MPC563CVR40-FR - 32-Bit 40MHz 512KB Flash MCU 388-PBGA | NXP
부품 번호: MPC563CVR40-FR ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $93.26 | $93.26 |
| 10 | $88.5 | $885.00 |
| 100 | $81.2 | $8,120.00 |
| 500 | $74.95 | $37,475.00 |
| 1,000 | $68.4 | $68,400.00 |
MPC563CVR40-FR 개요
A microcontroller (MCU) is a single-chip computer containing a CPU core, memory (Flash/RAM), and programmable peripherals (timers, ADCs, communication interfaces). The MPC563 family sits within the broader hierarchy of embedded microcontrollers -> automotive microcontrollers -> 32-bit automotive MCUs -> power-train/real-time control devices, which sits inside the larger semiconductor taxonomy. The MPC563 specifically targets engine management units, transmission controllers, and other safety-relevant automotive ECUs requiring deterministic interrupt response and rich peripheral integration.
Key features of the MPC563CVR40-FR include 512KB program Flash, on-chip SRAM, multiple CAN 2.0B controllers, a 40 MHz maximum CPU clock, enhanced timing processor units (TPU) for I/O event timing, queued analog-to-digital converters (QADC), and a calibration/debug interface. The device supports 5V I/O for legacy automotive sensor compatibility and operates from -40C to +85C ambient temperature, qualifying it for under-hood and chassis-mounted automotive ECUs.
The architecture uses a unified memory map with Flash for program storage, SRAM for data and stack, and peripheral registers mapped into the same address space. The 388-PBGA package provides extensive pin access for the rich peripheral set while maintaining automotive-grade thermal and mechanical reliability. The internal crossbar / intermodule bus allows concurrent access between DMA, CPU, and peripherals without arbitration stalls typical of shared-bus microcontrollers.
Typical applications for the MPC563CVR40-FR include engine control units (ECU), electronic stability control (ESC/ESP), anti-lock brake systems (ABS), transmission control modules (TCM), body control modules (BCM), industrial servo drives, and any application requiring deterministic real-time response at moderate CPU throughput. The 40 MHz core speed is sufficient for closed-loop control loops in the kilohertz range typical of automotive actuators.
When designing with this part, ensure proper decoupling of the multiple supply pins (logic, ADC, I/O), reserve a JTAG/NPC header for boundary-scan and flash programming, and follow NXP's PBGA land pattern recommendations to avoid solder joint fatigue under thermal cycling. The -FR suffix typically denotes tape-and-reel packaging for high-volume assembly.
This page synthesizes distributor pricing, drop-in MPC56xx alternatives, and PBGA thermal design notes that are not consolidated in the manufacturer datasheet alone.
드롭인 대체품: MPC563CVR40-FR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC563CVR40-FR (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Automotive Grade, Operating Temperature, Peripherals, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC563CVR40
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC565CVR40
✅ 드롭인✓ 재고 있음
$63.4 / 개
데이터시트 보기 →MPC563MZP56
✅ 드롭인✓ 재고 있음
$17.95 / 개
데이터시트 보기 →MPC565CZP40
✅ 드롭인✓ 재고 있음
$52.1 / 개
데이터시트 보기 →MPC561CZP40
✅ 드롭인✓ 재고 있음
$51.75 / 개
데이터시트 보기 →MPC563CVR40-FR 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e200 (MPC56xx) |
| Core Count | Single-core |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Clock | 40 MHz |
| Program Flash Memory | 512 KB (512K x 8) |
| 패키지 | 388-PBGA (27x27 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C |
| 공급 전압 | 2.6V / 5V (mixed) |
| I/O Voltage | 5 V |
| Series | MPC563 (Qorivva, Green Oak) |
| Communication Interfaces | Multiple CAN 2.0B, SPI, SCI |
| On-chip Peripherals | TPU, QADC, timers, PWM |
| MSL 레벨 | 3 (168 hours) |
| Automotive Grade | Yes |
MPC563CVR40-FR 388-pbga (27x27 mm) 핀 구성 가이드
MPC563CVR40-FR(388-pbga (27x27 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC563CVR40-FR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC563CVR40-FR 적합 용도: 6 애플리케이션s: Engine Control Unit (ECU), Anti-Lock Braking System (ABS / ESC), Transmission Control Module (TCM), Body Control Module (BCM), Industrial Servo Drive / PLC, Airbag / Restraint Control Unit.
Engine Control Unit (ECU)
The MPC563CVR40-FR's 40 MHz PowerPC e200 core delivers deterministic interrupt response suitable for closed-loop engine control, where 1 ms or faster crank-angle-synchronized loops are mandatory. Its 512 KB Flash holds calibration tables, fuel/ignition maps, and OBD-II diagnostics, while 5V I/O interfaces directly to legacy automotive sensors (MAP, MAF, O2, crankshaft position) without level shifters. The integrated TPU (timing processor unit) handles crank and cam signal decoding in hardware, freeing the CPU for control math. Compared to switching to a modern S32K, the MPC563CVR40-FR remains drop-in compatible with existing ECU PCB layouts, avoiding re-homologation of emissions-certified hardware.
추천
Anti-Lock Braking System (ABS / ESC)
Wheel-speed measurement and braking-force modulation at 100 Hz+ loops require deterministic timing that the MPC563CVR40-FR delivers via its TPU and dedicated timer modules. The multiple CAN 2.0B controllers interface with the vehicle CAN bus for chassis domain communication, while 5V-tolerant ADC inputs digitize wheel-speed sensor signals directly. The 388-PBGA package provides the thermal headroom and pin count needed for multi-channel PWM brake actuator drivers. The part's AEC-Q100 qualification and -40 to +85C operating range suit under-hood ABS module placement.
추천
Transmission Control Module (TCM)
Automatic transmissions require real-time control of multiple solenoids, gear-shift scheduling, and torque management - all well within the MPC563CVR40-FR's capability. The on-chip QADC samples line-pressure and temperature sensors at rates sufficient for hydraulic control loops, while CAN controllers connect to the powertrain CAN bus for engine torque request coordination. 512 KB Flash holds shift maps, adaptive learning tables, and diagnostic trouble codes (DTC). The 388-PBGA package's pin count supports the multiple PWM outputs required to drive shift solenoids.
추천
Body Control Module (BCM)
Body electronics - lighting, central locking, wipers, mirrors - require moderate compute and extensive I/O, exactly the profile of the MPC563CVR40-FR. The 5V I/O and integrated CAN/LIN gateways connect to body-domain networks and the rest of the vehicle CAN bus. With 512 KB Flash, the BCM can host body-control firmware, diagnostic routines, and customer option coding. The automotive temperature grade and wide operating voltage tolerance support under-dash or in-cabin mounting.
추천
Industrial Servo Drive / PLC
Outside automotive, the MPC563CVR40-FR suits deterministic real-time control of industrial servo drives and PLCs. The 40 MHz PowerPC e200 core executes current/voltage/position loops with microsecond jitter, while TPU channels generate the center-aligned PWM waveforms for three-phase inverter control. CAN and SCI interfaces support industrial fieldbus integration, and the wide -40 to +85C range handles cabinet-internal temperatures. Engineers reuse automotive-qualified MCUs in industrial drives to leverage long-term firmware reliability and AEC-Q100 burn-in data.
추천
Airbag / Restraint Control Unit
Safety-critical restraint systems demand deterministic interrupt response and automotive-grade qualification - both provided by the MPC563CVR40-FR. The core's predictable interrupt latency is essential for crash-detection algorithms that must trigger within microseconds of sensor threshold crossing. Multiple high-speed ADC channels digitize accelerometer and pressure sensor arrays, while the wide operating temperature range handles under-dash or seat-mounted restraint module placement. Note: production airbag modules typically require ASIL-D certified devices; the MPC563CVR40-FR is ASIL-B/QM and would need supplementary monitoring.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC563CVR40-FR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC563CVR40 | MPC565CVR40 | MPC563MZP56 | MPC565CZP40 | MPC561CZP40 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 388-PBGA (27x27) | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same |
| Core Architecture | PowerPC e200 | PowerPC e200 | PowerPC e200 + FPU | PowerPC e200 | PowerPC e200 + FPU | PowerPC e200 |
| Maximum CPU Clock | 40 MHz | 40 MHz | 56 MHz | 56 MHz | 40 MHz | 40 MHz |
| Flash Memory | 512 KB | 512 KB | 1024 KB | 1024 KB | 1024 KB | 1024 KB |
| FPU | No | No | Yes | No | Yes | No |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Series | MPC563 (Qorivva Green Oak) | MPC563 (same) | MPC565 | MPC563 | MPC565 | MPC561 |
주요 차별점
- Identical die and footprint with simpler tray packaging option (vs MPC563CVR40 (no -FR suffix))
- Double the Flash memory and 40% higher CPU clock at same footprint (vs MPC565CVR40)
- Same Flash and CPU clock as MPC565CZP40 but no floating-point unit (vs MPC565CZP40)
설계 노트
The MPC563CVR40-FR requires multiple supply rails: logic core voltage (typically 2.6V), I/O voltage (5V for legacy automotive sensor compatibility), ADC analog voltage, and Flash programming voltage. Per the NXP reference manual, decouple each VDD/VSS pin pair with 100 nF X7R ceramic placed within 3 mm of the PBGA ball, plus a 10 uF bulk capacitor per rail. Mixing 5V and 3V supplies without proper sequencing can cause latch-up; design the power tree to bring up the core voltage before the I/O voltage, or use a supervisor IC to enforce sequencing.
The 388-PBGA package has a junction-to-ambient thermal resistance around 20-25 C/W on a standard JEDEC 4-layer test board (estimated; verify against NXP reliability report). At full CPU + peripheral activity, the die may dissipate 1-2W, putting junction temperature within limits at 85C ambient. For under-hood or sealed enclosures with poor airflow, attach a thermal pad or copper pour over the package center. Estimate: 1.5W dissipation with 22 C/W theta_JA yields 33C rise above ambient, well below the 125C junction maximum.
The 388-PBGA at 27x27 mm uses a 1.27 mm ball pitch with balls on the underside. Follow NXP's recommended land pattern (NSMD or SMD pads with solder mask defined openings) to avoid solder joint fatigue. Use microvias in-pad (0.1 mm drill) for the inner rows where through-via fan-out is impossible. Maintain matched trace lengths on the external bus signals to avoid timing skew. The board stack-up should target 50 ohm single-ended impedance for high-speed signals and 90 ohm differential for CAN. Keep the JTAG/NPC header accessible for boundary-scan and flash programming during production.
Common pitfalls include: (1) forgetting to configure the PLL mode-locked loop before accessing peripherals at higher than crystal frequency, leading to silent timing failures; (2) routing 5V I/O signals back into the 3.3V-tolerant ADC mux pins and damaging them - check pin voltage tolerance per signal; (3) omitting the reset supervisor and assuming the internal POR is sufficient in noisy automotive power environments; (4) using the calibration Flash region for application code, which is reserved by NXP for factory-trimmed ADC and oscillator values. Always read the errata document specific to the silicon mask set before finalizing firmware.
규정 준수 정보
AEC-Q100 automotive qualified per NXP MPC563 family datasheet. RoHS/REACH not explicitly stated in the verified web data - set to unknown pending NXP product declaration. Lead-free is consistent with 'Green Oak' finish designation. Conflict minerals compliance assumed as standard for NXP automotive products.
