MPC8270ZUQLDA - PowerQUICC II 333MHz MPU | NXP | Comm Processor
부품 번호: MPC8270ZUQLDA ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $175.5 | $1,755.00 |
| 100 | $162 | $16,200.00 |
| 250 | $152 | $38,000.00 |
| 500 | $145 | $72,500.00 |
MPC8270ZUQLDA 개요
A PowerQUICC communications processor is a specialized system-on-chip that integrates a general-purpose CPU core with dedicated peripheral and protocol-processing engines. The MPC82xx family typically embeds a CPM (Communications Processor Module) for HDLC, Ethernet, USB, and PCI bridging, offloading these tasks from the host CPU. In the hierarchy: PowerQUICC -> communications processor -> embedded MPU -> microprocessor -> semiconductor IC.
Key features include a 333 MHz core, 32-bit data path, integrated PCI, USB, HDLC, and Ethernet interfaces, and a 0 to 105C commercial operating temperature range. The device uses NXP's HiPerMOS7 0.13-micron process technology, achieving the PowerQUICC II family's blend of throughput and low power for routing, switching, and access equipment.
The 480-TBGA package provides dense I/O for simultaneous memory and high-speed serial interfaces. The integrated CPM can handle multiple Fast Ethernet MACs, ATM, HDLC channels, and PCI bridges in parallel, freeing the G2_LE core for control-plane tasks, routing tables, or application code.
Typical applications include wired and wireless infrastructure such as DSLAM line cards, wireless base stations, multi-service access multiplexers, routers, and industrial control platforms that require deterministic communication protocol handling alongside embedded Linux or VxWorks application code.
Designers should validate thermal design assumptions given the 37.5x37.5 mm BGA footprint, ensure multi-layer PCB stack-up for high-speed signal integrity, and confirm that DDR/SDRAM memory interfaces are length-matched per the NXP reference design. This part is now in NXP's End-of-Life flow - see NXP product page for PCN and replacement guidance.
This page synthesizes distributor pricing, drop-in alternatives within the PowerQUICC II family, and practical design notes not found in the standalone datasheet.
드롭인 대체품: MPC8270ZUQLDA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8275ZUQLDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8280ZUQLDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8270ZUQLDDA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8270CVVUPEA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8270ZUUPEA
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8280CVVUPEA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8270ZUQLDA 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II, MPC82xx |
| Core Architecture | PowerPC G2_LE |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 333 MHz |
| 패키지 | 480-TBGA (37.5x37.5 mm) |
| 동작 온도 | 0C to +105C (commercial) |
| Process Technology | HiPerMOS7, 0.13 micron |
| Integrated Communications Module | CPM (PCI, USB, HDLC, Ethernet) |
| Interface Support | PCI, USB, HDLC, Ethernet |
| 실장 유형 | Surface Mount (BGA) |
| 수명 주기 상태 | End of Life / Last Time Buy (per NXP PCN) |
| Memory Type (external) | DDR/SDRAM via local bus |
MPC8270ZUQLDA 480-tbga (37.5x37.5 mm) 핀 구성 가이드
MPC8270ZUQLDA(480-tbga (37.5x37.5 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8270ZUQLDA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8270ZUQLDA 적합 용도: 6 애플리케이션s: DSLAM Line Card Controller, Wireless Base Station Controller, Multi-Service Access Multiplexer, Industrial Router and Protocol Gateway, VoIP Media Gateway, Embedded Control Platform with Linux.
DSLAM Line Card Controller
The MPC8270ZUQLDA's integrated CPM with HDLC and Ethernet termination makes it well suited to DSLAM line cards in central-office equipment. The 333 MHz G2_LE core runs control-plane routing and management code while the CPM handles ATM/HDLC channel aggregation across multiple line-card ports. Its 32-bit data path and external DDR support allow line-rate processing for hundreds of subscriber channels per card. Compared with discrete CPU+ASIC designs, the integrated CPM cuts BOM cost and PCB area, and the 480-TBGA footprint provides enough I/O for memory bus, PCI uplink, and multiple serial PHYs. Engineers should validate DDR timing margins and CPM serial channel allocation against the NXP reference design.
추천
Wireless Base Station Controller
In wireless base station controllers, the MPC8270ZUQLDA acts as a control-plane processor handling Layer 2/3 signalling, baseband-to-network bridging, and O&M interfaces. Its PCI interface connects to baseband modem cards while the integrated Ethernet MACs aggregate backhaul traffic. The 333 MHz core combined with the CPM's HDLC offload keeps deterministic latency for TDM/ATM backhaul to legacy mobile networks. The 480-TBGA package supports the wide memory and I/O bus required for simultaneous PCI, Ethernet, and serial operation. Designs targeting 3G/4G small cells often pair this MPU with a dedicated baseband DSP and front-end RF transceiver; for new designs, NXP recommends migrating to a current QorIQ successor.
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Multi-Service Access Multiplexer
Multi-service access multiplexers (MSAN/DSLAM aggregation nodes) require deterministic termination of TDM (T1/E1), Ethernet, and often legacy serial protocols on a single platform. The MPC8270ZUQLDA integrates HDLC, Ethernet, and serial controllers inside the CPM, eliminating external protocol-handling ASICs and reducing BOM cost. The G2_LE core runs the aggregation/routing stack under Linux or VxWorks, while the CPM handles per-channel framing without CPU intervention. Designers can scale ports by adding external TDM PHYs or Ethernet switches via PCI. The part's 0-105C commercial temperature range suits environmentally controlled central-office deployments, and the 480-TBGA package provides the I/O density needed for multi-phy interfacing.
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Industrial Router and Protocol Gateway
Industrial routers and protocol gateways translating between Ethernet, serial fieldbuses, and cellular backhaul benefit from the MPC8270ZUQLDA's combination of Ethernet, HDLC, USB, and PCI. The G2_LE core runs the routing stack and VPN/encryption, while the CPM terminates multiple serial protocols simultaneously for SCADA or substation automation. Its 480-TBGA package is suitable for industrial SBC form factors, and the commercial temperature range fits enclosed control cabinets. Power consumption is moderate thanks to the 0.13-micron HiPerMOS7 process. Engineers should plan for industrial-grade long-term supply, as this part is on NXP Last Time Buy - new designs should evaluate QorIQ LS series as the migration path.
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VoIP Media Gateway
VoIP media gateways require simultaneous packet processing for RTP/UDP voice streams and TDM termination to PSTN. The MPC8270ZUQLDA's CPM handles HDLC/TDM and Ethernet packetization in parallel, freeing the G2_LE core for signalling stacks (SIP, H.248) and DSP coordination. The 32-bit 333 MHz core, combined with external DDR, can sustain hundreds of voice channels per device. The integrated PCI bus allows direct connection to DSP daughter cards for codec acceleration. The 480-TBGA footprint suits ATCA/AMC carrier cards. Engineers should budget memory bandwidth for the G2_LE's instruction fetches plus DMA from the CPM; the NXP reference design provides validated DDR topologies for this scenario.
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Embedded Control Platform with Linux
Engineers building custom embedded Linux platforms for networking or industrial control find the MPC8270ZUQLDA well documented with U-Boot, LTIB, and mainline Linux BSPs. The G2_LE core runs the Linux kernel plus userspace networking daemons, while the CPM offloads HDLC and Ethernet. External NOR Flash holds U-Boot; external DDR runs the kernel and applications. The 480-TBGA package suits 6-8 layer PCBs typical of SBC designs. The commercial 0-105C temperature range is appropriate for indoor enclosure deployments, and JTAG debug ports on the BGA enable standard PowerPC toolchains (BDI2000/3000, CodeWarrior). New designs should weigh the part's Last Time Buy status against longevity requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8270ZUQLDA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8275ZUQLDA | MPC8280ZUQLDA | MPC8270ZUQLDDA | MPC8270CVVUPEA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5x37.5 mm) | 480-TBGA (37.5x37.5 mm) - same | 480-TBGA (37.5x37.5 mm) - same | 480-TBGA (37.5x37.5 mm) - same | 480-TBGA (37.5x37.5 mm) - same |
| Core Architecture | PowerPC G2_LE, 32-bit | PowerPC G2_LE, 32-bit - same | PowerPC G2_LE, 32-bit - same | PowerPC G2_LE, 32-bit - same | PowerPC G2_LE, 32-bit - same |
| Process Technology | HiPerMOS7, 0.13 micron | HiPerMOS7, 0.13 micron - same | HiPerMOS7, 0.13 micron - same | HiPerMOS7, 0.13 micron - same | HiPerMOS7, 0.13 micron - same |
| Integrated Communications Module | CPM (PCI, USB, HDLC, Ethernet) | Enhanced CPM | Expanded CPM channels | Same CPM (same die) | Same CPM family |
| Operating Temperature | 0C to +105C (commercial) | 0C to +105C (commercial) | 0C to +105C (commercial) | 0C to +105C (commercial) | 0C to +105C (commercial) |
| Lifecycle Status | End of Life / Last Time Buy | End of Life / Last Time Buy | End of Life / Last Time Buy | End of Life / Last Time Buy | End of Life / Last Time Buy |
| Pin-to-Pin Compatible | Reference | Yes - same 480-TBGA footprint | Yes - same 480-TBGA footprint | Yes - same die | Yes - same 480-TBGA footprint |
주요 차별점
- Pin-compatible drop-in family (vs MPC8275ZUQLDA / MPC8280ZUQLDA)
- Integrated CPM offloads protocol processing (vs Discrete CPU + external HDLC/Ethernet ASICs)
- Mature Linux and VxWorks BSP support (vs Newer QorIQ platforms requiring migration effort)
설계 노트
The 480-TBGA package at 37.5x37.5 mm has moderate thermal resistance; for 333 MHz operation with high CPM utilization, design a 6+ layer PCB with a thermal via array under the package center and adequate copper pour on top/bottom layers. Confirm junction temperature against the NXP thermal model for your specific airflow and ambient conditions before locking the mechanical design.
Use a 6-8 layer PCB stack-up to route the external DDR/SDRAM memory bus, PCI, and multiple serial interfaces without excessive via stubs. Match trace lengths within 25 mil for DDR signals and follow the NXP reference design exactly for the local bus. BGA breakout requires microvia or via-in-pad technology for inner rows - confirm with your PCB fabricator's capabilities before commit.
Do not confuse the ZUQ ball-alloy variant with later RoHS-compliant versions - verify the specific date code and lot marking against NXP's material declaration if your end product requires RoHS. The MPC8270ZUQLDA is on NXP Last Time Buy: do not commit to long-life programs without an approved replacement, and order safety stock now if your production horizon extends beyond the announced LTB date.
Provide a clean, low-noise core and I/O supply per the NXP reference design. The G2_LE core and CPM have separate supply rails with specific sequencing requirements (core before I/O). Use a multi-rail PMIC or discrete LDOs with proper power-on-reset timing. Decoupling: place 0.1uF X7R ceramics as close as possible to each BGA supply pin and bulk 10-47uF tantalum or polymer caps near the supply inputs.
Validate the PCI, USB, and Ethernet MII/RMII interfaces against the datasheet AC specifications with signal-integrity simulation before tape-out. The DDR memory interface is particularly sensitive to ISI and clock jitter - run IBIS-AMI simulations and consider series-termination resistor placement per NXP guidelines for the target memory topology.
규정 준수 정보
The ZUQ suffix historically indicates Pb-bearing ball alloy for non-RoHS applications. Specific date code and lot must be verified against NXP material declaration for RoHS compliance. AEC-Q100 is not applicable - this is a communications processor, not an automotive-grade IC. Conflict-minerals compliance per NXP standard declaration.
