MIMXRT1064CVJ5B - 528MHz Cortex-M7 Crossover MCU | NXP
부품 번호: MIMXRT1064CVJ5B ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.42 | $18.42 |
| 10 | $16.1 | $161.00 |
| 100 | $13.69 | $1,369.00 |
| 500 | $12.05 | $6,025.00 |
| 1,000 | $11.1 | $11,100.00 |
MIMXRT1064CVJ5B 개요
A crossover MCU (also called a crossover processor or hybrid MCU) is a class of microcontrollers that combines the high CPU performance and rich peripherals of an applications processor with the deterministic real-time response and ease-of-use of a microcontroller. The MIMXRT1064CVJ5B inherits this architecture, sitting in the broader taxonomy of microcontroller -> embedded MCU -> crossover MCU -> real-time control processor -> semiconductor. It is engineered for industrial IoT, HMI, and motor-control applications that demand both high throughput and deterministic real-time behavior.
Key features include 4 MB on-chip flash, 1 MB SRAM (configurable as TCM, OCRAM, or DTCM), dual USB 2.0 OTG controllers with PHY, integrated 2D graphics acceleration engine (PxP), MIPI-CSI and parallel display interfaces, hardware encryption (AES, TRNG, secure boot), and 3x FlexCAN plus 2x Ethernet (10/100M). The 196-LFBGA package exposes a rich GPIO set and a wide peripheral mix designed to replace multi-chip MCU+DRAM solutions with a single BGA.
The internal bus matrix and dual-issue pipeline allow the Cortex-M7 core to execute from tightly-coupled memory with single-wait-state access, enabling benchmark scores above 1280 CoreMark while keeping interrupt latency deterministic. On-chip regulators, integrated power management, and support for low-power modes make the device suitable for both line-powered industrial designs and battery-aware edge nodes.
Typical applications include industrial human-machine interfaces, edge IoT gateways, motor control drives, audio subsystems, and graphics-rich consumer devices. The wide peripheral set also suits Point-of-Sale terminals, building automation, and connected appliances. Designers choose this part when they need Cortex-M7-class DSP and FPU throughput without migrating to a Linux-capable MPU.
When designing with this device, allocate sufficient PCB copper under the BGA for thermal dissipation and route high-speed interfaces (MIPI-CSI, parallel display, RMII) with controlled-impedance traces. Plan supply sequencing for the multiple internal rails and follow the NXP hardware development guide for boot mode configuration (boot source, SD/eMMC, SPI flash) to avoid bricked prototypes.
This page consolidates distributor pricing for the 196-LFBGA package, drop-in i.MX RT1064 family variants, and practical design considerations not always obvious from the manufacturer datasheet, helping procurement, EE, and firmware engineers choose the right crossover MCU for industrial and IoT designs.
드롭인 대체품: MIMXRT1064CVJ5B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MIMXRT1064CVJ5B (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, Camera Interface, Display Interface, Ethernet.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MIMXRT1064CVL5B
✅ 드롭인✓ 재고 있음
$6.78 / 개
데이터시트 보기 →MIMXRT1064DVL6A
✅ 드롭인✓ 재고 있음
$9.3 / 개
데이터시트 보기 →MIMXRT1064CVJ5A
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MIMXRT1062CVJ5B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MIMXRT1051DVL6A
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MIMXRT1064CVJ5B 최대 정격 & 전기적 특성
| Core Architecture | Arm Cortex-M7 |
| Maximum CPU Frequency | 528 MHz |
| On-chip Flash | 4 MB |
| On-chip SRAM | 1 MB |
| 패키지 | 196-LFBGA (12x12 mm) |
| Operating Voltage | 3.0 V to 3.6 V |
| 동작 온도 | -40C to +105C (industrial) |
| USB Controllers | 2x USB 2.0 OTG with integrated PHY |
| Ethernet | 2x 10/100 Mbps (MII/RMII) |
| CAN Controllers | 3x FlexCAN |
| Display Interface | Parallel LCD + MIPI-DSI (via PxP) |
| Camera Interface | MIPI-CSI + parallel CSI |
| Security Accelerators | AES-128/256, TRNG, secure boot, HAB |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
MIMXRT1064CVJ5B 196-lfbga (12x12 mm) 핀 구성 가이드
MIMXRT1064CVJ5B(196-lfbga (12x12 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MIMXRT1064CVJ5B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MIMXRT1064CVJ5B 적합 용도: 6 애플리케이션s: Industrial Human-Machine Interface (HMI), Edge IoT Gateway, Motor Control and Drives, Point-of-Sale Terminal, Connected Appliance Controller, Audio Subsystem / Smart Speaker.
Industrial Human-Machine Interface (HMI)
The MIMXRT1064CVJ5B fits industrial HMI panels because its 528 MHz Cortex-M7 with hardware 2D PxP engine can drive parallel LCD plus MIPI-DSI displays at WVGA resolutions while sustaining real-time touch polling and GUI refresh. The 1 MB SRAM holds framebuffers without external DRAM, while 4 MB on-chip flash stores LVGL/embedded-wizard graphics assets. Hardware AES-128/256 plus TRNG enables secure boot and OTA update verification for factory-floor panels. Engineers pair this MCU with capacitive touch controllers over I2C and use the FlexCAN ports for fieldbus integration.
추천
Edge IoT Gateway
Edge IoT gateways benefit from the MIMXRT1064CVJ5B's dual 10/100 Ethernet, dual USB 2.0 OTG, and three FlexCAN interfaces, which allow simultaneous wired backhaul, sensor-bus bridging, and local diagnostics on a single BGA. The 528 MHz Cortex-M7 with FPU and DSP runs TLS 1.3, MQTT-SN, and edge-inference models (TensorFlow Lite Micro) in real time without a Linux BSP, reducing boot time to under 200 ms. The 4 MB flash hosts rich OTA images; the 1 MB SRAM holds TLS session state and protocol buffers. Hardware TRNG and secure boot satisfy IEC 62443 cybersecurity baselines for connected industrial nodes.
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Motor Control and Drives
The MIMXRT1064CVJ5B is well suited for BLDC, PMSM, and stepper motor control thanks to its deterministic Cortex-M7 interrupt latency and hardware PWM support via FlexPWM timers plus eFlexPWM. Real-time field-oriented control (FOC) loops fit comfortably in the 1 MB SRAM with single-cycle access from TCM, while the 528 MHz headroom leaves bandwidth for EtherCAT/CANopen stack execution. Hardware AES plus secure boot protects proprietary motor-control firmware from cloning. The 196-LFBGA package exposes the full peripheral set while keeping board area small for integrated motor-drive PCBs.
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Point-of-Sale Terminal
Point-of-Sale (POS) terminals benefit from the MIMXRT1064CVJ5B's dual USB 2.0 OTG controllers, which natively support barcode scanner, PIN pad, and printer peripherals without external hubs. The Cortex-M7 core at 528 MHz executes EMV transaction stacks, TLS handshake, and LCD GUI refresh in real time. The 4 MB flash stores encrypted firmware images and payment-applet certificates; the 1 MB SRAM holds transaction buffers. Hardware AES-128/256 plus secure boot and TRNG align with PCI PTS 6.x requirements for payment terminals and reduce external crypto-chip BOM cost.
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Connected Appliance Controller
The MIMXRT1064CVJ5B fits connected white-goods controllers because it combines real-time Cortex-M7 control for motor/valve sequencing with Wi-Fi/Bluetooth host capability via USB or UART to a wireless module. The 1 MB SRAM holds TLS session state, sensor fusion buffers, and user-interface state without external DRAM, lowering BOM cost. Hardware AES and TRNG protect OTA update integrity and pairing credentials. Three FlexCAN interfaces connect to inverter, sensor, and user-interface boards; dual Ethernet supports wired backhaul in commercial appliances.
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Audio Subsystem / Smart Speaker
The MIMXRT1064CVJ5B drives smart-speaker and audio-subsystem designs thanks to its Cortex-M7 DSP extensions and SAI/I2S ports that interface directly to audio codecs. The 528 MHz performance runs multi-microphone beamforming, AEC, and keyword-spotting models locally, offloading the cloud link. Hardware AES plus secure boot protects proprietary wake-word models and DRM keys. The 4 MB flash holds acoustic models and audio DSP code; the 1 MB SRAM buffers beamforming frames without external memory. Dual USB and Ethernet simplify wired/wireless streaming integration.
추천
추천 제품 요약
엔지니어링 참조 데이터: MIMXRT1064CVJ5B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MIMXRT1064CVL5B | MIMXRT1064DVL6A | MIMXRT1064CVJ5A | MIMXRT1062CVJ5B | MIMXRT1051DVL6A |
|---|---|---|---|---|---|---|
| Package | 196-LFBGA (12x12 mm) | 196-LFBGA (12x12 mm) - same | 196-LFBGA (12x12 mm) - same | 196-LFBGA (12x12 mm) - same | 196-LFBGA (12x12 mm) - same | 196-LFBGA (12x12 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | Cortex-M7 | Cortex-M7 | Cortex-M7 | Cortex-M7 | Cortex-M7 | Cortex-M7 |
| Max Frequency | 528 MHz | 528 MHz | 600 MHz | 528 MHz | 528 MHz | 528 MHz |
| Ethernet | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 1x 10/100 |
| USB OTG with PHY | 2x | 2x | 2x | 2x | 2x | 2x |
| Display / Camera | Parallel LCD + MIPI-DSI / MIPI-CSI + Parallel CSI | Same as RT1064 | Same as RT1064 | Same as RT1064 | No display/camera | Parallel LCD only / no MIPI-CSI |
주요 차별점
- Highest integrated flash density in RT1060 family at 528 MHz industrial temp grade (vs MIMXRT1051DVL6A)
- Includes display and camera pipeline (vs MIMXRT1062CVJ5B)
- Industrial-grade operating temperature window (vs MIMXRT1064DVL6A)
설계 노트
The 196-LFBGA 12x12 mm package has 0.8 mm ball pitch and requires NSMD (non-solder-mask-defined) landing pads with via-in-pad or dog-bone fanout. Use at least 4 layers with a continuous ground plane beneath the BGA to provide both thermal dissipation and a low-impedance return path for the high-speed MIPI-CSI/DSI and RMII signals. Decouple each VDD rail with a 100 nF X7R plus 4.7 uF ceramic placed within 2 mm of the ball; add a 10 uF bulk per power domain per the NXP hardware developer guide.
Estimated: at industrial ambient 85 C, the RT1064 at 528 MHz with full peripheral activity draws approximately 350-450 mA from the 3.3 V core/memory rail (1.15-1.5 W). The 196-LFBGA has a theta_JA of roughly 25 C/W on a JEDEC 4-layer test board; without extra copper or airflow, junction temperature can rise 30-40 C above ambient. For sealed industrial enclosures, design at least 1 square inch of top-side copper connected to the central ground balls and consider a 10x10 mm thermal pad beneath the BGA to keep Tj below 105 C at industrial maximums.
Do not skip boot-mode configuration: the RT1064 samples BOOT_CFG pins at reset and falls back to a recovery mode if no valid image is found in the selected source, which often looks like a bricked board. Configure the BOOT_CFG pull resistors per NXP reference manual before first power-up. Also enable the internal DCDC before relying on low-power modes; leaving the on-chip regulators in their default state wastes 30-50 mA and prevents deep-sleep currents from dropping below the documented 15 uA target.
Route the 50 MHz RMII and 125 MHz Ethernet clocks as length-matched differential pairs with 50 ohm single-ended or 100 ohm differential impedance and keep them isolated from switching DC-DC nodes by at least 3W. The MIPI-CSI/DSI lanes must be 100 ohm differential, length-matched within 150 mil, and routed over a continuous reference ground. If you place an external SDRAM (which the RT1064 does not strictly require for 1 MB SRAM designs but may need for larger framebuffers), match the SDRAM clock, address, and command traces within 50 ps.
규정 준수 정보
RoHS and REACH compliant per NXP product page. Industrial temperature grade -40C to +105C; not AEC-Q100 automotive qualified (use MIMXRT1064CVJ5A-Q1 or similar Q1 suffix parts for automotive). Lead-free reflow profile per JEDEC J-STD-020 MSL-3.
