MIMXRT1064CVL5B - i.MX RT1064 Crossover MCU 600MHz | NXP
부품 번호: MIMXRT1064CVL5B ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.85 | $11.85 |
| 10 | $10.67 | $106.70 |
| 100 | $9.49 | $949.00 |
| 500 | $8.55 | $4,275.00 |
| 1,000 | $7.62 | $7,620.00 |
| 3,000 | $6.78 | $20,340.00 |
MIMXRT1064CVL5B 개요
A crossover MCU is a class of embedded processor that bridges the gap between traditional microcontrollers (deterministic, low-power, easy-to-use) and application processors (high performance, rich peripherals). By integrating a Cortex-M7 core with tightly coupled memory, large SRAM, and high-speed peripherals like USB 2.0 with PHY, the i.MX RT1064 lets designers run graphical user interfaces, audio pipelines, and edge inference workloads on a single chip without an external Linux MPU.
Key features of the MIMXRT1064CVL5B include the 600 MHz Cortex-M7 with single-precision and double-precision FPU, 4 MB Flash, 1 MB SRAM, a dedicated 2D graphics accelerator (PxP), an LCDIF display controller supporting up to WXGA resolution, two USB 2.0 controllers (one with integrated HS PHY), two 12-bit ADC modules totaling 20 channels, FlexIO for flexible serial emulation, and a comprehensive security subsystem including High Assurance Boot and on-the-fly AES decryption (OTFAD). The 196-MAPBGA package provides sufficient I/O for demanding industrial designs while fitting within a 10x10 mm footprint.
Architecturally, the RT1064 leverages NXP's advanced 40 nm low-power process and a sophisticated bus matrix that allows concurrent DMA-driven data movement between peripherals and SRAM, leaving the Cortex-M7 core free for application logic. The integrated LCDIF and PxP blocks offload display composition, allowing the core to focus on real-time control loops.
Typical applications include industrial human-machine interfaces (HMIs), building automation control panels, point-of-sale terminals, edge IoT gateways with on-screen visualization, USB-equipped audio devices, and low-latency motor control with integrated display feedback. The wide temperature range and AEC-Q100-style qualification flow also make the part attractive in non-automotive industrial segments.
When designing with this device, pay close attention to PCB layout: the 0.65 mm pitch MAPBGA requires microvia stack-ups and matched-length routing for the DDR-style memory interfaces. Confirm that your selected power management IC can deliver the dynamic load currents demanded by the Cortex-M7 at full speed.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the i.MX RT family, and practical PCB-layout and thermal design notes that go beyond what the datasheet alone provides.
드롭인 대체품: MIMXRT1064CVL5B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MIMXRT1064CVL5B (동일 폼 팩터 및 풋프린트) — 차이점: Package, Camera Interface, Ethernet, Operating Temperature Range, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MIMXRT1064CVL5A
✅ 드롭인✓ 재고 있음
$6.1 / 개
데이터시트 보기 →MIMXRT1064DVL6A
✅ 드롭인✓ 재고 있음
$9.3 / 개
데이터시트 보기 →MIMXRT1064CVL5B
✅ 드롭인✓ 재고 있음
$6.78 / 개
데이터시트 보기 →MIMXRT1064CVL5B 최대 정격 & 전기적 특성
| Core Architecture | Arm Cortex-M7 with FPU (single + double precision) |
| Maximum Core Frequency | 600 MHz |
| On-chip Flash | 4 MB |
| On-chip SRAM | 1 MB |
| Operating Voltage Range | 3 V to 3.6 V |
| 패키지 | 196-ball MAPBGA (10x10 mm, 0.65 mm pitch) |
| 동작 온도 범위 | -40 C to +105 C |
| USB Controllers | 2x USB 2.0 (one with integrated HS PHY) |
| ADC | 2x 12-bit, 20 channels total |
| Display Controller | LCDIF up to WXGA resolution |
| 2D Graphics Accelerator | PxP engine |
| FlexIO | Yes (flexible serial emulation) |
| Security Features | High Assurance Boot, OTFAD AES decryption, TRNG, Secure JTAG |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Family | i.MX RT1064 Crossover MCU |
MIMXRT1064CVL5B 196-ball mapbga (10x10 mm, 0.65 mm pitch) 핀 구성 가이드
MIMXRT1064CVL5B(196-ball mapbga (10x10 mm, 0.65 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MIMXRT1064CVL5B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MIMXRT1064CVL5B 적합 용도: 6 애플리케이션s: Industrial Human-Machine Interface (HMI), USB Audio Interface / DAC, Edge IoT Gateway with Display, Point-of-Sale (POS) Terminal, Building Automation Controller, Motor Control with Display Feedback.
Industrial Human-Machine Interface (HMI)
The MIMXRT1064CVL5B is ideal for industrial HMI panels because its integrated LCDIF controller supports WXGA (1366x768) resolution directly, while the PxP 2D accelerator offloads alpha blending and color space conversion from the Cortex-M7 core. With 600 MHz of CPU headroom, designers can run LVGL or emWin graphics stacks on top of FreeRTOS without an external MPU, and the 1 MB SRAM provides enough framebuffer space for partial-update schemes that minimize display-tearing artifacts. The 196-MAPBGA 10x10 mm package keeps the SoM footprint compact for 3.5-inch to 7-inch panel designs.
추천
USB Audio Interface / DAC
The MIMXRT1064CVL5B's integrated USB 2.0 High-Speed PHY with on-chip transceiver eliminates the need for an external ULPI PHY, reducing BOM cost and PCB area in USB audio interfaces. The 600 MHz Cortex-M7 has ample processing budget for USB isochronous streaming at 24-bit/96 kHz plus DSP effects (EQ, reverb, crossover). 1 MB of SRAM can buffer multiple audio frames, while the SAI/I2S interfaces connect directly to high-performance DACs. The MAPBGA 10x10 mm package fits inside compact USB-C dongle form factors with proper thermal copper.
추천
Edge IoT Gateway with Display
Edge IoT gateways benefit from the MIMXRT1064CVL5B's combination of Cortex-M7 real-time determinism and application-processor multimedia throughput. The 4 MB Flash stores TLS certificates, MQTT brokers, and local UI assets, while the 1 MB SRAM handles TLS record buffers and JSON message parsing. The integrated USB HS PHY enables direct cellular modem attachment, the FlexIO can emulate UART/SPI/I2C for legacy sensor buses, and the LCDIF drives a local status display. The industrial -40C to +105C range supports outdoor enclosures.
추천
Point-of-Sale (POS) Terminal
POS terminals require a touchscreen-capable processor with reliable USB peripherals, secure boot, and compact PCB area - all delivered by the MIMXRT1064CVL5B. The integrated LCDIF supports capacitive touch panel interfaces, the two USB 2.0 controllers host barcode scanners and receipt printers simultaneously, and HAB/OTFAD secure boot prevents firmware tampering. The 4 MB Flash accommodates payment application code with room for OTA update staging, while the Cortex-M7's deterministic response keeps card-reader latency consistent.
추천
Building Automation Controller
Building automation controllers consolidate HVAC, lighting, and security subsystems on a single display-equipped panel. The MIMXRT1064CVL5B's 20-channel 12-bit ADC reads multiple analog sensors (temperature, humidity, light), the FlexIO expands digital I/O count beyond native pins, and the LCDIF drives the wall-mounted touchscreen. The -40C to +105C industrial range covers unheated equipment rooms, while the security subsystem (HAB, OTFAD, TRNG) protects building network credentials.
추천
Motor Control with Display Feedback
Servo and stepper motor drives benefit from the MIMXRT1064CVL5B's combination of deterministic Cortex-M7 control loops and integrated LCDIF for operator feedback. The two 12-bit ADCs sample motor phase currents simultaneously at high rate, the FlexPWMs generate center-aligned switching waveforms, and the LCDIF displays real-time torque/speed plots without an external controller. The 4 MB Flash stores multi-axis trajectory tables for pick-and-place machines and CNC spindles.
추천
추천 제품 요약
엔지니어링 참조 데이터: MIMXRT1064CVL5B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MIMXRT1064CVL5A | MIMXRT1064DVL6A |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-MAPBGA (10x10 mm, 0.65 mm pitch) | 196-MAPBGA (10x10 mm) - same | 196-MAPBGA (10x10 mm) - same |
| Core Architecture | Arm Cortex-M7 @ 600 MHz | Arm Cortex-M7 @ 600 MHz | Arm Cortex-M7 @ 600 MHz |
| On-chip Flash | 4 MB | 4 MB | 4 MB |
| On-chip SRAM | 1 MB | 1 MB | 1 MB |
| USB HS PHY | Yes (integrated) | No (disabled) | Yes (integrated) |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Display Controller | LCDIF up to WXGA | LCDIF up to WXGA | LCDIF up to WXGA |
| RoHS Compliance | Yes | Yes | Yes |
주요 차별점
- Integrated USB 2.0 High-Speed PHY with on-chip transceiver (vs MIMXRT1064CVL5A)
- 4 MB Flash + 1 MB SRAM on-chip memory architecture (vs MIMXRT1064DVL6A)
- LCDIF + PxP integrated graphics subsystem (vs MIMXRT1061CVJ5A)
설계 노트
The 196-MAPBGA package uses a 0.65 mm ball pitch, which mandates a microvia-in-pad PCB process (typically laser-drilled microvias with 0.3 mm diameter). Use a 4-layer stack-up with a dedicated ground plane directly beneath the BGA to control impedance for the high-speed SEMC memory interface. Maintain matched trace lengths (within 50 mil) for SEMC data, address, and clock signals, and stitch the perimeter with a ground via fence every 200 mil to suppress EMI from the 600 MHz core switching.
The Cortex-M7 core can draw transient currents exceeding 200 mA during cache-fill bursts from external memory. Use a buck regulator featuring at least 1 A output rating with low-ESR ceramic output capacitors (e.g., 22 uF X7R 10 V) and place the regulator within 25 mm of the SoC's VDD_SOC pins. Decoupling requires 0.1 uF caps on every VDD pin plus four 4.7 uF bulk caps distributed around the BGA perimeter. Power-rail sequencing per the NXP datasheet must be respected to avoid latch-up.
Estimated: at full 600 MHz core speed with all peripherals active, the MIMXRT1064CVL5B can dissipate 0.8-1.2 W depending on peripheral usage. With a typical 196-MAPBGA theta_JA of 30 C/W on a 4-layer JEDEC board, junction-to-ambient temperature rise is approximately 25-35 C. For industrial -40 C to +105 C operation, ensure ambient temperature stays below 70-80 C. Add thermal relief copper pads under the BGA and stitch vias to inner ground planes to improve heat spreading.
Common pitfalls include: (1) attempting to use a 0.8 mm pitch PCB design with the 0.65 mm pitch BGA - this will not work; (2) ignoring the boot configuration pin (BOOT_MODE) strapping resistors, which can leave the part unresponsive after reset; (3) failing to configure the DCDC vs LDO power mode per the PMIC companion IC, leading to brown-out during deep-sleep wake; (4) over-driving LCD data lines without source-termination, causing reflections on WXGA panels.
규정 준수 정보
RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified - this is an industrial-grade part. Lead-free reflow compatible per JEDEC J-STD-020.
