MPC7410HX500LE - PowerPC G4 MPU 500MHz 360-CBGA | NXP
부품 번호: MPC7410HX500LE ✗ 단종MPC7410HX500LE 개요
In computing taxonomy the MPC7410HX500LE is a microprocessor (MPU), one tier above a microcontroller and a level below the broader processor family that encompasses PowerPC, ARM, and x86 architectures. As a Power Architecture device it retains binary compatibility with the established PowerPC instruction set while extending it through the AltiVec vector unit, which accelerates SIMD workloads used in DSP, multimedia, and network packet processing. The MPC7410HX500LE is targeted at host-style processing rather than embedded control, often paired with a northbridge such as the MPC107.
Key on-device characteristics include a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache, on-chip L2 cache controller, integrated thermal management with on-die temperature diode, and a system interface that can be configured for 60x or MPX bus operation. The part supports up to 2 Gbytes of addressable memory through the external bus and includes hardware MMU support for full virtual-memory operating systems such as VxWorks, Linux, and INTEGRITY.
Typical applications for the MPC7410HX500LE include networking infrastructure (echo-canceller basestations, IP routers, control-plane processors), long-life industrial and military systems where Power Architecture binaries are maintained, imaging and radar pre-processing that benefit from AltiVec SIMD, and secure communications appliances performing accelerated encryption. The wide SIMD throughput and proven software ecosystem make it a common choice for OEMs upgrading older PowerPC designs rather than rewriting code for new architectures.
When designing a board around this part, treat the 360-CBGA as a high-density flip-chip land pattern that demands 6-layer (or thicker) controlled-impedance stack-up with matched-length bus traces. The exposed die-to-package interface is sensitive to moisture and mechanical stress, so MSL-3 handling and a 1.8V core sequencing strategy relative to the 2.5V and 3.3V rails is recommended.
This page synthesizes Octopart live-distributor pricing, parametric drop-in alternatives to MPC74xx siblings and the e2v/Teledyne rad-hard variants, and design notes that go beyond the Freescale/NXP Hardware Specifications document.
드롭인 대체품: MPC7410HX500LE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC7410HX500LE (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Mounting Type, Package.
MPC7410RX500LE
✅ 드롭인가격 문의
데이터시트 보기 →MPC7410THX500LE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC7410THX500NE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC7447A
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC7448
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PC7410VG500LE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PC7410MG500LE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC7410HX500LE 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MPC7410HX500LE |
| Processor Family | PowerPC G4 (MPC74xx) |
| Core Architecture | Power Architecture with AltiVec SIMD |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit (with 64-bit extension) |
| 최대 클록 주파수 | 500 MHz |
| Instruction Set | 32-bit PowerPC with AltiVec 128-bit SIMD |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltages | 2.5 V and 3.3 V |
| Operating Temperature (TJ) | 0C to 105C |
| Maximum Junction Temperature | 105C |
| Process Technology | 0.18 micrometer CMOS |
| L1 Instruction Cache | 32 Kbyte |
| L1 Data Cache | 32 Kbyte |
| L2 Cache Controller | Yes (external SRAM) |
| 패키지 | 360-CBGA (FCCBGA, 25x25 mm) |
| 실장 유형 | Surface Mount (flip-chip BGA) |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| Tray Quantity | Tray packaging |
MPC7410HX500LE 360-cbga (fccbga, 25x25 mm) 핀 구성 가이드
MPC7410HX500LE(360-cbga (fccbga, 25x25 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC7410HX500LE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC7410HX500LE 적합 용도: 6 애플리케이션s: IP Router and Control-Plane Processor, Basestation Echo-Canceller DSP Front-End, Long-Life Industrial Controllers (VME/cPCI), Imaging and Radar Front-End Pre-Processing, Network Security Appliance (IPsec/SSL Acceleration), Military and Avionics Panel Computer.
IP Router and Control-Plane Processor
The MPC7410HX500LE fits IP router control planes because its AltiVec 128-bit SIMD engine accelerates packet-header lookup, ACL classification, and bulk IPsec bulk crypto at the 500 MHz core clock. The 32-Kbyte/32-Kbyte L1 split and external L2 controller sustain multi-queue forwarding tables without cache thrashing, while the MPC107 northbridge provides a 60x/MPX host bus to DDR memory and PCI peripherals. Compared with switching to ARM Cortex-A, the part preserves existing VxWorks and INTEGRITY BSPs for long-life telecom deployments.
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Basestation Echo-Canceller DSP Front-End
Echo cancellation and baseband pre-processing in 2G/3G basestations stress SIMD throughput, which is exactly the workload AltiVec was designed for. The MPC7410HX500LE's 128-bit vector ALU and double-precision FPU pair to cancel acoustic echo across 192 tap lengths per channel while keeping power dissipation low enough for cabinet cooling. PowerPC Linux with libspe2 streams vector jobs to AltiVec registers without an RTOS upgrade, preserving firmware investments across platform revs.
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Long-Life Industrial Controllers (VME/cPCI)
VMEbus and CompactPCI backplanes still host PowerPC SBCs for nuclear, railway, and military programs that demand 25-year field life. The MPC7410HX500LE's 105C junction rating, 1.8V core, and 360-CBGA industrial screening slot cleanly into the existing SBC reference designs without redesign. e2v/Teledyne's PC7410VG500LE MIL-PRF-38535 variant even allows the same land pattern to be transitioned into a fully rad-hard build when a project graduates to that requirement.
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Imaging and Radar Front-End Pre-Processing
Synthetic Aperture Radar (SAR) and medical imaging pre-processing benefit from PowerPC Altivec's 128-bit SIMD on integer and floating-point streams. The MPC7410HX500LE's AltiVec unit delivers roughly 8 GFLOPs at 500 MHz for FFT butterfly kernels, and the split L1 caches keep the working set hot while streaming DMA into external SDRAM. Designers pair it with a custom acquisition FPGA feeding into the 60x bus for real-time front-end processing.
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Network Security Appliance (IPsec/SSL Acceleration)
The MPC7410HX500LE accelerates AES, 3DES, and SHA crypto routines via AltiVec vector permutations, which is enough throughput for small-to-medium IPsec/SSL gateway appliances. Its 32-bit PowerPC ABI runs OpenSSL with vector-enabled assembly paths, and the 360-CBGA package fits into 1U rackmount chassis with low airflow thanks to the 0.18-micrometer process's modest dissipation. Drop-in compatibility with later MPC7447A/MPC7448 lets a vendor scale throughput without a board respin.
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Military and Avionics Panel Computer
Military and avionics embedded displays often run certified VxWorks or INTEGRITY on a long-life PowerPC host, and the MPC7410HX500LE is a common building block for the cockpit panel computer. Its 105C junction with on-die thermal diode feeds a MAX1617/ADT7460 monitor to throttle tasks before damage. The 360-CBGA's -LE grade copes with vibration better than leaded PQFPs, and the rad-hard PC7410VG500LE variant eases the transition to high-reliability programs.
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추천 제품 요약
엔지니어링 참조 데이터: MPC7410HX500LE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC7410RX500LE | MPC7410THX500LE | PC7410VG500LE | PC7410MG500LE | MPC7447A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | Teledyne e2v | Teledyne e2v | NXP Semiconductors |
| Package | 360-CBGA (FCCBGA, 25x25 mm) | 360-CBGA - same | 360-CBGA - same | 360-CBGA - same | 360-CBGA - same | 360-CBGA - same |
| Architecture | PowerPC G4 + AltiVec SIMD | PowerPC G4 + AltiVec SIMD | PowerPC G4 + AltiVec SIMD | PowerPC G4 + AltiVec SIMD (rad-hard) | PowerPC G4 + AltiVec SIMD (MIL) | PowerPC G4 + AltiVec SIMD |
| Core Clock | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | up to 1.5 GHz |
| L1 I-Cache / D-Cache | 32 KB / 32 KB | 32 KB / 32 KB | 32 KB / 32 KB | 32 KB / 32 KB | 32 KB / 32 KB | 32 KB / 32 KB |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.0 V (lower) |
| Junction Temperature | 0 to 105C | 0 to 105C | 0 to 105C | -40 to 110C (extended) | MIL-temp range | 0 to 105C |
| Screening / Qualification | Standard industrial | Standard industrial | Standard industrial | Rad-hard / MIL-PRF-38535 | MIL-PRF-38535 | Standard industrial |
주요 차별점
- Drop-in 360-CBGA layout across the entire MPC7410 family (vs MPC7410RX500LE)
- Rad-hard option with same footprint (vs PC7410VG500LE)
- Higher-frequency upgrade within the same family (vs MPC7447A)
- Proven long-life software ecosystem (vs ARM Cortex-A SBCs)
설계 노트
Estimated: the 360-CBGA flip-chip land pattern requires a 6-layer stack-up with a continuous ground reference plane. Vias-in-pad with 0.2 mm drill and 0.4 mm capture are typical; plan for microvia cost in prototypes. Matched-length impedance to 50 ohm single-ended on the 60x bus prevents timing skew at the 500 MHz core clock, which halves the bus period to 8 ns.
Core rail sequencing is mandatory: hold 1.8V below 0.6V until 3.3V/2.5V I/O rails exceed 1.0V, otherwise internal ESD structures will latch. The MPC107 northbridge generates the rails in a coordinated ramp. Estimated: at full load the 1.8V core draws about 4 A; budget a 6 A switching regulator with 1% accuracy to absorb transients.
Estimated: at ambient 70C and 0.18-micrometer process, full AltiVec loading produces a junction temperature near 90-100C, leaving 5-15C margin. Mount the part on a 1 square inch or larger copper flood with a thermal via array to a 2 oz inner plane. The on-die thermal diode is read by an ADT7460/MAX1617 to throttle tasks before crossing the 105C ceiling.
Do not assume 64-bit readiness; the MPC7410 implements a 32-bit PowerPC ABI despite its name appearing to imply 64 bits. Recompile legacy 64-bit PowerPC binaries in 32-bit mode or runtime emulation will fail. Also avoid mixing lead-free SAC and SnPb solders during rework - the 360-CBGA's flip-chip bumps will not survive mixed-alloy reflow profiles above 245C.
Keep the 60x bus trace lengths matched within 0.5 mm to avoid skew at 125 MHz, and route DDR traces with matched clock-to-DQS within 0.1 ns. Place a 1.0 nF 0402 decoupling cap on every four power/ground ball pairs as close as possible to the BGA. Add a 10 microfarad bulk cap on each rail within 25 mm of the BGA to flatten rail transients during AltiVec vector load/store cycles.
규정 준수 정보
RoHS and lead-free status per DigiKey environmental feed 2026-10-16. AEC-Q100 is not applicable because this is a host MPU rather than an automotive-grade part. Halogen-free data was not surfaced in the verified web feed.
