MPC8247CZQTIEA - PowerQUICC II 400MHz MPU, 516-PBGA | NXP
부품 번호: MPC8247CZQTIEA ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.65 | $346.50 |
| 100 | $31.2 | $3,120.00 |
| 250 | $29.5 | $7,375.00 |
| 500 | $27.85 | $13,925.00 |
MPC8247CZQTIEA 개요
A microprocessor (MPU) is an integrated circuit containing a complete central processing unit on a single die, executing fetched instructions at high clock rates and coordinating system resources. In the broader taxonomy, the MPC8247 sits under 32-bit embedded microprocessors -> microprocessors -> integrated circuits -> semiconductors. PowerQUICC II is a NXP product family aimed at communications equipment where deterministic I/O, PCI bus master/slave capability, and integrated peripherals reduce BOM and board area versus a discrete CPU + bridge chip approach.
Key features include a 32-bit Power Architecture core at 400 MHz, integrated CPM with dual Fast Ethernet MACs via MII/RMII, 32-bit PCI 2.2 bus interface, USB 1.1 host/function, integrated SDRAM controller supporting PC-133, 4 DMA channels, and an extended temperature grade of -40C to +105C for industrial and outdoor deployments. The 27x27 mm TEPBGA package exposes all address, data, and peripheral signals for full-system designs.
Architecturally the MPC8247 pairs the G2_LE core with the CPM, which runs microcode engines for Ethernet, HDLC, UART, and other serial protocols, offloading the core and improving aggregate throughput. On-chip dual 10/100 Ethernet MACs eliminate external PHY controller logic and reduce PCB complexity in switches, routers, and access devices.
Typical applications include SOHO/SMB routers and switches, integrated access devices, DSL/ADSL/Cable modems with host interface, industrial gateway controllers, printers with networking, and embedded control planes that need PCI expansion and deterministic I/O handling.
When designing with the MPC8247, ensure the host PCB provides the full 27x27 mm BGA footprint, 4-layer minimum stack-up for controlled impedance on the 32-bit PCI bus, and matched-length SDRAM routing to meet PC-133 timing. Per the NXP product page, this part is now listed under End of Life, so designers should evaluate the QorIQ or Layerscape families for new platforms.
드롭인 대체품: MPC8247CZQTIEA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8247CZQTIEA (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, Operating Temperature, PCI Interface, Ethernet.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8247VRMIBA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8247CVRTIEA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8247VRTIEA
✅ 드롭인✓ 재고 있음
$58.25 / 개
데이터시트 보기 →MPC8247ZQTIEA
✅ 드롭인✓ 재고 있음
$58.9 / 개
데이터시트 보기 →MPC8247CZQTLEA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8247CZQTIEA 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II |
| Core Processor | PowerPC G2_LE |
| Core Architecture | 32-bit Power Architecture |
| Core Count | 1 |
| Core Speed | 400 MHz |
| 패키지 | 516-PBGA (TEPBGA) 27x27 mm |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +105C (Industrial) |
| 공급 전압 | 3.3 V core/IO |
| Process Technology | 0.13 um CMOS |
| Integrated Peripherals | CPM, PCI 2.2, USB 1.1, 2x 10/100 Ethernet MAC |
| SDRAM Controller | PC-133 SDRAM, 32-bit data |
| DMA Channels | 4 |
| Ethernet | Dual 10/100 MII/RMII MAC |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| Lifecycle | End of Life (per NXP product page) |
MPC8247CZQTIEA 516-pbga (tepbga) 27x27 mm 핀 구성 가이드
MPC8247CZQTIEA(516-pbga (tepbga) 27x27 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8247CZQTIEA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8247CZQTIEA 적합 용도: 6 애플리케이션s: SOHO/SMB Router, Integrated Access Device (IAD), Industrial Gateway Controller, Network Printer with Embedded Server, DSL/Cable Modem with Host Interface, Embedded Control Plane with PCI Expansion.
SOHO/SMB Router
The MPC8247CZQTIEA's 400 MHz PowerPC G2_LE core, integrated dual 10/100 Ethernet MACs, and CPM offload engine make it a strong fit for SOHO/SMB router platforms. The CPM microcode engines accelerate NAT, IPsec, and QoS classification while the host core runs the routing stack - delivering wire-speed 100 Mbps forwarding at low CPU load. The -40 to +105C industrial temperature range allows deployment in non-climate-controlled customer premises equipment. PCI 2.2 expansion supports an external crypto accelerator or DSL/cable modem front-end. The 516-PBGA package keeps the design footprint manageable for compact desktop enclosures.
추천
Integrated Access Device (IAD)
Integrated Access Devices combine DSL/cable modem, VoIP, and Ethernet switch functions in one box, and the MPC8247CZQTIEA serves well as the central processor in such designs. Its dual Ethernet MACs aggregate LAN ports, while the PCI bus hosts the xDSL/cable modem chipset and DSP resources. The CPM handles HDLC framing, TDM voice bus multiplexing, and ATM AAL2 segmentation directly in hardware, freeing the host core for control-plane and VoIP signaling tasks. Power dissipation fits comfortably within fanless IAD enclosures, and the 27x27 mm BGA is compatible with mainstream 4-layer PCB processes.
추천
Industrial Gateway Controller
Industrial gateways bridge Modbus/Profi/Ethernet protocols and require deterministic real-time I/O. The MPC8247CZQTIEA's CPM offload, PCI 2.2 bus for fieldbus cards, and -40 to +105C operating range allow direct deployment on factory floors and outdoor installations. The 400 MHz G2_LE core handles TLS/DTLS security for OPC UA and MQTT while the CPM accelerates serial protocol framing. With 32-bit PC-133 memory bandwidth and 4 DMA channels the design can sustain full-duplex data acquisition without dropping samples. BGA package supports conformal-coated industrial assembly.
추천
Network Printer with Embedded Server
Networked multifunction printers need a controller that handles print rendering, scanner data acquisition, and Ethernet/wireless connectivity simultaneously. The MPC8247CZQTIEA fits this role: the PowerPC G2_LE core renders PCL/PostScript streams, the CPM handles network protocol framing, and PCI 2.2 expansion hosts the scanner ASIC or Wi-Fi card. The 516-PBGA 27x27 mm footprint fits standard printer controller card dimensions. Low power consumption supports energy-star compliance in office printers. USB 1.1 host port enables direct-print from USB storage without an external hub chip.
추천
DSL/Cable Modem with Host Interface
External DSL and cable modems that expose a USB or Ethernet host interface to a PC can use the MPC8247CZQTIEA as their main processor. Its PCI 2.2 bus connects directly to xDSL/cable modem front-end ICs from NXP's complementary portfolio, while the USB 1.1 host/function port and Ethernet MACs serve the upstream PC interface. The CPM accelerates ATM AAL5 segmentation for DSL or DOCSIS framing for cable, offloading the host core. Industrial -40 to +105C rating ensures reliable operation in customer premises that may not be climate controlled.
추천
Embedded Control Plane with PCI Expansion
Embedded systems requiring deterministic real-time response plus PCI-based expansion (data acquisition, motion control, telecom control plane) are a natural fit for the MPC8247CZQTIEA. The PowerPC G2_LE core runs a real-time OS such as VxWorks or Linux RT while the CPM handles time-critical serial and packet I/O. PCI 2.2 32-bit bus supports standard off-the-shelf cards for analog/digital I/O, GPS timing, or telecom framer interfacing. The 516-BGA package exposes enough I/O for full system designs and supports -40 to +105C operation in telecom roadside cabinets.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8247CZQTIEA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8247VRMIBA | MPC8247CVRTIEA | MPC8247VRTIEA | MPC8247ZQTIEA | MPC8247CZQTLEA |
|---|---|---|---|---|---|---|
| Package | 516-PBGA (27x27 mm) | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 400 MHz | 266 MHz | 250 MHz | 266 MHz | 400 MHz | 400 MHz |
| Operating Temperature | -40 to +105C | -40 to +105C | -40 to +105C | -40 to +105C | -40 to +105C | 0 to +105C |
| Core | PowerPC G2_LE 32-bit | PowerPC G2_LE 32-bit | PowerPC G2_LE 32-bit | PowerPC G2_LE 32-bit | PowerPC G2_LE 32-bit | PowerPC G2_LE 32-bit |
| Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 |
| PCI Bus | PCI 2.2 32-bit | PCI 2.2 32-bit | PCI 2.2 32-bit | PCI 2.2 32-bit | PCI 2.2 32-bit | PCI 2.2 32-bit |
| Process Technology | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life | End of Life | End of Life |
주요 차별점
- Higher CPU clock speed at the same footprint (vs MPC8247VRMIBA)
- Industrial temperature range -40 to +105C (vs MPC8247CZQTLEA)
- Active end-of-life with PDN on file (vs QorIQ P1010)
설계 노트
Estimated: the 516-PBGA 27x27 mm package has a 1.27 mm ball pitch typical of NXP PowerQUICC II packages, requiring a 4-layer minimum PCB stack-up with continuous reference planes under the BGA fan-out. Use microvia-in-pad or dog-bone fan-out with 0.1mm trace/space to break out the inner rows. Provide a 6 mm keep-out zone around the BGA for via-in-pad microvias. Match PCI bus traces to 50 ohm +/-10% controlled impedance, and SDRAM traces to 50 ohm +/-10% with length matching within 25 ps. Reference the NXP AN2814 application note on PowerQUICC II PCB layout for the full layout checklist.
Estimated: at 400 MHz core clock, 3.3 V I/O supply, and 1.8 V core supply the MPC8247CZQTIEA dissipates approximately 1.5-2.0 W typical, which is within the 516-PBGA thermal envelope of theta_JA ~20 C/W on a 4-layer JEDEC JESD51 test board. At maximum -40 to +105C industrial ambient, ensure the application note's recommended thermal via array under the BGA thermal pad is implemented. The exposed die paddle on the package bottom should be soldered to the PCB thermal land with a 5x5 thermal via array to a continuous internal ground plane.
Refer to the NXP MPC8247 hardware specifications manual and reference manual at https://www.nxp.com/docs/en/data-sheet/MPC8247.pdf for reset configuration word (RCW) details - an incorrect RCW causes the part to lock up with no visible debug output. Many designers forget to terminate the JTAG TCK pin with a pull-down; floating TCK can cause boundary-scan false triggers during power ramp. The USB 1.1 D+ line requires the 15 kohm pull-up to indicate full-speed device - omitting it is the most frequent USB enumeration failure in production.
규정 준수 정보
RoHS and REACH compliant per NXP product page; lead-free terminations supported; AEC-Q100 not applicable (this is an MPU, not an automotive-qualified part).
