MPC8245LZU266D - 266MHz PowerPC 603e MPU, 352-TBGA | NXP
부품 번호: MPC8245LZU266D ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.35 | $78.35 |
| 10 | $72.4 | $724.00 |
| 100 | $64.85 | $6,485.00 |
| 500 | $58.1 | $29,050.00 |
| 1,000 | $52.4 | $52,400.00 |
MPC8245LZU266D 개요
The MPC8245 belongs to the broader category of integrated host processors (IHPs), sometimes termed a system-on-chip for the Power Architecture ecosystem. In the device taxonomy, it sits below general-purpose microprocessors (MPU) yet above basic microcontrollers (MCU) because it pairs a high-performance 603e core with on-chip memory and I/O controllers, eliminating external Northbridge/Southbridge silicon on many networking and storage designs. This integration position is why the part remains specified for routers, switches, NAS, image-display systems and similar cost-sensitive appliances.
Key differentiating features include 505.4 MIPS at 266 MHz, hardware SDRAM controller operation up to 133 MHz, integrated PCI bridge and DMA, and a 0-105 C commercial case-temperature range. It is built on a 0.25 um CMOS process and powered by a 3.3 V supply. The 352-TBGA package exposes the full 64-bit local bus plus multiplexed PCI and memory signals, allowing compact four-layer PCB layouts when conventional BGA escape rules are followed.
Typical target applications include entry-level routers, 10/100 Ethernet switches, network-attached storage controllers, RAID cards, industrial printer controllers and image-display controller boards. The 603e core runs legacy vxWorks, Linux 2.4/2.6 and PowerPC RTOS images, which keeps the part alive in long-lifecycle industrial designs even after newer e500/e600 devices appeared.
When designing with the 352-TBGA, allocate at least four PCB layers with continuous power and ground planes, follow Freescale Application Note AN2282 for high-speed BGA break-out, and keep all power rails decoupled within 50 mil of their assigned balls. Designers migrating from older BGA packages should re-validate the DDR/SDRAM timing window against the SDRAM controller section because the controller's tap settings differ from the MPC106/MPC107 generations.
드롭인 대체품: MPC8245LZU266D — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8245LZU266D (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Manufacturer, Memory Controller, Performance.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8245LVV266D
✅ 드롭인✓ 재고 있음
$48.9 / 개
데이터시트 보기 →MPC8245LZU266DM
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8245TZU266D
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8245LZU300D
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$71.9 / 개
데이터시트 보기 →MPC8245LZU266DT
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8245LVV300D
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$79.4 / 개
데이터시트 보기 →MPC8245LZU266D 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC82xx |
| Part Status | Active |
| Core Processor | PowerPC 603e |
| Number of Cores / Bus Width | 1 Core / 32-bit |
| Speed (Clock Frequency) | 266 MHz |
| Performance | 505.4 MIPS |
| Co-Processor / DSP | None |
| RAM Controllers | SDRAM |
| Graphics Acceleration | No |
| PCI Interface | 32-bit, 33/66 MHz |
| Memory Controller Max Frequency | 133 MHz (SDRAM), up to 2 GB |
| Serial I/O | I2C, UART, I2O |
| 공급 전압 | 3.3 V (typ.) |
| Process Technology | 0.25 um CMOS |
| 동작 온도 | 0 C to +105 C (commercial) |
| 패키지 | 352-TBGA (35 mm x 35 mm) |
| 실장 유형 | Surface Mount |
| Lead-Free Status | Lead-free (BGA balls, SnAgCu) |
MPC8245LZU266D 핀 구성
| 핀 B1 | VDD — Core supply 3.3V |
| 핀 C2 | GND — Ground reference |
| 핀 A10 | MD0 — Memory data bus bit 0 (64-bit memory interface) |
| 핀 AC15 | PCI_AD31 — PCI address/data bit 31 (multiplexed) |
| 핀 AE18 | PCI_FRAME — PCI cycle frame |
| 핀 K5 | MA0 — Memory address bit 0 |
| 핀 T10 | MAA0 — Memory address/control auxiliary signal |
| 핀 W18 | GPIO0 — General-purpose I/O 0 |
| 핀 AD20 | UART1_TXD — UART1 transmit data |
| 핀 AE22 | I2C_SDA — I2C serial data |
| 핀 AB25 | ETH_TXD0 — MII Ethernet transmit data 0 |
| 핀 Y27 | ETH_TX_CLK — MII Ethernet transmit clock |
| 핀 AC31 | IRQ0 — External interrupt request 0 |
| 핀 AD33 | RST_HRESET — Hard reset, active-low |
| 핀 AE35 | TCK — JTAG test clock |
| 핀 AB1 | VDD_IO — I/O supply 3.3V |
일반적인 애플리케이션
MPC8245LZU266D 적합 용도: 6 애플리케이션s: Entry-Level Routers and SOHO Gateways, Network-Attached Storage (NAS) Controllers, 10/100 Ethernet Switch Control Boards, Industrial Printer and Imaging Controllers, RAID / Storage Controller Cards, Embedded Linux Industrial Control Boards.
Entry-Level Routers and SOHO Gateways
The MPC8245LZU266D's 266 MHz PowerPC 603e core delivers 505.4 MIPS while the on-chip PCI bridge and 64-bit memory bus provide the throughput needed for a 10/100 router running Linux or VxWorks. The integrated SDRAM controller and MII Ethernet interface remove the need for an external northbridge, letting the design shrink to a four-layer PCB. Compared with discrete MPC860 + PCI-PCI bridge designs, the 8245 cuts roughly 30 percent of the BOM and halves standby power.
추천
Network-Attached Storage (NAS) Controllers
NAS enclosures for the SOHO segment rely on the MPC8245LZU266D for protocol offload, SMB/NFS acceleration and disk-RAID coordination. The 32-bit PCI bridge attaches to SATA or IDE RAID controllers while the 64-bit SDRAM channel supports up to 2 GB of cache, sufficient for 4-drive RAID-5 workloads. The 0 to 105 C thermal envelope lets the part sit in fanless metal enclosures without active cooling.
추천
10/100 Ethernet Switch Control Boards
Stackable 10/100 Ethernet switches use the MPC8245LZU266D as the management-plane CPU, running SNMP, RMON and L2 switching firmware. Its PCI interface attaches to switch fabrics such as the BCM5338 family, while the UART and I2C controllers connect to SFP/QSFP modules and management PHYs. The integrated 603e core keeps latency predictable for time-sensitive management tasks, and the commercial temperature grade suits climate-controlled wiring closets.
추천
Industrial Printer and Imaging Controllers
Multi-function printers and image-display controllers adopt the MPC8245LZU266D for its 505.4 MIPS of processing at 266 MHz and its 64-bit memory bus for high-bandwidth rasterization. The PCI bridge links to scanner engines and external image processors, while the SDRAM controller holds large page buffers without external FIFOs. The 352-TBGA footprint fits the compact form factors required for printer controller boards.
추천
RAID / Storage Controller Cards
The MPC8245LZU266D powers mid-range RAID controllers where the 603e core runs the firmware supervisor, offloading data-path work to dedicated XOR engines. The 32-bit PCI bus talks to host systems while the SDRAM controller supplies 256 MB to 2 GB of write-cache memory with ECC. Engineers frequently swap 8245-300/333 variants in for higher RAID6 reconstruction throughput without changing the card layout because the 352-TBGA pinout is preserved.
추천
Embedded Linux Industrial Control Boards
Long-lifecycle industrial controllers use the MPC8245LZU266D with a Linux 2.6 BSP for deterministic EtherCAT, Profibus or Modbus master bridges. The 266 MHz 603e core and 32-bit PCI bus run the industrial protocol stacks, while the I2C and UART peripherals drive sensor and actuator networks. The 352-TBGA's commercial thermal envelope lets the part ride in IP65 sealed enclosures inside factory cells.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8245LZU266D — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8245LVV266D | MPC8245TZU266D | MPC8245LZU300D | MPC8245LVV300D |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 352-TBGA (35x35) | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same |
| Core Frequency | 266 MHz | 266 MHz | 266 MHz | 300 MHz | 300 MHz |
| Core Architecture | PowerPC 603e (32-bit) | PowerPC 603e (32-bit) | PowerPC 603e (32-bit) | PowerPC 603e (32-bit) | PowerPC 603e (32-bit) |
| RAM Controller | SDRAM up to 2 GB | SDRAM up to 2 GB | SDRAM up to 2 GB | SDRAM up to 2 GB | SDRAM up to 2 GB |
| PCI Interface | 32-bit, 33/66 MHz | 32-bit, 33/66 MHz | 32-bit, 33/66 MHz | 32-bit, 33/66 MHz | 32-bit, 33/66 MHz |
| Ball Alloy / Lead-Free | SnPb (LU) | SnAgCu (VV, lead-free) | SnPb (TU), different temp grade | SnPb (LU), 300MHz | SnAgCu (VV), lead-free 300MHz |
주요 차별점
- Faster core within the same 352-TBGA package (vs MPC8245LZU300D)
- Lead-free ball alloy while preserving identical electrical spec (vs MPC8245LVV266D)
- Long-term continuous manufacturing support (vs MPC8245TZU266D)
- Higher memory controller ceiling within the same IHP family (vs MPC8245LZU300D)
설계 노트
Estimated: a four-layer stack-up with a continuous ground plane on layer 2 and a power plane on layer 5 is the minimum geometry needed to escape a 352-TBGA at 1.0 mm to 1.27 mm pitch. Assign SDRAM byte lanes to dedicated layer-3 traces to minimize crosstalk and keep matched lengths within +/-150 mil across the 64-bit bus. A six-layer stack improves signal integrity if the design runs the SDRAM controller at the upper 133 MHz boundary.
Sequence the core 3.3V supply and the PLL analog supply within the timing window defined in the MPC8245 hardware specification; the PLL analog rail must reach regulation before the core rail exits reset or the device may lock at an incorrect frequency. Use bulk tantalum capacitors of at least 220 uF near each VRM together with 0.1 uF ceramic decouplers within 50 mil of each power pin. The MPC8245 has separate VDD and VDD_IO rails that should be tied to the same 3.3V source through ferrite beads for noise isolation.
Estimated: at 266 MHz and worst-case internal activity, the MPC8245LZU266D dissipates approximately 2.5 W to 3.2 W in a typical router workload, and the TBGA thermal resistance allows the part to remain within its 0-105 C case-temperature rating without a heatsink. Forced-air cooling is recommended for fanless industrial enclosures mounted in sealed panels because the case temperature can rise above ambient by 35-45 C. Measure junction temperature through the on-chip thermal diode if the design budget is tight.
Do not assume that any 266 MHz MPC8245 variant is interchangeable: the 'L' vs 'V' suffix changes the ball alloy (SnPb vs SnAgCu) and reflow profile, while the 'T' vs 'U' suffix indicates a different temperature grade. Always match the exact suffix to the firmware's PLL configuration register, otherwise the part may fail to come out of reset or may boot at a clock divider that does not match the link-rate tables. Confirm the part-marking date code matches the revision letter listed in the latest NXP errata before mass-production checkout.
Run an IBIS-based simulation of the 64-bit SDRAM bus before tap-out; the memory controller's tap-delay settings are tuned for the specific DIMM trace lengths, so simulations should use the actual SDRAM part's IBIS model rather than a generic lumped load. For the 66 MHz PCI bus, keep the clock-to-AD setup at the AC-timing minimum and avoid sharing reference planes with the SDRAM byte lanes. If the design auto-negotiates to 66 MHz PCI, validate with the worst-case DIMM simultaneously active.
규정 준수 정보
The LZU suffix indicates a SnPb ball finish; an explicit RoHS declaration must be retrieved per lot from the NXP distributor because Freescale/NXP historically shipped both leaded and lead-free variants under this part family. AEC-Q100 is not applicable since the MPC8245 is an industrial/networking processor, not an automotive-qualified MPU.
