MPC536CZP40 - 32-Bit PowerPC MCU 1MB Flash 40MHz | NXP
부품 번호: MPC536CZP40 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 100 | $64.5 | $6,450.00 |
| 500 | $58.2 | $29,100.00 |
| 1,000 | $52.1 | $52,100.00 |
MPC536CZP40 개요
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program and data memory, and a programmable peripheral set on a single silicon die, enabling standalone embedded control without external memory or logic. The PowerPC MPC5xx architecture is a 32-bit Book-E enhanced RISC core originally developed by Freescale (now part of NXP) for safety-critical and high-reliability embedded systems, and it occupies the automotive microcontroller tier of the broader power management / embedded controller category hierarchy.
Key features include 1 MB embedded FLASH for application code, 40 MHz CPU clock with an internal bus architecture optimized for deterministic interrupt latency, on-chip codec hardware for code compression to maximize effective FLASH density, and a 388-ball PBGA package providing the high I/O count needed to expose multiple CAN, SPI, SCI, and timer channels. The device also includes hardware debug support and boundary-scan features for production test.
The MPC5xx architecture is engineered around a uniform memory map with multiple time-protected peripheral modules, making it well-suited to ASIL-classified automotive applications. The integrated codec unit reduces the FLASH footprint required for typical powertrain code, while the 388-pin BGA exposes enough I/O to drive multiple sensor and actuator channels without external glue logic.
Typical applications include automotive engine management units (ECM/ECU), transmission control modules (TCM), body control modules (BCM), industrial servo drives, and other real-time embedded platforms requiring a deterministic 32-bit core with high on-chip memory density. The wide peripheral set and automotive-grade process make it equally suitable for off-highway vehicle controllers and aerospace-grade auxiliary controllers.
When designing with this device, plan the PCB layout carefully for the 27x27 mm BGA - the device requires at least six PCB layers and microvia technology for reliable assembly. Ensure firmware initialization matches the codec unit configuration if compressed images are stored in FLASH, and verify the operating-temperature profile against the AEC-Q100 grade specified on the lot.
This page synthesizes distributor stock, parametric specifications, and package information for engineers evaluating the MPC536CZP40 for new designs or service replacements on existing MPC5xx platforms.
드롭인 대체품: MPC536CZP40 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC536CZP40 (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Core Architecture, Number of I/O, Operating Temperature, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC535CZP40
✅ 드롭인✓ 재고 있음
$24.5 / 개
데이터시트 보기 →MPC534CZP40
✅ 드롭인✓ 재고 있음
$21.1 / 개
데이터시트 보기 →MPC533CZP40
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC555LFMZP40
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →MPC536CZP40 최대 정격 & 전기적 특성
| Core Architecture | PowerPC MPC5xx (32-bit Book-E) |
| CPU Clock Frequency | 40 MHz |
| Program Memory (FLASH) | 1 MB (1M x 8) |
| 패키지 | 388-PBGA (27 x 27 mm) |
| On-chip Codec | Yes (FLASH code compression/decompression) |
| Bit Width | 32-bit |
| 동작 온도 범위 | -40C to +85C (industrial) / -40C to +125C (automotive grade) |
| 실장 유형 | Surface Mount (BGA) |
| Communication Interfaces | CAN, SPI, SCI (UART), typical MPC5xx peripheral set |
| Debug Interface | BDM / JTAG (MPC5xx standard) |
| RoHS 상태 | Compliant (per NXP/Freescale product family policy) |
| Lead-Free | Yes |
MPC536CZP40 388-pbga (27 x 27 mm) 핀 구성 가이드
MPC536CZP40(388-pbga (27 x 27 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC536CZP40.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC536CZP40 적합 용도: 6 애플리케이션s: Automotive Engine Management Unit (ECM/ECU), Transmission Control Module (TCM), Body Control Module (BCM), Industrial Servo and Motion Controller, Off-Highway Vehicle Controller (Agricultural / Material Handling), Aerospace Auxiliary Controller.
Automotive Engine Management Unit (ECM/ECU)
The MPC536CZP40's 32-bit PowerPC core at 40 MHz and 1 MB integrated FLASH make it a strong fit for engine management units where deterministic real-time control of fuel injection, ignition timing, and emissions is mandatory. The on-chip code-compression codec effectively enlarges the usable FLASH capacity, allowing the large calibration tables typical of powertrain code to fit alongside the application image. The 388-pin PBGA exposes enough I/O for multiple analog sensor inputs, CAN channels for OBD-II and chassis network connectivity, and SPI-driven actuator drivers. AEC-Q100 temperature grade (-40C to +125C) supports under-hood mounting. The MPC5xx architecture's deterministic interrupt latency is essential for crank-angle-synchronized control loops.
추천
Transmission Control Module (TCM)
The MPC536CZP40 serves as the central controller in automatic transmission control modules where multiple gear-position sensor inputs, solenoid driver outputs, and CAN communication to the engine ECU must be processed in deterministic time slices. The 40 MHz PowerPC core delivers the throughput required for shift-scheduling algorithms, while 1 MB FLASH with codec compression holds the gear-map calibration data. Hardware timers on the MPC5xx peripheral set support precise shift-event sequencing. The 388-BGA package allows routing of dedicated analog channels for line-pressure and temperature feedback without external multiplexing. Automotive temperature range and long-term NXP supply make the part appropriate for TCM production programs.
추천
Body Control Module (BCM)
The MPC536CZP40 is suitable for body control modules managing lighting, door, mirror, wiper, and HVAC subsystems in automotive electrical architectures. The MPC5xx peripheral mix provides the multiple timer-capture channels, PWM outputs, and LIN/CAN interfaces needed for body-domain communication. The 388-pin BGA is well matched to BCMs with high pin counts and supports both low-side and high-side driver control. The integrated codec unit keeps the BCM application image compact, allowing room for OEM-specific calibration. NXP long-term supply and automotive temperature grade suit BCM programs with multi-decade production horizons.
추천
Industrial Servo and Motion Controller
The MPC536CZP40's deterministic interrupt response and 32-bit processing throughput fit industrial servo and motion-control platforms driving brushless DC or AC servo motors. The MPC5xx timer modules support PWM generation for three-phase inverter bridges and quadrature-encoder feedback capture for closed-loop velocity and position control. The 388-BGA package allows routing of analog current-sense amplifiers and digital Hall-effect inputs. The on-chip codec keeps large servo-loop tables in FLASH without sacrificing determinism. NXP's automotive-grade temperature range is overkill for cabinet-mounted industrial use but provides margin for harsh factory environments.
추천
Off-Highway Vehicle Controller (Agricultural / Material Handling)
The MPC536CZP40 fits off-highway vehicle controllers in tractors, forklifts, and construction equipment where vibration, dust, and wide temperature ranges are routine. AEC-Q100 temperature grade and a robust PBGA package withstand harsh under-hood mounting. The PowerPC MPC5xx core's deterministic interrupt handling is critical for joystick, hydrostatic, and CAN-J1939 communication tasks. The 1 MB FLASH with codec compression supports the larger application code typical of multi-function off-highway platforms. NXP long-term supply supports multi-year production programs common in agricultural equipment.
추천
Aerospace Auxiliary Controller
The MPC536CZP40 is used in auxiliary aerospace controllers for cabin systems, environmental control, and non-flight-critical subsystems where 32-bit deterministic control is required. The PowerPC Book-E core provides a well-documented instruction set traceable to safety-critical development flows. The 388-BGA package supports high pin counts for multiple sensor interfaces and ARINC-429 channels. The automotive temperature grade provides additional margin beyond typical avionics bay environments. Long-term NXP supply suits aerospace platforms with decades-long service lives and slow obsolescence planning cycles.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC536CZP40 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC535CZP40 | MPC534CZP40 | MPC533CZP40 | MPC555LFMZP40 |
|---|---|---|---|---|---|
| Package | 388-PBGA (27x27) | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC MPC5xx (32-bit, Book-E) | PowerPC MPC5xx (32-bit) | PowerPC MPC5xx (32-bit) | PowerPC MPC5xx (32-bit) | PowerPC MPC5xx (32-bit) |
| CPU Clock Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Operating Temperature Range | -40C to +125C (automotive) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Lifecycle Status | NRNDR (long-term supply) | NRNDR | NRNDR | NRNDR | Active (limited) |
주요 차별점
- On-chip FLASH code compression codec (vs MPC555LFMZP40)
- 1 MB FLASH density at 40 MHz in 388-PBGA (vs MPC533CZP40)
- Same-footprint migration across MPC5xx family (vs MPC534CZP40)
설계 노트
The 388-pin PBGA at 27 x 27 mm requires a multilayer PCB with microvia (laser-drilled) stack-up for the inner-row ball escape. A minimum of six copper layers is recommended, with two outer signal layers, two inner power/ground planes, and at least two additional routing layers for BGA break-out. Use 1.0 mm pitch BGA land pattern and follow NXP's package mechanical drawing for pad diameter and solder-mask-defined (SMD) or non-solder-mask-defined (NSMD) pad choice. Plan BGA fan-out as a dog-bone pattern for trace escape and verify impedance control for high-speed signals.
Power dissipation in the MPC536CZP40 is dominated by CPU clock and peripheral activity. For automotive under-hood enclosures, calculate worst-case junction temperature using theta_JA from the NXP package drawing and ambient temperature ratings per AEC-Q100 Grade 1. Use thermal vias under the BGA thermal pad to sink heat to internal ground planes. Provide continuous copper pour on the top layer under the device to spread heat evenly. Derate by 25% if the application runs at sustained 40 MHz CPU activity without idle slots.
Do not assume the on-chip codec is always enabled. The codec unit must be configured by firmware at startup; a misconfigured codec will prevent the application image from executing because compressed FLASH blocks will not be decompressed correctly. Verify the codec control register settings against the NXP MPC536 reference initialization code, and ensure the boot sequence maps compressed code regions to the codec decode window. The BGA also requires X-ray inspection post-assembly to verify solder joint integrity - optical inspection alone is insufficient.
규정 준수 정보
RoHS and REACH compliance inferred from NXP/Freescale MPC5xx family policy as documented on distributor listings (DigiKey, Mouser). AEC-Q100 qualification is automotive-grade standard for the MPC5xx family. Halogen-free status not explicitly stated in the verified web data - set to unknown.