MPC7410RX500LE - 500MHz PowerPC G4 MPU, 360-CBGA | NXP
부품 번호: MPC7410RX500LE ✗ 단종MPC7410RX500LE 개요
A PowerPC G4 microprocessor is a superscalar RISC CPU that combines a 32-bit PowerPC core with an AltiVec/VMX vector processing unit capable of issuing up to four instructions per cycle. PowerPC G4 belongs to the broader RISC microprocessor category within embedded CPUs, sitting in the hierarchy as: microprocessor -> RISC MPU -> PowerPC -> PowerPC G4 (32-bit). The architecture delivers high per-clock performance for integer, floating-point, and SIMD workloads, which is why the MPC7410 family remains a drop-in choice for long-life-cycle industrial, aerospace, and defense programs that originally qualified PowerPC silicon.
Key features include a 64-bit backside L1/L2 cache interface, dedicated L1 instruction and data caches of 32 KB each, a 2 MB on-chip L2 cache with programmable way-locking, and a full PowerPC 60x/MPX system bus. The device supports multiprocessing via an external address-multiplexed bus, hardware table-walk, and dynamic power management with low-power and nap modes. On-chip debug is provided through BDM/JTAG-compatible JTAG signals over dedicated test pins.
The MPC7410RX500LE is fabricated on a 0.18 micrometer CMOS process with copper interconnect, a substantial thermal interface that demands a heatsink in most operating points above 0.5 W, and a 360-ball CBGA package whose ceramic body supplies the mechanical robustness and thermal conductivity needed for industrial temperature screening. The core voltage rail is supplied through dedicated VDD balls while the I/O pad ring is powered from a separate rail with independent sequencing requirements.
Typical applications include industrial control SBCs and VME/cPCI boards, military/aerospace embedded computing, telecom base-station channel cards, and legacy Apple Power Mac G4 service replacements. The wide operating temperature envelope and the longevity of the PowerPC instruction set make this part a long-life component for retrofit and support contracts.
Designers should note that production is end-of-life and current inventory is limited to last-time-buy and broker channels. Pin-compatible MPC7410 variants (HX and RX suffixes) at different speed grades share the same 360-CBGA land pattern, while alternative vendors such as e2v (now Teledyne e2v) resell the same silicon under different prefixes for aerospace customers.
This page synthesizes distributor live stock, drop-in replacement candidates, parametric comparison, and design notes that consolidate data not available from a single source.
드롭인 대체품: MPC7410RX500LE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC7410RX500LE (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Mounting Type, Package.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MPC7410RX500LE 최대 정격 & 전기적 특성
| Core Architecture | PowerPC G4 |
| Core Processor | MPC74xx |
| Number of Cores / Bus Width | 1 Core, 32-bit |
| Speed | 500 MHz |
| Co-Processors / DSP | None |
| RAM Controllers | None |
| Graphics Acceleration | No |
| Display & Interface Controllers | None |
| Ethernet | None |
| SATA | None |
| USB | None |
| 패키지 | 360-CBGA (25x25 mm) |
| Number of Terminals | 360 |
| Terminal Form | Ball |
| Package Code | HBGA |
| Package Shape | Square |
| 실장 유형 | Surface Mount |
MPC7410RX500LE square 핀 구성 가이드
MPC7410RX500LE(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC7410RX500LE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC7410RX500LE 적합 용도: 6 애플리케이션s: Industrial VME/cPCI Single-Board Computer, Military and Aerospace Embedded Computing, Telecom Base Station Channel Card, Legacy Apple Power Mac G4 Service Replacement, Medical Imaging Front-End Processor, High-Performance Industrial Automation Controller.
Industrial VME/cPCI Single-Board Computer
The MPC7410RX500LE's 500 MHz PowerPC G4 core, 32 KB L1 instruction/data caches, and 2 MB L2 cache give a VME or cPCI SBC enough compute for deterministic control loops and legacy aerospace software stacks. Designers typically pair the part with a companion bridge such as the MPC107 PCI host bridge for PMC site expansion and run VxWorks or LynxOS on top. The 360-CBGA package tolerates the higher ambient seen in chassis-mounted boards when paired with a clip-on heatsink, making this drop-in choice attractive for long-life defense programs. Compared with newer ARM Cortex parts, the MPC7410RX500LE retains software compatibility with legacy PowerPC binaries already deployed for years.
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Military and Aerospace Embedded Computing
The MPC7410RX500LE's CBGA package, extended temperature screening typical of the RX suffix, and the long-term stability of the PowerPC instruction set make it well matched to military and aerospace retrofit programs that must run the same binary for decades. Typical mission profiles deploy the part in flight-control adjunct processors, signal preprocessing modules, and ruggedized mission computers where MIL-STD-810 thermal and vibration conformance are non-negotiable. The 360-CBGA ceramic body withstands thermal cycling better than plastic BGAs, supporting fielded lifetimes of 15+ years. The same PowerPC G4 core remains in production through the e2v/Teledyne channel for new aerospace designs, easing the obsolescence path.
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Telecom Base Station Channel Card
In legacy WCDMA and early LTE channel cards, the MPC7410RX500LE provides 500 MHz of single-core PowerPC G4 throughput for Layer 1 DSP pre/post-processing and control-plane packet handling. The 60x/MPX bus is shared with a companion ASIC or FPGA, and the AltiVec-class VMX unit accelerates I/Q sample manipulation such as FFT and Viterbi kernels used in soft-decision decoding. Power gating via the nap and sleep modes supported by the MPC7410 helps idle carriers save energy in dense rack enclosures. A clip-on heatsink plus forced-air cooling keeps the CBGA junction within the industrial temperature envelope during sustained VME backplane traffic.
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Legacy Apple Power Mac G4 Service Replacement
The MPC7410RX500LE is the original PowerPC G4 microprocessor used in the Apple Power Mac G4 (Digital Audio, Quicksilver, and early Mirrored Drive Door models), making it the first-choice service replacement for failed logic boards. The 360-CBGA socketed variant at 500 MHz matches the AGP/PCI Power Mac G4 daughter-card design and lets repair shops restore workstations without sourcing complete logic boards. Compatibility with Mac OS 9 and OS X 10.4 Tiger is verified for the 500 MHz speed grade. EOL status has made original pulls scarce, but the pin-compatible MPC7410HX500LE grade provides a cost-effective substitute on the same footprint for non-critical repairs.
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Medical Imaging Front-End Processor
Medical imaging front ends such as ultrasound beamformers and MRI receiver boards benefit from the deterministic latency of the MPC7410RX500LE PowerPC G4 pipeline, where real-time I/Q sample aggregation demands predictable cache and bus behavior. The 32 KB L1 instruction cache, 32 KB L1 data cache, and a sizable L2 provide plenty of headroom for processing stages like envelope detection and digital down-conversion before handing the data to a host DSP or FPGA. The 360-CBGA package's mechanical robustness supports the autoclave and conformal-coat processes used in medical equipment manufacturing. Designers pair the part with an MPC107 to expose PMC mezzanine sites for additional ADC boards.
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High-Performance Industrial Automation Controller
For high-end PLCs, motion controllers, and industrial printing systems, the MPC7410RX500LE's 500 MHz PowerPC G4 core runs real-time operating systems like VxWorks or Linux with sub-microsecond response for closed-loop PID control across hundreds of axes. The AltiVec-class VMX engine accelerates vector math common in kinematic transforms, while the bus architecture supports dual-processor configurations for redundancy. The 360-CBGA ceramic package tolerates the ambient temperatures inside unenclosed factory panels, and pairing the MPU with an MPC107 bridge enables deterministic PCI-based I/O expansion. Compared to newer SoCs, the MPC7410RX500LE provides unmatched long-term binary stability for installed automation lines.
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추천 제품 요약
엔지니어링 참조 데이터: MPC7410RX500LE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC7410HX500LE | MPC7410RX450LE | MPC7410HX450LE | MPC7410HX400LE | PCX7410MGU500LE |
|---|---|---|---|---|---|---|
| Package | 360-CBGA (25x25 mm) | 360-CBGA (25x25 mm) - same | 360-CBGA (25x25 mm) - same | 360-CBGA (25x25 mm) - same | 360-CBGA (25x25 mm) - same | 360-CBGA (25x25 mm) - same |
| Brand | NXP Semiconductors (formerly Motorola/Freescale) | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP/e2v (Teledyne) rebrand |
| Core Architecture | PowerPC G4 (32-bit) | PowerPC G4 (32-bit) - same | PowerPC G4 (32-bit) - same | PowerPC G4 (32-bit) - same | PowerPC G4 (32-bit) - same | PowerPC G4 (32-bit) - same |
| Speed | 500 MHz | 500 MHz | 450 MHz | 450 MHz | 400 MHz | 500 MHz |
| Temperature / Quality Grade | RX (extended temp / high reliability) | HX (industrial) | RX (extended) | HX (industrial) | HX (industrial) | Aerospace screening |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Limited (aerospace channel) |
| Core Count | 1 | 1 | 1 | 1 | 1 | 1 |
| Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
주요 차별점
- Highest speed grade in the MPC7410 family (vs MPC7410HX500LE)
- Aerospace-qualified silicon source through e2v/Teledyne channel (vs PCX7410MGU500LE)
- Extended temperature vs commercial temperature screening (vs MPC7410HX450LE)
설계 노트
The MPC7410RX500LE is housed in a 360-CBGA ceramic package whose thermal resistance is significantly higher than a plastic BGA equivalent. At 500 MHz under typical 2.0 V core supply and full activity, designers should mount the part on a heatsink with thermal interface material rated for the -40 C to +110 C operating envelope, plus adequate airflow. Estimate: with theta_JA in the range of 10-15 C/W (depends on board stack-up and heatsink), expect ~15-20 C/W thermal margin to be safe. Always clamp core voltage and disable PLLs before nap/sleep transitions.
Lay out the 360-CBGA ball pattern per the manufacturer's mechanical specification, using NSMD pads with microvia-in-pad for sub-1.0 mm pitch. Decouple the core VDD balls with 0.1 uF X7R ceramics placed within 50 mils of the ball, plus a few 10 uF bulk tantalum or polymer tantalum capacitors near the board edge. Keep the AVdd and GvdD power islands separated from the I/O ring, and connect the PLL supply VddPLL through a ferrite bead and an RC filter for low jitter. The CBGA land pattern recommends non-solder-mask-defined pads.
Do not assume the MPC7410RX500LE is drop-in compatible with MPC7400/MPC750 series processors; while they share the same 360-ball count and similar BGA package, the ball map and pin-out differ between the MPC7410 family and the older MPC740/750 families. Always validate against the manufacturer's Pin-Out document. Also, ensure the JTAG/BDM signals are accessible at the board edge for in-field debug, since the L2 way-locking features require configuration via JTAG before the first power-up.
규정 준수 정보
RoHS, REACH, lead-free, and halogen-free status were not provided in the verified web data for MPC7410RX500LE. The part is a ceramic CBGA from the early 2000s; engineers should request the latest manufacturer declaration letter before designing into a RoHS-restricted end product.
