with the single-core i.MX6 Solo, the dual Cortex-A9 lets one core run payment processing and the other drive the UI, isolating security and UX threads.
추천
Medical Imaging Display Console
The MCIMX6U1AVM08AB supports medical-grade imaging displays because its DVI/HDMI output and LVDS interface pair with high-resolution panels and its hardware codecs handle ultrasound/ endoscopy video at low latency. With 800 MHz Cortex-A9 and NEON SIMD, real-time image preprocessing runs in software without offloading to a DSP. Designers should observe IEC 60601 isolation requirements on the carrier board - the SoC itself is not medical-grade certified, but it integrates well into systems that target IEC 60601-1.
추천
Ruggedized Multimedia IoT Edge Device
Outdoor signage, kiosk terminals, and ruggedized edge devices run on the MCIMX6U1AVM08AB due to its automotive temperature grade, integrated LVDS panels, and 2D GPU that drives human-readable dashboards. The PCIe Gen 2.0 controller accepts an AI accelerator card or SSD for edge AI, while dual GbE handles uplink and daisy-chain connectivity. Typical carrier-board power dissipation lands between 2-3 W, which suits fanless enclosures; effective thermal management requires a continuous inner copper plane and thermal vias under the BGA.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCIMX6U1AVM08AB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX6S4AVM08AB | MCIMX6U5AVM08AB | MCIMX6U1AVM08AC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 624-MAPBGA (21x21 mm) | 624-MAPBGA (21x21 mm) | 624-MAPBGA (21x21 mm) | 624-MAPBGA (21x21 mm) |
| Core | Dual ARM Cortex-A9 | Single ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Family | i.MX6 DualLite (U1) | i.MX6 Solo (S4) | i.MX6 DualLite (U5) | i.MX6 DualLite (U1) |
| GPU | 2D only | 2D only | 2D only | 2D only |
| Lifecycle | NRND | NRND | NRND | NRND |
주요 차별점
- Balanced multimedia and dual-core compute (vs MCIMX6S4AVM08AB)
- Lower power than i.MX6 Quad (vs MCIMX6U4AVM08AC)
- Automotive temperature grade standard (vs MCIMX6U1AVM08AC)
설계 노트
Estimated: at typical 1.05 V core supply with both Cortex-A9 cores active, the MCIMX6U1AVM08AB dissipates approximately 2-3 W. The 21x21 mm MAPBGA package benefits from a 4-layer PCB with a continuous GND plane under the BGA; thermal vias (0.2 mm drill, 0.5 mm pitch) tied to inner copper help spread heat. For sealed industrial enclosures, derate to roughly 70% of maximum core frequency.
Follow the NXP i.MX6 hardware design guide for DDR3/LPDDR2 routing: 50 ohm single-ended impedance, length matching within +/-25 mils for byte lanes, and decoupling within 100 mils of every BGA power pin. Place the 24 MHz crystal within 5 mm of the XTAL pins with a guard ring tied to AGND. Route USB DP/DN as a 90 ohm differential pair with no stubs, and add common-mode chokes at the connector.
Do not power the MCIMX6U1AVM08AB without bringing up all four voltage rails (1.8 V, 2.5 V, 2.8 V, 3.15 V) in the order specified by the NXP power-up sequence; the PMIC's POWER_OK signal must gate the processor's reset to avoid latch-up. Avoid routing high-speed signals under the BGA shadow - the inner planes will be perforated by via arrays. Always program the boot configuration fuses before production flashing.
규정 준수 정보
RoHS compliance per NXP product page. AEC-Q100 specifically refers to automotive electrical-component qualification; the -A suffix indicates NXP's automotive temperature grade but is not equivalent to AEC-Q100 certification, which is not declared on the product page.
