MCIMX6U4AVM08AB - i.MX6 DualLite ARM Cortex-A9 800MHz MPU | NXP
부품 번호: MCIMX6U4AVM08AB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $44.2 | $442.00 |
| 100 | $39.8 | $3,980.00 |
| 500 | $35.6 | $17,800.00 |
| 1,000 | $31.9 | $31,900.00 |
MCIMX6U4AVM08AB 개요
An applications processor (AP) is a system-on-chip (SoC) class IC designed to run an operating system and execute complex application workloads, sitting hierarchically above microcontrollers and below multi-chip server CPUs in the embedded computing stack. The i.MX6 family extends this with NXP's IP for multimedia — hardware video codecs, GPU blocks, image processing pipelines — and integrates DRAM controllers, display/LVDS interfaces, Ethernet MACs, USB, and PCIe PHYs alongside the CPU cores, giving board designers a single-chip computing platform for industrial HMI, automotive infotainment, and connected consumer devices.
Key features include dual ARM Cortex-A9 cores at 800 MHz with 32 KB L1 instruction cache, 32 KB L1 data cache, and a unified 256 KB L2 cache. The integrated IPUs, GPU (Vivante GC320 2D plus optional GC880 3D shader), and VPU support 1080p video decode/encode and dual-display output. Connectivity includes one Gigabit Ethernet MAC with AVB support, two USB 2.0 OTG controllers plus one USB 2.0 host, PCIe 2.0, SATA II, four UARTs, four I2C, three SPI, and CAN bus interfaces. The chip is manufactured in a 40 nm CMOS low-power process and supports DDR3/DDR3L/LPDDR2 memory with the hardware Multi-Mode DDR controller.
From an architectural perspective, the i.MX6DL utilizes a multi-level memory hierarchy with speculative out-of-order execution on the Cortex-A9 pair, giving strong single-threaded performance for system code while keeping two cores available for parallelized workload partitioning. NXP's Smart Speed Technology provides dynamic voltage and frequency scaling across CPU, GPU, and peripheral domains, enabling the 800 MHz operating point used here. The internal 624-pin BGA provides extensive I/O for multimedia-rich designs while remaining compatible with the i.MX6Q (Quad), i.MX6D (Dual), i.MX6S (Solo), and i.MX6UL/6ULL families in adjacent designs.
Typical applications span industrial human-machine interfaces (HMI), point-of-sale (POS) terminals, building automation control panels, automotive infotainment head units (with the Q1 graded parts recommended for AEC-Q100 designs), medical patient-monitoring displays, and networked smart-home gateways. The DualLite variant targets designs that need two Cortex-A9 cores but no 3D GPU shader (the GC880 is unpopulated on this die variant), reducing cost versus the Quad part while retaining L2 cache and full Cortex-A9 compute headroom.
When designing with this part, ensure the board provides adequate thermal dissipation — at 800 MHz the typical power envelope sits between 2 W and 4 W depending on workload, and the 21x21 BGA benefits from a four-layer PCB with thermal vias under the die. DDR3/LPDDR2 routing must follow NXP's i.MX6 hardware design guide for signal integrity, and the boot configuration pins need to be latched correctly by the onboard PMIC at POR.
This page combines NXP datasheet specifications, current distributor pricing across DigiKey/Mouser/Octopart, drop-in same-package alternative parts, and engineering design notes that go beyond the basic product page found on distributor sites.
드롭인 대체품: MCIMX6U4AVM08AB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MCIMX6U4AVM08AB 최대 정격 & 전기적 특성
| Series | i.MX 6 |
| Core Architecture | ARM Cortex-A9 |
| Core Count | 2 (DualLite) |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Clock | 800 MHz |
| L1 Instruction Cache | 32 KB per core |
| L1 Data Cache | 32 KB per core |
| L2 Cache | 256 KB unified |
| Memory Interface | DDR3, DDR3L, LPDDR2 (16/32-bit) |
| GPU | Vivante GC320 2D |
| VPU | Hardware video codec (1080p) |
| 패키지 | 624-MAPBGA (21x21 mm) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +85C (industrial) |
| Process Node | 40 nm CMOS |
| RoHS 상태 | Compliant |
MCIMX6U4AVM08AB 624-mapbga (21x21 mm) 핀 구성 가이드
MCIMX6U4AVM08AB(624-mapbga (21x21 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCIMX6U4AVM08AB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCIMX6U4AVM08AB 적합 용도: 6 애플리케이션s: Industrial Human-Machine Interface (HMI) Panel, Automotive Infotainment Head Unit, Point-of-Sale (POS) Terminal, Building Automation Control Panel, Medical Patient-Monitoring Display, Connected Smart-Home Gateway.
Industrial Human-Machine Interface (HMI) Panel
The MCIMX6U4AVM08AB is well suited as the host processor for industrial HMI panels operating from -40C to +85C. Its dual Cortex-A9 cores run Qt/EGL graphical interfaces, the integrated VPU handles 1080p video playback for instructional loops, and the rich peripheral set (LVDS dual-display output, PCIe, USB 2.0) supports touchscreens and barcode scanners. The 40 nm process and NXP Smart Speed Technology dynamic voltage/frequency scaling let the panel idle to a few hundred milliwatts when the operator is not actively touching the screen, while delivering full 800 MHz on demand. Designers typically pair it with DDR3L for cost efficiency and a dedicated PMIC for deterministic power-up sequencing.
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Automotive Infotainment Head Unit
The MCIMX6U4AVM08AB's AEC-Q100 Grade 3 qualification and dual-core Cortex-A9 compute make it a classic choice for in-vehicle infotainment head units. The integrated VPU handles 1080p H.264 playback for rear-seat entertainment, while the GC320 2D GPU powers instrument-cluster graphics and HVAC-control overlays. The on-chip Ethernet MAC with AVB support streams audio deterministically, and the two CAN interfaces connect to body and powertrain buses. Pair it with an automotive PMIC such as the PF0100 for sequencing. For under-hood or higher-temperature designs, NXP offers i.MX6 variants qualified to Grade 2.
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Point-of-Sale (POS) Terminal
POS terminals benefit from the MCIMX6U4AVM08AB's rich peripheral set and multimedia performance. The two Cortex-A9 cores run Android/Linux POS applications, the touchscreen-friendly LVDS output drives the cashier display, and the hardware VPU handles customer-facing promotional video. USB 2.0 ports connect barcode scanners and cash drawers, while the on-chip Ethernet MAC and PCIe lanes support LAN and Wi-Fi modules. The industrial temperature range lets the terminal operate in kitchens and warehouse aisles where temperatures swing. NXP's BSP support includes Android and Yocto builds covering common POS frameworks.
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Building Automation Control Panel
For building automation, the MCIMX6U4AVM08AB brings dual-core Cortex-A9 compute, multi-protocol connectivity, and industrial temperature tolerance in a single SoC. The Ethernet MAC with AVB support handles building-network traffic including BACnet/IP, while the CAN interfaces connect to HVAC and elevator subsystems. The LVDS display output drives 7- to 15-inch wall-mount control panels, and the touchscreen-friendly interfaces pair well with capacitive overlays. NXP's LTS Linux BSP ensures long-term supply for facility-management platforms that must run uninterrupted for a decade or more.
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Medical Patient-Monitoring Display
Patient-monitoring displays at bedside often use the MCIMX6U4AVM08AB for its industrial temperature reliability, multimedia performance, and long-life NXP supply commitment. The dual Cortex-A9 cores run Linux medical-grade UI frameworks, the VPU decodes IP-camera feeds from bedside cameras, and the LVDS/MIPI outputs drive diagnostic displays. IEC 60601-1 compliant power design typically pairs the SoC with an isolated PMIC and a low-leakage DDR3L for safe patient-side operation. NXP's long-term BSP support matches the 10+ year lifecycle typical of medical devices.
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Connected Smart-Home Gateway
Smart-home gateways need to terminate Zigbee, Z-Wave, Wi-Fi, and Ethernet into a single IP endpoint — exactly the workload the MCIMX6U4AVM08AB is built for. The dual Cortex-A9 cores run a Linux-based home-automation daemon, the VPU decodes camera streams, the SATA II controller hosts local video storage, and the Gigabit Ethernet MAC with AVB streams audio to multiroom speakers. USB 2.0 ports connect optional Z-Wave or Thread dongles. Industrial temperature tolerance lets the gateway sit in unconditioned utility closets. NXP's i.MX6 BSP includes AVB stack support for deterministic audio delivery.
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추천 제품 요약
엔지니어링 참조 데이터: MCIMX6U4AVM08AB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCIMX6U4AVM08AC | MCIMX6U4AVM10AC | MCIMX6U5AVM08AB | MCIMX6S4AVM08AB | MCIMX6Q4AVM08AB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 624-MAPBGA (21x21) | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same | 624-MAPBGA (21x21) - same |
| CPU Cores | 2 x Cortex-A9 | 2 x Cortex-A9 | 2 x Cortex-A9 | 2 x Cortex-A9 | 1 x Cortex-A9 | 4 x Cortex-A9 |
| CPU Clock | 800 MHz | 800 MHz | 1 GHz (+25%) | 800 MHz | 800 MHz | 800 MHz |
| GPU | GC320 2D | GC320 2D | GC320 2D | GC320 2D | GC320 2D | GC320 2D + GC880 3D |
| VPU (Video Decode) | 1080p H.264 30 fps | 1080p H.264 30 fps | 1080p H.264 30 fps | 1080p H.264 30 fps | 1080p H.264 30 fps | 1080p H.264 30 fps |
| Temperature Grade | -40C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| AEC-Q100 | Yes (Grade 3) | No (commercial) | No (commercial) | Yes (Grade 3) | Yes (Grade 3) | Yes (Grade 3) |
주요 차별점
- Dual-core compute in a Q4-compatible package (vs MCIMX6S4AVM08AB)
- Industrial temp range and AEC-Q100 Grade 3 (vs MCIMX6U4AVM08AC)
- Same package as the Quad upgrade path (vs MCIMX6Q4AVM08AB)
설계 노트
Estimated: at 800 MHz DualLite with both cores active, typical power dissipation is around 2.5 W. The 21x21 mm MAPBGA package requires a four-layer PCB with thermal vias under the die-attached paddle to keep junction temperature below 85C in industrial enclosures. Without adequate cooling the part will throttle to 600-700 MHz in heavy workloads. Use NXP's i.MX6 thermal management application note (AN4578) for the recommended copper-pour and via pattern.
The 0.8 mm pitch BGA requires microvia PCB technology — standard 1.0 mm-pitch BGA breakout won't work. Use 1-2-1 or 1-n-1 stack-up with laser-drilled microvias, matched-length DDR3 traces of 50 ohms +/- 10 percent, and length-matched LVDS pairs at 100 ohms differential. NXP publishes an i.MX6 SABRE reference platform with full schematic and layout files that designers should treat as a template. Reference designators for decoupling caps should be placed as close as possible to the BGA beneath the keep-out.
Do not boot without a properly configured PMIC. The MCIMX6U4AVM08AB requires a PMIC such as the PF0100 or PF8100 with correct power-on sequencing; failure to drive the POR_B and reset signals correctly will leave the SoC in an indeterminate state. The boot configuration pins (BOOT_MODE, BOOT_CFG) need to be latched by the reset controller at POR — pull-ups/pull-downs on these balls are not optional. Also verify DDR3 timing calibration against the NXP i.MX6 calibration procedure before finalizing layouts.
규정 준수 정보
RoHS and REACH compliant per NXP product page. AEC-Q100 Grade 3 qualified for automotive applications per the 'B' suffix in the MPN. Halogen-free per NXP's standard BGA lead-free process.
